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    • 5. 发明专利
    • T-gate forming method for high electron mobility transistor and gate structure thereof
    • 用于高电子移动性晶体管的门极形成方法及其门结构
    • JP2008118087A
    • 2008-05-22
    • JP2007050000
    • 2007-02-28
    • Postech Academy-Industry FoundationPostech Foundationポステック・アカデミー‐インダストリー・ファウンデーションポステック・ファウンデーション
    • JEONG YOON-HALEE KANG-SUNGKIM YOUNG-SOOHONG YUN-KIJUNG SUNG-WOO
    • H01L21/338H01L21/027H01L29/812
    • H01L29/7787H01L29/42316H01L29/66462
    • PROBLEM TO BE SOLVED: To provide a T-gate forming method for a high electron mobility transistor and a gate structure thereof. SOLUTION: The T-gate forming method for the high electron mobility transistor includes: a first step of coating a semiconductor substrate with a first, a second and a third resist, each having an electron beam sensitivity different from each other; a second step of performing a first exposure process by using an electron beam and then selectively developing the third resist; a third step of defining a gate head area 402 by selectively developing the second resist to have a developed width relatively wider than that of the selectively developed third resist; a fourth step of performing a second exposure process by using an electron beam on the semiconductor substrate having the third resist and second resist selectively developed and then selectively developing the first resist at a temperature relatively lower than in the development of the second and the third steps; and a fifth step of depositing metallic materials along the selectively developed resists and then removing them to form a T-gate having the gate head and a gate foot 404. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种用于高电子迁移率晶体管的T形栅形成方法及其栅极结构。 解决方案:用于高电子迁移率晶体管的T形栅形成方法包括:第一步骤,用具有彼此不同的电子束灵敏度的第一,第二和第三抗蚀剂涂覆半导体衬底; 第二步骤,通过使用电子束进行第一曝光处理,然后选择性地显影第三抗蚀剂; 通过选择性地显影所述第二抗蚀剂以使显影宽度相对于所述选择性显影的第三抗蚀剂的显影宽度相对宽度来限定栅极头区域402的第三步骤; 第四步骤,通过在具有第三抗蚀剂和第二抗蚀剂的半导体衬底上使用电子束进行第二曝光处理,所述第二曝光选择性地显影,然后在比第二和第三步骤的显影中相对低的温度下选择性地显影第一光刻胶 ; 以及第五步,沿着选择性显影的抗蚀剂沉积金属材料,然后去除它们以形成具有栅极头和栅极脚404的T形栅极。(C)2008,JPO和INPIT
    • 10. 发明专利
    • Gan-based compound semiconductor light-emitting element, and method of manufacturing the same
    • 基于GAN的化合物半导体发光元件及其制造方法
    • JP2012124523A
    • 2012-06-28
    • JP2012035499
    • 2012-02-21
    • Postech FoundationSeoul Opto Devices Co Ltdソウル オプト デバイス カンパニー リミテッドポステック・ファウンデーション
    • LEE JONG-LAM
    • H01L33/10H01L33/32H01L33/38H01L33/40H01L33/44
    • H01L33/40H01L33/0079H01L33/32H01L33/387H01L33/405H01L33/44
    • PROBLEM TO BE SOLVED: To provide a vertical type GaN light-emitting element capable of improving characteristic of a horizontal type light-emitting element by a metal protection film layer and a metal support layer, related to a GaN-based compound semiconductor light-emitting element and a method of manufacturing the same.SOLUTION: A thick metal protection film layer of 10 micron or more is formed on the side surface and/or the lower surface of a vertical type GaN-LED, so that an element can be protected from external impact and chip separation can be easily performed. And also, a metal substrate is used instead of a sapphire substrate so that heat that is generated at the time of element operation can be easily released, thereby suitable for use in a high output element. Thus, an element having improved optical output characteristic can be manufactured. A metal support layer is formed so that phenomenon such that the element is distorted at the time of chip separation or damaged by impact can be prevented. A p-type electrode is partially formed in network on a p-GaN, so that radiation of photon formed in an active layer toward an n-GaN layer can be maximized.
    • 要解决的问题:提供一种能够通过金属保护膜层和金属支撑层改善水平型发光元件的特性的垂直型GaN发光元件,涉及GaN基化合物半导体 发光元件及其制造方法。 解决方案:在垂直型GaN-LED的侧表面和/或下表面上形成10微米或更厚的厚金属保护膜层,从而可以保护元件免受外部冲击和芯片分离 容易执行。 而且,使用金属基板代替蓝宝石基板,能够容易地释放元件运转时产生的热量,适合用于高输出元件。 因此,可以制造具有改善的光学输出特性的元件。 形成金属支撑层,从而可以防止在芯片分离时元件变形或受冲击损坏的现象。 p型电极部分地形成在p-GaN上的网络中,使得在有源层中形成的朝向n-GaN层形成的光子的辐射可以最大化。 版权所有(C)2012,JPO&INPIT