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    • 2. 发明申请
    • SYSTEM AND METHOD TO CUSTOMIZE BOND PROGRAMS COMPENSATING INTEGRATED CIRCUIT BONDER VARIABILITY
    • 系统和方法来自定义绑定程序来加强集成电路粘结剂的可变性
    • US20060217817A1
    • 2006-09-28
    • US11423880
    • 2006-06-13
    • David BonSreenivasan Koduri
    • David BonSreenivasan Koduri
    • G05B19/18
    • G05B19/4083G05B2219/36046G05B2219/36048G05B2219/45033
    • A computerized system and method for customizing bond programs in order to compensate first for variabilities in an integrated circuit (IC) “slave” bonder, and second to any irregularities in a “slave” circuit positioned on the slave bonder for attaching connecting bonds onto the IC bond pads. According to the invention, a “master” segmentator groups the bond pads of a “master” circuit on a master bonder into segments and stores the reference data related to these segments in a master file. Next, a slave regenerator, coupled to the master file, regenerates the master reference data so that variable characteristics of the slave bonder are defined and adaptively compensated. Finally, a slave corrector, coupled to the salve regenerator, corrects the bond program for the slave circuit on the adaptively compensated slave bonder. The slave bonder attaches the connecting bonds based on the computed correct bond locations.
    • 一种用于定制键合程序的计算机化系统和方法,以便首先补偿集成电路(IC)“从”)接合器中的变量,并且其次是位于从属接合器上的“从”电路中的任何不规则性,用于将连接键附接到 IC焊盘。 根据本发明,“主”分隔器将主接头上的“主”电路的接合焊盘分组成段,并将与这些段相关的参考数据存储在主文件中。 接下来,耦合到主文件的从再生器重新生成主参考数据,从而定义从属接合器的可变特性并进行自适应补偿。 最后,耦合到硬盘再生器的从属校正器在自适应补偿的从属接合器上校正从电路的接合程序。 奴隶连接器根据计算的正确的债券位置附加连接债券。
    • 6. 发明授权
    • Apparatus, system and method for forming custom-made shoe inserts
    • 用于成型定制鞋垫的装置,系统和方法
    • US5640779A
    • 1997-06-24
    • US450617
    • 1995-05-25
    • Paul D. RolloffReginald T. Lamb
    • Paul D. RolloffReginald T. Lamb
    • A43B7/28A43D1/02A43D39/00A61B5/107G05B19/42G01B7/28A41H1/02A61B5/103
    • A43D1/022A43B7/28A43D1/02A43D39/00G05B19/4207A61B5/1078G05B2219/36048G05B2219/37043G05B2219/37054G05B2219/37057G05B2219/45243G05B2219/49025
    • A foot impression unit is provided with an array of gauging elements, a control mechanism for urging the gauging elements into contact with the undersurface of a person's foot to form an impression of the undersurface of the foot, a locking mechanism for releasably locking the gauging elements in place to retain that impression, and a sensing mechanism for scanning the gauging elements to produce digital signals indicative of the positions of the gauging elements. These digital signals are stored and processed by a computer to provide a stored data record serving as a digital representation of the impression of the undersurface of the foot. The computer may also be employed to provide stored additional information for modifying that data record to compensate for a perceived defect of the foot. In response to the stored data record and any stored additional information for modifying that data record, a shaping unit shapes an insert blank to form a custom-made shoe insert conforming to the undersurface of the foot and compensating for any perceived defect of the foot.
    • 足部印模单元设置有一组测量元件,一个控制机构,用于推动测量元件与人的脚的下表面接触以形成脚的下表面的印模;锁定机构,用于可释放地锁定测量元件 以保持该印象,以及用于扫描测量元件以产生指示测量元件的位置的数字信号的感测机构。 这些数字信号由计算机存储和处理,以提供用作足部底面的印象的数字表示的存储的数据记录。 还可以使用计算机来提供存储的附加信息,以便修改该数据记录以补偿感觉到的脚缺陷。 响应于存储的数据记录和用于修改该数据记录的任何存储的附加信息,成形单元形成插入坯料,以形成符合脚的下表面的定制的鞋插入件,并补偿脚的任何感觉到的缺陷。
    • 8. 发明授权
    • System and method to customize bond programs compensating integrated circuit bonder variability
    • 定制接合程序的系统和方法补偿集成电路焊接机变异性
    • US07069102B2
    • 2006-06-27
    • US09855893
    • 2001-05-15
    • David J. BonSreenivasan K. Koduri
    • David J. BonSreenivasan K. Koduri
    • G06F19/00
    • G05B19/4083G05B2219/36046G05B2219/36048G05B2219/45033
    • A computerized system and method for customizing bond programs in order to compensate first for variabilities in an integrated circuit (IC) “slave” bonder, and second to any irregularities in a “slave” circuit positioned on the slave bonder for attaching connecting bonds onto the IC bond pads. According to the invention, a “master” segmentator groups the bond pads of a “master” circuit on a master bonder into segments and stores the reference data related to these segments in a master file. Next, a slave regenerator, coupled to the master file, regenerates the master reference data so that variable characteristics of the slave bonder are defined and adaptively compensated. Finally, a slave corrector, coupled to the salve regenerator, corrects the bond program for the slave circuit on the adaptively compensated slave bonder. The slave bonder attaches the connecting bonds based on the computed correct bond locations.
    • 一种用于定制键合程序的计算机化系统和方法,以便首先补偿集成电路(IC)“从”)接合器中的变量,并且其次是位于从属接合器上的“从”电路中的任何不规则性,用于将连接键附接到 IC贴片。 根据本发明,“主”分隔器将主接头上的“主”电路的接合焊盘分组成段,并将与这些段相关的参考数据存储在主文件中。 接下来,耦合到主文件的从再生器重新生成主参考数据,从而定义从属接合器的可变特性并进行自适应补偿。 最后,耦合到硬盘再生器的从属校正器在自适应补偿的从属接合器上校正从电路的接合程序。 奴隶连接器根据计算的正确的债券位置附加连接债券。