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    • 4. 发明专利
    • T-gate forming method for high electron mobility transistor and gate structure thereof
    • 用于高电子移动性晶体管的门极形成方法及其门结构
    • JP2008118087A
    • 2008-05-22
    • JP2007050000
    • 2007-02-28
    • Postech Academy-Industry FoundationPostech Foundationポステック・アカデミー‐インダストリー・ファウンデーションポステック・ファウンデーション
    • JEONG YOON-HALEE KANG-SUNGKIM YOUNG-SOOHONG YUN-KIJUNG SUNG-WOO
    • H01L21/338H01L21/027H01L29/812
    • H01L29/7787H01L29/42316H01L29/66462
    • PROBLEM TO BE SOLVED: To provide a T-gate forming method for a high electron mobility transistor and a gate structure thereof. SOLUTION: The T-gate forming method for the high electron mobility transistor includes: a first step of coating a semiconductor substrate with a first, a second and a third resist, each having an electron beam sensitivity different from each other; a second step of performing a first exposure process by using an electron beam and then selectively developing the third resist; a third step of defining a gate head area 402 by selectively developing the second resist to have a developed width relatively wider than that of the selectively developed third resist; a fourth step of performing a second exposure process by using an electron beam on the semiconductor substrate having the third resist and second resist selectively developed and then selectively developing the first resist at a temperature relatively lower than in the development of the second and the third steps; and a fifth step of depositing metallic materials along the selectively developed resists and then removing them to form a T-gate having the gate head and a gate foot 404. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种用于高电子迁移率晶体管的T形栅形成方法及其栅极结构。 解决方案:用于高电子迁移率晶体管的T形栅形成方法包括:第一步骤,用具有彼此不同的电子束灵敏度的第一,第二和第三抗蚀剂涂覆半导体衬底; 第二步骤,通过使用电子束进行第一曝光处理,然后选择性地显影第三抗蚀剂; 通过选择性地显影所述第二抗蚀剂以使显影宽度相对于所述选择性显影的第三抗蚀剂的显影宽度相对宽度来限定栅极头区域402的第三步骤; 第四步骤,通过在具有第三抗蚀剂和第二抗蚀剂的半导体衬底上使用电子束进行第二曝光处理,所述第二曝光选择性地显影,然后在比第二和第三步骤的显影中相对低的温度下选择性地显影第一光刻胶 ; 以及第五步,沿着选择性显影的抗蚀剂沉积金属材料,然后去除它们以形成具有栅极头和栅极脚404的T形栅极。(C)2008,JPO和INPIT
    • 6. 发明专利
    • Nanoporous tungsten carbide catalyst and preparation method thereof
    • 纳米碳纳米管催化剂及其制备方法
    • JP2007275883A
    • 2007-10-25
    • JP2007097266
    • 2007-04-03
    • Postech Academy-Industry FoundationPostech Foundationポステック・アカデミー‐インダストリー・ファウンデーションポステック・ファウンデーション
    • LEE JAE SUNGJUNG MOOYOUNGRAMAN GANESANKIM YOUNGKWON
    • B01J27/22B01J35/04B01J35/10B01J37/08B01J37/10C01B32/949H01M4/90
    • B01J27/22H01M4/90H01M4/92H01M4/925H01M8/086H01M8/1009Y02E60/523Y02P70/56
    • PROBLEM TO BE SOLVED: To provide a nanoporous tungsten carbide catalyst that can be used as an electrode of a fuel cell, and a preparation method thereof. SOLUTION: Provided are the nanoporous tungsten carbide catalyst, which includes tungsten carbide crystalline particles and has nanopores of a mean pore diameter ranging from 2 nm to 5 nm and a nanopore volume of 0.08 to 0.25 cm 3 per gram of the catalyst, the preparation method thereof, an electrode and a fuel cell, such as a direct methanol fuel cell and a polymer electrolyte membrane fuel cell, to which the nanoporous tungsten carbide catalyst is applied. The nanoporous tungsten carbide catalyst has high electrochemical activity and enhanced resistance to poisoning by carbon monoxide. This catalyst can keep high activity even when used as the electrode of the fuel cell for a long period of time. Since this catalyst has a wide surface area, a metallic active component can be dispersed suitably in this catalyst and consequently a metallic active component-supported catalyst can exhibit higher catalytic activity even when the metallic active component of the amount smaller than that of the conventional noble metal catalyst is supported. The electrode and the fuel cell employing this catalyst can be manufactured at lower costs, respectively. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供可用作燃料电池的电极的纳米多孔碳化钨催化剂及其制备方法。 解决方案:提供纳米多孔碳化钨催化剂,其包括碳化钨结晶颗粒并且具有平均孔径范围为2nm至5nm和纳米孔体积为0.08至0.25cm 3(SP)的纳米孔 >每克催化剂,其制备方法,电极和燃料电池,例如直接甲醇燃料电池和聚合物电解质膜燃料电池,其中应用纳米多孔碳化钨催化剂。 纳米多孔碳化钨催化剂具有高电化学活性和增强的抗一氧化碳中毒性。 即使长时间用作燃料电池的电极,该催化剂也能保持高的活性。 由于该催化剂具有较宽的表面积,所以金属活性成分可以适当地分散在该催化剂中,因此即使金属活性成分的量少于常规贵金属的金属活性成分,金属活性成分负载型催化剂也能够表现出更高的催化活性 金属催化剂。 可以分别以较低的成本制造使用该催化剂的电极和燃料电池。 版权所有(C)2008,JPO&INPIT
    • 8. 发明专利
    • Gan-based compound semiconductor light-emitting element, and method of manufacturing the same
    • 基于GAN的化合物半导体发光元件及其制造方法
    • JP2012124523A
    • 2012-06-28
    • JP2012035499
    • 2012-02-21
    • Postech FoundationSeoul Opto Devices Co Ltdソウル オプト デバイス カンパニー リミテッドポステック・ファウンデーション
    • LEE JONG-LAM
    • H01L33/10H01L33/32H01L33/38H01L33/40H01L33/44
    • H01L33/40H01L33/0079H01L33/32H01L33/387H01L33/405H01L33/44
    • PROBLEM TO BE SOLVED: To provide a vertical type GaN light-emitting element capable of improving characteristic of a horizontal type light-emitting element by a metal protection film layer and a metal support layer, related to a GaN-based compound semiconductor light-emitting element and a method of manufacturing the same.SOLUTION: A thick metal protection film layer of 10 micron or more is formed on the side surface and/or the lower surface of a vertical type GaN-LED, so that an element can be protected from external impact and chip separation can be easily performed. And also, a metal substrate is used instead of a sapphire substrate so that heat that is generated at the time of element operation can be easily released, thereby suitable for use in a high output element. Thus, an element having improved optical output characteristic can be manufactured. A metal support layer is formed so that phenomenon such that the element is distorted at the time of chip separation or damaged by impact can be prevented. A p-type electrode is partially formed in network on a p-GaN, so that radiation of photon formed in an active layer toward an n-GaN layer can be maximized.
    • 要解决的问题:提供一种能够通过金属保护膜层和金属支撑层改善水平型发光元件的特性的垂直型GaN发光元件,涉及GaN基化合物半导体 发光元件及其制造方法。 解决方案:在垂直型GaN-LED的侧表面和/或下表面上形成10微米或更厚的厚金属保护膜层,从而可以保护元件免受外部冲击和芯片分离 容易执行。 而且,使用金属基板代替蓝宝石基板,能够容易地释放元件运转时产生的热量,适合用于高输出元件。 因此,可以制造具有改善的光学输出特性的元件。 形成金属支撑层,从而可以防止在芯片分离时元件变形或受冲击损坏的现象。 p型电极部分地形成在p-GaN上的网络中,使得在有源层中形成的朝向n-GaN层形成的光子的辐射可以最大化。 版权所有(C)2012,JPO&INPIT
    • 10. 发明专利
    • Contact type capacitive displacement sensor
    • 接触式电容式位移传感器
    • JP2007051899A
    • 2007-03-01
    • JP2005236254
    • 2005-08-17
    • Postech Academy-Industry FoundationPostech Foundationポステック・アカデミー‐インダストリー・ファウンデーションポステック・ファウンデーション
    • MOON WONKYUKIM MOOJIN
    • G01D5/24G01D5/245
    • PROBLEM TO BE SOLVED: To provide a contact type capacitive displacement sensor of an area change measuring system capable of reducing a mechanical installation error and an error caused by inconsistency between a driving direction and a measuring direction.
      SOLUTION: This contact type capacitive displacement sensor of the present invention includes: a fixed element provided with a fixed plate, and a fixed conductive pattern formed on the fixed plate and having a periodic pattern of a conductor; a moving element provided with a moving plate, and a moving conductive pattern formed on the moving plate and having the periodic pattern of the conductor, contacting with the fixed element each other, and movable to be relatively displaced each other; an electric power source for supplying electric power to the sensor; and a signal detecting means for detecting a change of an electric capacity between the fixed element and the moving element. The fixed element and the moving element have respectively insulation films related to the corresponding conductive patterns, and the electric capacity is fluctuated between the fixed conductor and the moving conductor along with fluctuation in an overlapped area therebetween, when the both conductors are moved relatively.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种能够减少机械安装误差和由驱动方向与测量方向不一致引起的误差的区域变化测量系统的接触式电容式位移传感器。 本发明的接触型电容式位移传感器包括:设置有固定板的固定元件和形成在固定板上并且具有导体的周期性图案的固定导电图案; 设置有移动板的移动元件和形成在移动板上并且具有导体的周期性图案的移动导电图案,与固定元件相互接触并且可相对移动相对移动; 用于向传感器供电的电源; 以及信号检测装置,用于检测固定元件和移动元件之间的电容量的变化。 固定元件和移动元件分别具有与相应导电图案相关的绝缘膜,并且当两个导体相对移动时,固定导体和移动导体之间的电容随着它们之间的重叠区域的波动而波动。 版权所有(C)2007,JPO&INPIT