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1. 发明申请

WO2007050571A2 TECHNIQUE FOR INCREASING THE COMPLIANCE OF LEAD-FREE SOLDERS CONTAINING SILVER 审中-公开
标题翻译：提高包含银的无铅焊枪符合性的技术
公开(公告)号：WO2007050571A2
公开(公告)日：2007-05-03
申请号：PCT/US2006/041410
申请日：2006-10-24
申请人： INDIUM CORPORATION OF AMERICA
发明人： HUANG, Benlih , HWANG, Hong-Sik , LEE, Ning-Cheng
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , B23K35/262 , B23K35/3006
摘要： A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn-Ag-Al alloy composition comprising (0.01-20) %Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn-Ag-Cu-Al alloy composition comprising (0.01-20)%Ag, (0.01-l)%Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn-Ag-Al-Ni composition comprising (0.01-20) %Ag, (0.01-2)%Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn-Ag-Cu-Al-Ni alloy composition comprising (0.01-20) %Ag, (0.01-l)%Cu, (0.01-2)%Al, (0.01-4)%Ni, balanced with Sn.
摘要翻译：公开了一种提高含银无铅焊料柔顺性的技术。在一个具体的示例性实施方案中，该技术可以实现为包含与Sn平衡的（0.01-20）％Ag，（0.01-2）％Al，Sn-Ag-Al合金组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn与Sn平衡的Sn-Ag-Cu-Al合金组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-2）％Al，（0.01-4）％Ni，与Sn平衡的Sn-Ag-Al-Ni组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn-Ag-Cu-Al- （0.01-4）％Ni，与Sn平衡。

2. 发明申请

WO2007027428A3 TECHNIQUE FOR INCREASING THE COMPLIANCE OF TIN-INDIUM SOLDERS 审中-公开
公开(公告)号：WO2007027428A3
公开(公告)日：2007-03-08
申请号：PCT/US2006/031776
申请日：2006-08-15
申请人： INDIUM CORPORATION OF AMERICA , HUANG, Benlih , HWANG, Hong-sik , LEE, Ning-cheng
发明人： HUANG, Benlih , HWANG, Hong-sik , LEE, Ning-cheng
IPC分类号： C22C13/00
摘要： A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.

3. 发明公开

EP1685586A2 ANTI-TOMBSTONING LEAD FREE ALLOYS FOR SURFACE MOUNT REFLOW SOLDERING 审中-公开
标题翻译：具有抗竖碑表面无铅合金支架RÜCKFLUSSLÖTUNG
公开(公告)号：EP1685586A2
公开(公告)日：2006-08-02
申请号：EP04810184.4
申请日：2004-11-02
申请人： Indium Corporation of America
发明人： HUANG, Benlih , LEE, Ning-Cheng
IPC分类号： H01L21/00
CPC分类号： C22C13/00 , B23K35/262 , H05K3/3463 , H05K2201/10636 , Y02P70/611
摘要： A lead-free solder alloy composition comprising tin, silver and copper, and a process for reflow soldering for minimizing tombstoning frequency are disclosed. In one particular exemplary embodiment, the lead-free Sn—Ag—Cu solder alloys for minimizing the tombstoning effect of the present disclosure display high mass fraction during melting and prolonged melting as shown by a widened DSC peaks, that allows for a balanced surface tension on both ends of the chip component to develop. In accordance with further aspects of this exemplary embodiment, the alloys display a mass fraction of solid during melting greater than 20% and a DSC peak width greater than 8° C. using a 5° C./min scan rate. In accordance with further aspects of this exemplary embodiment, the alloy comprises on a weight basis Ag 1-4.5%, Cu 0.3-1% balanced with Sn.

4. 发明申请

WO2007038490A2 LOW MELTING TEMPERATURE COMPLIANT SOLDERS 审中-公开
标题翻译：低熔点温度合规焊接
公开(公告)号：WO2007038490A2
公开(公告)日：2007-04-05
申请号：PCT/US2006/037441
申请日：2006-09-26
申请人： INDIUM CORPORATION OF AMERICA
发明人： HUANG, Benlih
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , B23K35/262
摘要： Low melting temperature compliant solders are disclosed. In one particular exemplary embodiment, a low melting temperature compliant solder alloy comprises from about 91.5% to about 97.998% by weight tin, from about 0.001% to about 3.5% by weight silver, from about 0.0% to about 1.0% by weight copper, and from about 2.001% to about 4.0% by weight indium.
摘要翻译：披露了低熔点温度的焊料。在一个特定的示例性实施方案中，低熔点兼容性焊料合金包含约91.5重量％至约97.998重量％的锡，约0.001重量％至约3.5重量％的银，约0.0重量％至约1.0重量％的铜，和约2.001重量％至约4.0重量％的铟。

5. 发明申请

WO2005048303A2 ANTI-TOMBSTONING LEAD FREE ALLOYS FOR SURFACE MOUNT REFLOW SOLDERING 审中-公开
标题翻译：防反射焊接自由焊接表面安装反射焊接
公开(公告)号：WO2005048303A2
公开(公告)日：2005-05-26
申请号：PCT/US2004/036256
申请日：2004-11-02
申请人： INDIUM CORPORATION OF AMERICA
发明人： HUANG, Benlih , LEE, Ning-Cheng
IPC分类号： H01L
CPC分类号： C22C13/00 , B23K35/262 , H05K3/3463 , H05K2201/10636 , Y02P70/611
摘要： A lead-free solder alloy composition comprising tin, silver and copper, and a process for reflow soldering for minimizing tombstoning frequency are disclosed. In one particular exemplary embodiment, the lead-free Sn-Ag-Cu solder alloys for minimizing the tombstoning effect of the present disclosure display high mass fraction during melting and prolonged melting as shown by a widened DSC peaks, that allows for a balanced surface tension on both ends of the chip component to develop. In accordance with further aspects of this exemplary embodiment, the alloys display a mass fraction of solid during melting greater than 20% and a DSC peak width greater than 8 ° C using a 5 ° C/min scan rate. In accordance with further aspects of this exemplary embodiment, the alloy comprises on a weight basis Ag 1-4.5 %, Cu 0.3-1% balanced with Sn.
摘要翻译：公开了一种包含锡，银和铜的无铅焊料合金组合物，以及用于最小化墓碑频率的回流焊接方法。在一个具体的示例性实施例中，用于使本公开的墓碑效应最小化的无铅Sn-Ag-Cu焊料合金在熔化和延长熔化期间显示高质量分数，如扩大的DSC峰所示，其允许平衡的表面张力在芯片组件的两端开发。根据该示例性实施方案的另外的方面，合金在熔化时显示大于20％的固体的质量分数，并且使用5℃/ min的扫描速率显示大于8℃的DSC峰宽。根据该示例性实施方案的另外的方面，合金包含基于Ag 1-4.5％的重量，与Sn平衡的0.3-1％的Cu。

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