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    • 1. 发明申请
    • LED MODULE FOR ILLUMINATION
    • LED模块用于照明
    • US20090122514A1
    • 2009-05-14
    • US12293420
    • 2007-03-13
    • Young Ro YoonWoo Suk Kang
    • Young Ro YoonWoo Suk Kang
    • F21V33/00
    • F21V3/02F21K9/00F21Y2115/10
    • The present invention relates to an LED module for illumination, and more particularly, to an LED module for illumination capable of enhancing light emitting efficiency by having a light emitting structure, in which the thickness of an insulation substrate with an electrode pattern formed on a top portion thereof is minimized, a heat radiation substrate is formed by integrally attaching a radiator to a bottom surface of the insulation substrate, and LED elements are attached to the electrode pattern of the heat radiation substrate through silver epoxy with excellent heat conductivity as an adhesive agent, so that heat generated from the LED elements can effectively radiate through the radiator, white light is effectively generated from the light emitted from the LED elements, and the white light can be emitted to the outside maximally.
    • 本发明涉及一种用于照明的LED模块,更具体地,涉及一种用于照明的LED模块,其能够通过具有发光结构来提高发光效率,其中具有形成在顶部的电极图案的绝缘基板的厚度 部分被最小化,通过将散热器整体地附接到绝缘基板的底面而形成散热基板,并且通过具有优良导热性的银环氧树脂作为粘合剂将LED元件附着到散热基板的电极图案 ,使得从LED元件产生的热量可以有效地辐射通过散热器,从LED元件发射的光有效地产生白光,并且白光可以最大程度地发射到外部。
    • 2. 发明授权
    • LED module for illumination
    • LED模块用于照明
    • US07740373B2
    • 2010-06-22
    • US12293420
    • 2007-03-13
    • Young-Ro YoonWoo-Suk Kang
    • Young-Ro YoonWoo-Suk Kang
    • F21V11/00H01J1/62
    • F21V3/02F21K9/00F21Y2115/10
    • The present invention relates to an LED module for illumination, and more particularly, to an LED module for illumination capable of enhancing light emitting efficiency by having a light emitting structure, in which the thickness of an insulation substrate with an electrode pattern formed on a top portion thereof is minimized, a heat radiation substrate is formed by integrally attaching a radiator to a bottom surface of the insulation substrate, and LED elements are attached to the electrode pattern of the heat radiation substrate through silver epoxy with excellent heat conductivity as an adhesive agent, so that heat generated from the LED elements can effectively radiate through the radiator, white light is effectively generated from the light emitted from the LED elements, and the white light can be emitted to the outside maximally.
    • 本发明涉及一种用于照明的LED模块,更具体地,涉及一种用于照明的LED模块,其能够通过具有发光结构来提高发光效率,其中具有形成在顶部的电极图案的绝缘基板的厚度 部分被最小化,通过将散热器整体地附接到绝缘基板的底面而形成散热基板,并且通过具有优良导热性的银环氧树脂作为粘合剂将LED元件附着到散热基板的电极图案 ,使得从LED元件产生的热量可以有效地辐射通过散热器,从LED元件发射的光有效地产生白光,并且白光可以最大程度地发射到外部。
    • 3. 发明公开
    • LED MODULE FOR ILLUMINATION
    • LED-MODULFÜRBELEUCHTUNG
    • EP1996856A1
    • 2008-12-03
    • EP07715626.3
    • 2007-03-13
    • DAE Shin Led Co. Ltd.
    • YOON, Young RoKANG, Woo Suk
    • F21S2/00
    • F21V3/02F21K9/00F21Y2115/10
    • The present invention relates to an LED module for illumination, and more particularly, to an LED module for illumination capable of enhancing light emitting efficiency by having a light emitting structure, in which the thickness of an insulation substrate with an electrode pattern formed on a top portion thereof is minimized, a heat radiation substrate is formed by integrally attaching a radiator to a bottom surface of the insulation substrate, and LED elements are attached to the electrode pattern of the heat radiation substrate through silver epoxy with excellent heat conductivity as an adhesive agent, so that heat generated from the LED elements can effectively radiate through the radiator, white light is effectively generated from the light emitted from the LED elements, and the white light can be emitted to the outside maximally.
    • 本发明涉及一种用于照明的LED模块,更具体地,涉及一种用于照明的LED模块,其能够通过具有发光结构来提高发光效率,其中具有形成在顶部的电极图案的绝缘基板的厚度 通过将散热器整体地安装在绝缘基板的底面,形成散热基板,通过作为粘合剂的导热性优异的银环氧树脂将LED元件附着在散热基板的电极图案上 ,使得从LED元件产生的热量可以有效地辐射通过散热器,从LED元件发出的光有效地产生白光,并且白光可以最大程度地发射到外部。