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    • 1. 发明公开
    • ELECTRONIC SYSTEM AND EXTERNAL AUXILIARY HEAT DISSIPATION DEVICE THEREOF
    • ZUSÄTZLICHEEXTERNEWÄRMEABLEITUNGSVORRICHTUNGDAFÜR的ELEKTRONISCHES系统
    • EP3141980A2
    • 2017-03-15
    • EP16153316.1
    • 2016-01-29
    • Cooler Master Co., Ltd.
    • TSAI, Shui-FaHUANG, Shih-WeiCHEN, Hsin-Hung
    • G06F1/16G06F1/20H05K7/20
    • H05K7/20263G06F1/1632G06F1/20H05K7/20272
    • An external auxiliary heat dissipation device (D) includes an external connection head module (M1), a fluid driving module (M2), a heat dissipation module (M3), and a plurality of first pipes (T1). The external connection head module (M1) includes a first carrier body (1) and at least two first fluid connector (2)s disposed on the first carrier body (1). The first pipes (T1) connect to the first fluid connector (2), the fluid driving module (M2), and the heat dissipation module (M3) to form a first fluid pathway. The electronic system (S) includes an internal connection head module (M9) and a plurality of second pipes (T2). The second pipes (T2) connect to the internal connection head module (M9) to form a second fluid pathway. The internal connection head module (M9) is detachably connected to the external connection head module (M1), so that the first and the second fluid pathways are in fluid communication with each other to form a loop fluid pathway.
    • 外部辅助散热装置(D)包括外部连接头模块(M1),流体驱动模块(M2),散热模块(M3)和多个第一管道(T1)。 外部连接头模块(M1)包括第一载体主体(1)和设置在第一载体主体(1)上的至少两个第一流体连接器(2)。 第一管(T1)连接到第一流体连接器(2),流体驱动模块(M2)和散热模块(M3)以形成第一流体通路。 电子系统(S)包括内部连接头模块(M9)和多个第二管道(T2)。 第二管(T2)连接到内部连接头模块(M9)以形成第二流体通路。 内部连接头模块(M9)可拆卸地连接到外部连接头模块(M1),使得第一和第二流体路径彼此流体连通以形成环路流体通路。
    • 2. 发明公开
    • ELECTRONIC SYSTEM AND EXTERNAL AUXILIARY HEAT DISSIPATION DEVICE THEREOF
    • 电子系统及其外部辅助散热装置
    • EP3141980A3
    • 2017-07-26
    • EP16153316.1
    • 2016-01-29
    • Cooler Master Co., Ltd.
    • TSAI, Shui-FaHUANG, Shih-WeiCHEN, Hsin-Hung
    • G06F1/16G06F1/20H05K7/20
    • H05K7/20263G06F1/1632G06F1/20H05K7/20272
    • An external auxiliary heat dissipation device (D) includes an external connection head module (M1), a fluid driving module (M2), a heat dissipation module (M3), and a plurality of first pipes (T1). The external connection head module (M1) includes a first carrier body (1) and at least two first fluid connector (2)s disposed on the first carrier body (1). The first pipes (T1) connect to the first fluid connector (2), the fluid driving module (M2), and the heat dissipation module (M3) to form a first fluid pathway. The electronic system (S) includes an internal connection head module (M9) and a plurality of second pipes (T2). The second pipes (T2) connect to the internal connection head module (M9) to form a second fluid pathway. The internal connection head module (M9) is detachably connected to the external connection head module (M1), so that the first and the second fluid pathways are in fluid communication with each other to form a loop fluid pathway.
    • 外部辅助散热装置(D)包括外部连接头模块(M1),流体驱动模块(M2),散热模块(M3)以及多个第一管道(T1)。 外部连接头模块(M1)包括第一载体主体(1)和设置在第一载体主体(1)上的至少两个第一流体连接器(2)。 第一管T1连接第一流体连接器2,流体驱动模块M2和散热模块M3以形成第一流体路径。 电子系统(S)包括内部连接头模块(M9)和多个第二管(T2)。 第二管道(T2)连接到内部连接头模块(M9)以形成第二流体路径。 内部连接头模块(M9)可拆卸地连接到外部连接头模块(M1),使得第一和第二流体路径彼此流体连通以形成环路流体路径。