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    • 9. 发明申请
    • SECONDARY DUAL PURPOSE STATION FOR WORKPIECE POLISHING MACHINE
    • 工程抛光机二次双用途站
    • WO00053371A1
    • 2000-09-14
    • PCT/US2000/005870
    • 2000-03-07
    • B24B37/20B24B37/34B24B57/02B24D9/10B24B37/04B24B41/047
    • B24B37/345B24B37/20B24B57/02B24D9/10
    • The present invention provides a dual purpose workpiece handoff station (22) for intermediately staging a semiconductor wafer (21), or other workpiece, being transferred between processing stations in, for example, a Chemical-Mechanical Planarization (CMP) machine. The handoff station (22) includes a workpiece processing surface (88); such as a polishing pad or buffing pad, defining a plurality of apertures (92, 94) for applying fluid, including water, chemicals, slurry, or vacuum, to the surface of a workpiece (21). In operation, a workpiece carrier (18) moves a polished wafer (21) from a primary polishing surface (16) to the handoff station (22), and polishes, buffs, or cleans the wafer (21) in the handoff station by rotating the wafer (21) and oscillating the wafer (27) across the handoff station polishing surface (88) while pressing the wafer (21) thereon.
    • 本发明提供了一种用于在例如化学机械平面化(CMP)机器中的处理站之间转移的半导体晶片(21)或其他工件的中间阶段的双用途工件切换站(22)。 切换站(22)包括工件处理表面(88); 例如抛光垫或抛光垫,其限定用于将包括水,化学品,浆料或真空的流体施加到工件(21)的表面的多个孔(92,94)。 在操作中,工件托架(18)将抛光的晶片(21)从主抛光表面(16)移动到切换站(22),并通过旋转来抛光,抛光或清洁切换站中的晶片(21) 晶片(21)并且在将晶片(21)压在其上的同时使晶片(27)摆动越过切换站抛光表面(88)。