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1. 发明申请

WO2022051958A1 VAPOR CHAMBER 审中-公开
公开(公告)号：WO2022051958A1
公开(公告)日：2022-03-17
申请号：PCT/CN2020/114351
申请日：2020-09-10
申请人： MURATA MANUFACTURING CO., LTD. , COOLER MASTER CO., LTD
发明人： NAITO, Akihito , LIU, Lei-Lei
IPC分类号： F28D15/04
摘要： A vapor chamber that includes: a casing including first and second sheets facing each other; a working medium sealed in an internal space of the casing; and a wick having at least three stacked wick components in the internal space. A first wick component is in contact with the first sheet, and a second wick component is in contact with the second sheet. In a sectional view in a direction orthogonal to a direction in which the first and second sheets face each other, a number of wick components larger in width than a wick component having a smallest width is two or more, and a width of a portion in which the wick components overlap each other is equal to or larger than 1/4 of the distance between supports nearest to the wick and is equal to or smaller than 3/4 of the width of a working space.

2. 发明专利

JP2008196485A Thin film pump and device equipped therewith 审中-公开
标题翻译：薄膜泵及其装置
公开(公告)号：JP2008196485A
公开(公告)日：2008-08-28
申请号：JP2008015829
申请日：2008-01-28
申请人： Cooler Master Co Ltd , Hsiao-Kang Ma , 訊凱國際股▲ふん▼有限公司 , 小康馬
发明人： MA HSIAO-KANG , KUO MING-CHIEN , HOU BO-REN , WU HONG-YUN , PENG CHANG-HUNG
IPC分类号： F04B43/04
CPC分类号： F04B43/04 , F04B43/046
摘要： PROBLEM TO BE SOLVED: To miniaturize a cooling medium circulating thin film pump for an electronic device while improving the efficiency thereof.
SOLUTION: The thin film pump comprises a hollow body 1, the hollow body having a first hollow chamber 11 and a second hollow chamber 12 inside, the first hollow chamber and the second hollow chamber being communicated 13 with each other, a water supply pipe 14 and a water drain pipe 15 installed in the first hollow chamber 11 and the second hollow chamber 12, respectively, and valve bodies 2, 2a installed in the openings thereof, respectively, for preventing the back flow of operating fluid. Furthermore, a thin film 3 and an actuator member 42 of a piezoelectric material are made in close contact with the upper face of the hollow body and with the thin film, respectively. The actuator member fixed at one end to the first hollow chamber 11 is energized to be flexed and thus deformed into a sector form. Thereby, the upper flexion of the thin film is linked with lower flexion and the operating fluid in the first hollow chamber is pressurized and depressurized to produce a unidirectional circulating flow.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了使提高其效率的电子设备的冷却介质循环薄膜泵的小型化。解决方案：薄膜泵包括中空体1，中空体具有内部的第一中空室11和第二中空室12，第一中空室和第二中空室彼此连通13，水分别安装在第一中空室11和第二中空室12中的供水管14和排水管15以及分别安装在其开口中的阀体2,2a用于防止工作流体的回流。此外，压电材料的薄膜3和致动器构件42分别与中空体的上表面和薄膜紧密接触。将一端固定在第一中空室11上的致动器构件被通电以弯曲并因此变形为扇形。因此，薄膜的上屈曲与较低的弯曲相关联，并且第一中空室中的工作流体被加压和减压以产生单向循环流。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2008258577A Water-cooled head for heat sink 审中-公开
标题翻译：水冷水头
公开(公告)号：JP2008258577A
公开(公告)日：2008-10-23
申请号：JP2008006165
申请日：2008-01-15
申请人： Cooler Master Co Ltd , Hsiao-Kang Ma , 訊凱國際股▲ふん▼有限公司 , 小康馬
发明人： MA HSIAO-KANG , PENG CHANG-HUNG , HOU BO-REN , KUO MING-CHIEN
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： F28F3/12 , F04B43/04 , F04B43/046 , F04B53/08 , F28F2250/08 , H01L23/34 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thinned water-cooled head which adheres to a heating member.
SOLUTION: A housing chamber 13 is disposed within a housing 1, a water supply passage 11 and a draining passage 12 are arranged at edges of the housing 1 respectively and they are communicated to the housing, and a heat exchange structure 14 is arranged in the housing to heat-exchange with a working fluid. A thin film 2 is formed on an upper side of the housing, an operation member 3 consisting of plate of piezoelectric material 32 adheres on the thin film such that the thin film vertically vibrates with a vertically vibration of the operation member by the conduction of the static electricity, and circulation flow in a certain direction is generated by increasing and decreasing the pressure of the working fluid in the housing.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供粘附到加热构件的变薄的水冷头。解决方案：容纳室13设置在壳体1内，供水通道11和排水通道12分别布置在壳体1的边缘处，并且它们连通到壳体，热交换结构14 布置在壳体中以与工作流体进行热交换。薄膜2形成在壳体的上侧，由压电材料板32组成的操作构件3附着在薄膜上，使得薄膜垂直振动，操作构件的垂直振动通过增加和减小壳体中的工作流体的压力来产生静电和沿一定方向的循环流动。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008010828A Heat-conducting module and method for manufacturing the same 审中-公开
标题翻译：导热模块及其制造方法
公开(公告)号：JP2008010828A
公开(公告)日：2008-01-17
申请号：JP2007109422
申请日：2007-04-18
申请人： Cooler Master Co Ltd , 訊凱國際股▼ふん▲有限公司
发明人： LEE PHON-QUAN
IPC分类号： H01L23/36 , H01L23/473
CPC分类号： F28D15/0275 , F28D15/0233 , H01L21/4878 , H01L21/4882 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat conducting module for improving heat transfer effects and a method for manufacturing it. SOLUTION: This heat conducting module and a method for manufacturing it are used for isolating the quantity of heat to be generated in an electronic member, and the heat conducting module includes a heat conducting board and a plurality of heat pipes. A plurality of concave grooves which are in parallel with each other are opened on the upper face of the heat conducting board, and each concave groove is put through the front and rear end faces of the heat-conducting board, and an arc-shaped face is formed at the lower part, and a restraint section is extended inward at both sides of the upper part of the concave groove. One end of the thermal tube is formed as a heat receiving end, and the other end is formed as a heat emitting end, and the heat receiving end is put through the concave groove of the heat conducting board, and adhered to and brought into contact with the internal wall of the concave groove and the internal side of the restraint part. Thus, it is possible to hold stability and adhesiveness between the heat conducting board and each thermal tube, and to improve the heat conducting effects of the heat conducting module. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于改善传热效果的导热模块及其制造方法。解决方案：该导热组件及其制造方法用于隔离电子部件中产生的热量，导热组件包括导热板和多个热管。在导热板的上表面上开设多个彼此平行的凹槽，并且每个凹槽穿过导热板的前端和后端面，并且弧形表面形成在下部，并且限制部在凹槽的上部的两侧向内延伸。热管的一端形成为受热端，另一端形成为发热端，受热端穿过导热板的凹槽，并粘接并接触与凹槽的内壁和约束部分的内侧。因此，可以保持导热板和各个热管之间的稳定性和粘合性，并且提高导热模块的导热效果。版权所有（C）2008，JPO＆INPIT

5. 发明授权

EP4036687B1 COMPUTER DEVICE, CASING, AND WATER COOLING HEAT DISSIPATION DEVICE 有权
公开(公告)号：EP4036687B1
公开(公告)日：2024-08-21
申请号：EP22150189.3
申请日：2022-01-04
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/20 , G06F2200/20120130101

6. 发明授权

EP4019875B1 HEAT DISSIPATION DEVICE 有权转让
公开(公告)号：EP4019875B1
公开(公告)日：2023-12-20
申请号：EP21166009.7
申请日：2021-03-30
发明人： CHEN, Kui-Yen , CHENG, Shan-Yin
IPC分类号： F28D1/03 , F28D21/00 , F28F3/06 , F28F9/02 , H01L23/367 , H01L23/473 , H05K7/20

7. 发明公开

EP3141980A2 ELECTRONIC SYSTEM AND EXTERNAL AUXILIARY HEAT DISSIPATION DEVICE THEREOF 审中-公开
标题翻译： ZUSÄTZLICHEEXTERNEWÄRMEABLEITUNGSVORRICHTUNGDAFÜR的ELEKTRONISCHES系统
公开(公告)号：EP3141980A2
公开(公告)日：2017-03-15
申请号：EP16153316.1
申请日：2016-01-29
申请人： Cooler Master Co., Ltd.
发明人： TSAI, Shui-Fa , HUANG, Shih-Wei , CHEN, Hsin-Hung
IPC分类号： G06F1/16 , G06F1/20 , H05K7/20
CPC分类号： H05K7/20263 , G06F1/1632 , G06F1/20 , H05K7/20272
摘要： An external auxiliary heat dissipation device (D) includes an external connection head module (M1), a fluid driving module (M2), a heat dissipation module (M3), and a plurality of first pipes (T1). The external connection head module (M1) includes a first carrier body (1) and at least two first fluid connector (2)s disposed on the first carrier body (1). The first pipes (T1) connect to the first fluid connector (2), the fluid driving module (M2), and the heat dissipation module (M3) to form a first fluid pathway. The electronic system (S) includes an internal connection head module (M9) and a plurality of second pipes (T2). The second pipes (T2) connect to the internal connection head module (M9) to form a second fluid pathway. The internal connection head module (M9) is detachably connected to the external connection head module (M1), so that the first and the second fluid pathways are in fluid communication with each other to form a loop fluid pathway.
摘要翻译：外部辅助散热装置（D）包括外部连接头模块（M1），流体驱动模块（M2），散热模块（M3）和多个第一管道（T1）。外部连接头模块（M1）包括第一载体主体（1）和设置在第一载体主体（1）上的至少两个第一流体连接器（2）。第一管（T1）连接到第一流体连接器（2），流体驱动模块（M2）和散热模块（M3）以形成第一流体通路。电子系统（S）包括内部连接头模块（M9）和多个第二管道（T2）。第二管（T2）连接到内部连接头模块（M9）以形成第二流体通路。内部连接头模块（M9）可拆卸地连接到外部连接头模块（M1），使得第一和第二流体路径彼此流体连通以形成环路流体通路。

8. 发明公开

EP3096011A1 LIQUID SUPPLY DEVICE AND LIQUID COOLING SYSTEM 审中-公开
标题翻译： FLÜSSIGKEITSVERSORGUNGSVORRICHTUNGUNDFLÜSSIGKEITSKÜHLUNGSSYSTEM
公开(公告)号：EP3096011A1
公开(公告)日：2016-11-23
申请号：EP16168889.0
申请日：2016-05-10
申请人： Cooler Master Co., Ltd.
发明人： Chen, Hsin-Hung , Liao, Pen-Hung , Huang, Shih-Wei
IPC分类号： F04B23/02 , H01L23/473 , F04B11/00
CPC分类号： F04B53/16 , F04B11/0008 , F04B11/0033 , F04B17/04 , F04B19/22 , F04B23/02 , F04B53/08 , F04B53/14 , F28D15/00 , F28D2021/0028 , F28D2021/0031 , F28F2250/08 , F28F2265/10 , H01L23/473
摘要： A liquid supply device (20, 20', 30, 40) includes a casing (200, 300), a cover (202, 302), a plunger (204, 304) and a driving unit (205, 305, 405). The casing (200, 300) has a liquid outlet (2000, 3000). The cover (202, 302) is connected to the casing (200, 300). A chamber (208, 308) is formed between the casing (200, 300) and the cover (202, 302). The chamber (208, 308) communicates with the liquid outlet (2000, 3000). The plunger (204, 304) is movably disposed in the chamber (208, 308). The driving unit (205, 305, 405) is disposed relative to the plunger (204, 304) and used for driving the plunger (204, 304) to move.
摘要翻译：液体供应装置（20,20'，30,40）包括壳体（200,300），盖子（202,302），柱塞（204,304）和驱动单元（205,305,405）。壳体（200,300）具有液体出口（2000,3000）。盖（202,302）连接到壳体（200,300）。在壳体（200,300）和盖（202,302）之间形成有腔室（208,308）。腔室（208,308）与液体出口（2000,3000）连通。柱塞（204,304）可移动地设置在腔室（208,308）中。驱动单元（205,305,405）相对于柱塞（204,304）设置并用于驱动柱塞（204,304）移动。

9. 发明公开

EP3089210A1 COOLING MODULE, WATER-COOLED COOLING MODULE AND COOLING SYSTEM 审中-公开
标题翻译： KÜHLMODUL，WASSERGEKÜHLTESKÜHLMODULUNDKÜHLSYSTEM
公开(公告)号：EP3089210A1
公开(公告)日：2016-11-02
申请号：EP15201672.1
申请日：2015-12-21
申请人： Cooler Master Co., Ltd.
发明人： SUN, Chien-Hung , LIU, Lei-Lei
IPC分类号： H01L23/427 , H01L23/473
CPC分类号： H01L23/427 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooling module 100 used in conjunction with a heating element 10 includes a vapor chamber 110 and a plurality of cooling fins 200. The vapor chamber 110 is in contact with one side of the heating element 10. The vapor chamber 110 is disposed with a direct conduction area 120 and a vacuum block 130 disposed on two sides of the direct conduction area 120 respectively. Each vacuum block 130 forms a chamber 170. The cooling fins 200 protrude from and are vertically disposed on the direct conduction area 120 and each vacuum block 130, respectively. Thereby, the effects of fast vertical heat transfer to the fin and fast horizontal heat transfer to the distal cooling fins are achieved.
摘要翻译：与加热元件10一起使用的冷却模块100包括蒸气室110和多个冷却翅片200.蒸气室110与加热元件10的一侧接触。蒸气室110直接设置导电区域120和设置在直接导电区域120两侧的真空块130。每个真空块130形成腔室170.冷却翅片200分别从直接传导区域120和每个真空块130突出并垂直设置。由此，实现了快速垂直热传递到翅片的效果，并且实现了对远端散热片的快速水平传热。

10. 发明公开

EP3076525A1 METHOD OF MANUFACTURING ROTOR 审中-公开
标题翻译： VERFAHREN ZUR HERSTELLOW EINES转子
公开(公告)号：EP3076525A1
公开(公告)日：2016-10-05
申请号：EP16151434.4
申请日：2016-01-15
申请人： Cooler Master Co., Ltd.
发明人： Lin, Fu-Lung , Huang, Shih-Wei , Lin, Tsung-Wei
IPC分类号： H02K5/173 , H02K15/14
CPC分类号： H02K15/14 , F16C35/067 , F16C2226/36 , F16C2360/46 , F16C2380/26 , H02K5/1737
摘要： A method of manufacturing a rotor (1, 3, 5) includes steps of providing a rotor casing (10) and a bearing (12), wherein the rotor casing (10) has an axial hole (100); disposing the bearing (12) in the axial hole (100); and using a laser (14) to weld an inner edge (102) of the axial hole (100) and an outer edge (120) of the bearing (12), so as to fix the bearing (12) with the axial hole (100).
摘要翻译：一种制造转子（1,3,5）的方法包括提供转子壳体（10）和轴承（12）的步骤，其中转子壳体（10）具有轴向孔（100）; 将轴承（12）布置在轴向孔（100）中; 以及使用激光器（14）来焊接所述轴向孔（100）的内边缘（102）和所述轴承（12）的外边缘（120），以使所述轴承（12）与所述轴向孔 100）。

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