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    • 6. 发明授权
    • Slot transfer molding apparatus and methods
    • 槽传送成型设备和方法
    • US4460537A
    • 1984-07-17
    • US401575
    • 1982-07-26
    • Preston J. Heinle
    • Preston J. Heinle
    • B29C43/00B29C45/00B29C45/02B29C45/14B29C45/26H01L21/56H05K13/00B29F1/10
    • H01L24/97B29C45/02B29C45/14655H01L21/565B29C2045/024H01L2224/48247H01L2924/181
    • An improved means and method is provided for encapsulating electronic devices and other objects by transfer molding. The mold cavities are arranged in rows, disposed adjacent to and parallel with slot-shaped encapsulant reservoirs, and coupled to the reservoirs by short feeder channels of uniform length. Preferably, a row of cavities is located in a mirror symmetric fashion on either side of and parallel with each slot-shaped reservoir. A tightly fitting blade moves in each slot-shaped reservoir to compress and liquify the plastic encapsulant charge, injecting it into the mold cavities containing the component to be encapsulated. Plastic utilization can exceed 90%, and better control over molding conditions can be obtained because the plastic material reaches each mold cavity at the same stage of the liquification-solidification cycle. More cavities can be fitted in a given mold area because the usual central material pot and runner-tree are eliminated.
    • 提供改进的装置和方法,用于通过传递模塑来封装电子装置和其它物体。 模具腔排列成与狭缝状密封剂储存器相邻并平行设置,并且通过具有均匀长度的短进料通道联接到储存器。 优选地,一排空腔以每个槽形储存器的任一侧并且平行于镜对称的方式定位。 紧密配合的叶片在每个槽形容器中移动以压缩和液化塑料密封剂装料,将其注入包含待包封的部件的模腔中。 塑料利用率可以超过90%,因为在液化凝固循环的同一阶段塑料材料到达每个模具腔体,所以可以获得更好的控制成型条件。 更多的空腔可以安装在给定的模具区域,因为消除了通常的中心材料锅和流道树。