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1. 发明申请

WO2007050712A3 TECHNIQUE FOR FORMING A THERMALLY CONDUCTIVE INTERFACE WITH PATTERNED METAL FOIL 审中-公开
公开(公告)号：WO2007050712A3
公开(公告)日：2007-05-03
申请号：PCT/US2006/041694
申请日：2006-10-26
申请人： INDIUM CORPORATION OF AMERICA
发明人： JARRETT, Robert, N. , MERRITT, Craig, K.
IPC分类号： H05K7/20 , B32B3/28 , H01L23/34
摘要： A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive metal foil having at least one patterned surface for facilitating heat dissipation from at least one integrated circuit device to at least one heat sink. The metal foil preferably has a characteristic formability and softness that may be exemplified by alloys of lead, indium, tin, and other malleable metals, and/or composites comprising layers of at least one malleable metal alloy.

2. 发明申请

WO2005042203A1 SOLDER PASTES FOR PROVIDING HIGH ELASTICITY, LOW RIGIDITY SOLDER JOINTS 审中-公开
标题翻译：用于提供高弹性，低刚度焊接接头的焊膏
公开(公告)号：WO2005042203A1
公开(公告)日：2005-05-12
申请号：PCT/US2004/036257
申请日：2004-11-02
申请人： INDIUM CORPORATION OF AMERICA
发明人： LIU, Yan , LEE, Ning-Cheng , HERRON, Derrick
IPC分类号： B23K31/02
CPC分类号： B23K35/025 , B23K35/0244 , B23K35/26 , B23K35/302 , B23K35/3612 , B23K2201/36 , H05K3/3484 , H05K2201/0215
摘要： Solder pastes (2) for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes (2) may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts (1, 9) are soldered together. In one particular exemplary embodiment, a solder paste (2) may be realized as a composition comprising a solder powder (6) and high melting temperature particles (5) with a flux (4), wherein the ratio between solder powder (6) and high melting temperature particles (5) may be between 2:1 and 1:10.
摘要翻译：公开了用于提供高弹性，低刚性焊点的焊膏（2）。焊膏（2）可以在其热膨胀系数不匹配的两个部件之间和/或当两个部件（1,9）被焊接在一起时机械变形的可能性很高时使用。在一个具体的示例性实施例中，焊膏（2）可以实现为包含焊料粉末（6）和具有焊剂（4）的高熔点温度颗粒（5）的组合物，其中焊料粉末（6）和高熔点温度的颗粒（5）可以在2:1和1:10之间。

3. 发明申请

WO2007133528A3 ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESS AND OXIDATION OF METALS AND ALLOYS 审中-公开
公开(公告)号：WO2007133528A3
公开(公告)日：2007-11-22
申请号：PCT/US2007/011080
申请日：2007-05-08
申请人： INDIUM CORPORATION OF AMERICA
发明人： HWANG, Hong-Sik , LEE, Ning-cheng
IPC分类号： C22C28/00
摘要： Alloy compositions and techniques for reducing IMC thickness and oxidation of metals and alloys are disclosed. In one particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy or mixture consisting essentially of from about 90% to about 99.999% by weight indium and from about 0.001% to about 10% by weight germanium and unavoidable impurities. In another particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy consisting essentially of from about 90% to about 99.999% by weight gallium and from about 0.001% to about 10% by weight germanium and unavoidable impurities.

4. 发明申请

WO2007050571A2 TECHNIQUE FOR INCREASING THE COMPLIANCE OF LEAD-FREE SOLDERS CONTAINING SILVER 审中-公开
标题翻译：提高包含银的无铅焊枪符合性的技术
公开(公告)号：WO2007050571A2
公开(公告)日：2007-05-03
申请号：PCT/US2006/041410
申请日：2006-10-24
申请人： INDIUM CORPORATION OF AMERICA
发明人： HUANG, Benlih , HWANG, Hong-Sik , LEE, Ning-Cheng
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , B23K35/262 , B23K35/3006
摘要： A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn-Ag-Al alloy composition comprising (0.01-20) %Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn-Ag-Cu-Al alloy composition comprising (0.01-20)%Ag, (0.01-l)%Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn-Ag-Al-Ni composition comprising (0.01-20) %Ag, (0.01-2)%Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn-Ag-Cu-Al-Ni alloy composition comprising (0.01-20) %Ag, (0.01-l)%Cu, (0.01-2)%Al, (0.01-4)%Ni, balanced with Sn.
摘要翻译：公开了一种提高含银无铅焊料柔顺性的技术。在一个具体的示例性实施方案中，该技术可以实现为包含与Sn平衡的（0.01-20）％Ag，（0.01-2）％Al，Sn-Ag-Al合金组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn与Sn平衡的Sn-Ag-Cu-Al合金组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-2）％Al，（0.01-4）％Ni，与Sn平衡的Sn-Ag-Al-Ni组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn-Ag-Cu-Al- （0.01-4）％Ni，与Sn平衡。

5. 发明申请

WO2007027428A3 TECHNIQUE FOR INCREASING THE COMPLIANCE OF TIN-INDIUM SOLDERS 审中-公开
公开(公告)号：WO2007027428A3
公开(公告)日：2007-03-08
申请号：PCT/US2006/031776
申请日：2006-08-15
申请人： INDIUM CORPORATION OF AMERICA , HUANG, Benlih , HWANG, Hong-sik , LEE, Ning-cheng
发明人： HUANG, Benlih , HWANG, Hong-sik , LEE, Ning-cheng
IPC分类号： C22C13/00
摘要： A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.

6. 发明申请

WO2003044849A3 INTEGRATED VOID-FREE PROCESS FOR ASSEMBLING A SOLDER BUMPED CHIP 审中-公开
公开(公告)号：WO2003044849A3
公开(公告)日：2003-05-30
申请号：PCT/US2002/036647
申请日：2002-11-14
申请人： INDIUM CORPORATION OF AMERICA
发明人： WANG, Shanger , YIN, Wusheng , LEE, Ning-Cheng
IPC分类号： H01L21/4763
摘要： An integrated void-free process has been developed for attaching a solder bumped chip (401) to a substrate (407). The chip (401) is first dipped in a tacky thermosettable flux (403), and the chip (401) is mounted on the substrate (407). An underfill (408) is dispensed along the edge of the chip (401). The device is then sent into the reflow furnace to complete the underfilling (which optionally can be completed before reflow), solder reflowing and underfill curing. The flux (403) also acts as a physical barrier minimizing, if not eliminating, the interference of filler on solder wetting and resulting metallurgical joints (406) formed between the solder (402) and the bond pads (405). The process allows for the integration of a void free conventional capillary flow underfilling process and a pre-deposited fluxing underfilling process by using a tacky thermosettable flux (403), avoiding the problems associated with each of the individual processes and requiring less time for the overall process.

7. 发明申请

WO2003044848A1 METHOD OF APPLYING NO-FLOW UNDERFILL 审中-公开
标题翻译：应用无流量的方法
公开(公告)号：WO2003044848A1
公开(公告)日：2003-05-30
申请号：PCT/US2002/036666
申请日：2002-11-14
申请人： INDIUM CORPORATION OF AMERICA
发明人： YIN, Wusheng , LEE, Ning-Cheng
IPC分类号： H01L21/44
CPC分类号： H01L24/27 , H01L21/563 , H01L24/29 , H01L2224/05571 , H01L2224/05573 , H01L2224/11822 , H01L2224/16225 , H01L2224/29111 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81011 , H01L2224/81191 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/10253 , H01L2924/14 , H01L2924/1579 , H01L2924/00012 , H01L2924/00
摘要： A new method has been developed to provide underfill to chips mounted on substrates. First, an underfill is dispensed on the substrate. Second, the bumps of the chip are dipped in a flux that does not contain filler. Third, the chip that has been dipped in a tacky thermosettable flux is placed on the substrate, and fourth, the chip is soldered to the substrate, and simultaneously the underfill is cured. This process eliminates the interference on solder joints caused by the presence of filler in filled no-flow underfill. In addition, the fluxing property of the flux allows the use of underfills with emphasis on curing and mechanical properties instead of fluxing performance. Accordingly, a mounted device with reliable solder joints and underfill encapsulation is obtained.
摘要翻译：已经开发了一种新的方法来为安装在基板上的芯片提供底部填充。首先，在基板上分配底部填充物。第二，将芯片的凸起浸入不含填料的焊剂中。第三，将已经浸入粘性热固性助熔剂中的芯片放置在基材上，第四，将芯片焊接到基材上，同时将底部填料固化。该过程消除了在填充的无流动底部填充物中由填料的存在引起的焊点上的干扰。此外，助焊剂的助熔性能允许使用底层填料，强调固化和机械性能而不是助熔性能。因此，获得了具有可靠的焊点和底部填充封装的安装装置。

8. 发明申请

WO1995020460A1 SOLDER PASTE UTILIZING AROMATIC CARBOXYLIC ACIDS 审中-公开
标题翻译：使用芳香羧酸的焊膏
公开(公告)号：WO1995020460A1
公开(公告)日：1995-08-03
申请号：PCT/US1995001078
申请日：1995-01-27
申请人： INDIUM CORPORATION OF AMERICA
发明人： INDIUM CORPORATION OF AMERICA , JOZEFOWICZ, Mikolaj, E. , LEE, Ning-Cheng
IPC分类号： B23K35/34
CPC分类号： B23K35/3618 , B23K35/025 , H05K3/3484
摘要： A solder paste that maintains its original viscosity over time and avoids rheology deterioration is disclosed. The invention includes coating solder alloy particles with an aromatic carboxylic acid or a mixture of acids to protect the solder alloy from reacting chemically with the flux and maintain the paste viscosity and deposition capability. In one embodiment, solder powder is treated by soaking the solder particles in an aromatic carboxylic acid solution and heat drying. In an alternative embodiment, the coated particles are dried under vacuum. The coated solder particles are then mixed with flux and formed into a paste. The aromatic carboxylic acid coating, by bonding strongly to the metal powder surface, serves as a non-soluble protective barrier against flux at ambient temperature and a flux-aid at elevated temperature.
摘要翻译：公开了一种随时间保持其原始粘度并避免流变性劣化的焊膏。本发明包括用芳族羧酸或酸的混合物涂覆焊料合金颗粒以保护焊料合金与焊剂化学反应并保持浆料的粘度和沉积能力。在一个实施例中，通过将焊料颗粒浸泡在芳族羧酸溶液中并加热干燥来处理焊料粉末。在替代实施方案中，将涂覆的颗粒在真空下干燥。然后将涂覆的焊料颗粒与焊剂混合并形成糊状物。通过与金属粉末表面强烈结合，芳族羧酸涂层在环境温度下作为不溶于水的保护屏障，并在高温下起助助剂的作用。

9. 发明申请

WO2007070548A2 LEAD-FREE SOLDER ALLOYS AND SOLDER JOINTS THEREOF WITH IMPROVED DROP IMPACT RESISTANCE 审中-公开
标题翻译：无铅焊接合金及其焊接接头，具有改善的耐冲击性
公开(公告)号：WO2007070548A2
公开(公告)日：2007-06-21
申请号：PCT/US2006/047476
申请日：2006-12-13
申请人： INDIUM CORPORATION OF AMERICA
发明人： LIU, Weiping , LEE, Ning-Cheng
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , C22C13/02
摘要： Lead- free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably comprise 0.0-4.0 wt . % of Ag, 0.01-1.5 wt . % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt.%, Y in an amount of 0.001-1.0 wt.%, Ti in an amount of 0.001-0.8 wt.%, and Bi in an amount of 0.01-1.0 wt.%, and the remainder of Sn.
摘要翻译：公开了具有改进的耐滴落冲击性的无铅焊料合金及其焊接接头。在一个具体的示例性实施方案中，无铅焊料合金优选包含0.0-4.0wt。％的Ag，0.01-1.5wt。％的Cu，以下添加剂中的至少一种：Mn为0.001〜1.0重量％％，Ce为0.001-0.8重量％，Y为0.001-1.0重量％，Ti为0.001-0.8重量％，Bi为0.01-1.0重量％，剩余的Sn。

10. 发明申请

WO2007038490A2 LOW MELTING TEMPERATURE COMPLIANT SOLDERS 审中-公开
标题翻译：低熔点温度合规焊接
公开(公告)号：WO2007038490A2
公开(公告)日：2007-04-05
申请号：PCT/US2006/037441
申请日：2006-09-26
申请人： INDIUM CORPORATION OF AMERICA
发明人： HUANG, Benlih
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , B23K35/262
摘要： Low melting temperature compliant solders are disclosed. In one particular exemplary embodiment, a low melting temperature compliant solder alloy comprises from about 91.5% to about 97.998% by weight tin, from about 0.001% to about 3.5% by weight silver, from about 0.0% to about 1.0% by weight copper, and from about 2.001% to about 4.0% by weight indium.
摘要翻译：披露了低熔点温度的焊料。在一个特定的示例性实施方案中，低熔点兼容性焊料合金包含约91.5重量％至约97.998重量％的锡，约0.001重量％至约3.5重量％的银，约0.0重量％至约1.0重量％的铜，和约2.001重量％至约4.0重量％的铟。

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