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    • 4. 发明授权
    • Thermosetting quinazolone resins their preparation and their applications
    • 热固性喹唑啉酮树脂的制备及应用
    • US4931541A
    • 1990-06-05
    • US313679
    • 1989-02-22
    • Regis MercierBernard Sillion
    • Regis MercierBernard Sillion
    • C07D239/91C08F38/00C08F138/00C08G73/06
    • C08G73/0694C08F38/00
    • Thermosetting quinazolone resins, their preparation and their applicationsre described.These thermosetting quinazolone resins can be defined as having the following general formula: ##STR1## in which Ar.sup.1 is a bivalent mono- or polycyclic aromatic radical and Ar.sup.2 is a bivalent aromatic radical of several simple aromatic rings bound two by two by atoms or bivalent groups.These Ar.sup.1 and Ar.sup.2 radicals are chosen so that the melting or emollescence temperature is between 80.degree. C. and 170.degree. C.The resins can be prepared from condensation of an ethynylarylbenzoxazinone with an aromatic diamine containing flexibilizing groups.These quinazolone resins can be polymerized in bulk in order to prepare adhesives or composite matrices in particular.
    • 热固性喹唑啉酮树脂及其制备方法及应用。 这些热固性喹唑啉酮树脂可以定义为具有以下通式:其中Ar1是二价单环或多环芳族基团,Ar2是几个由原子或二价基团键合的两个简单芳环的二价芳族基团 。 选择这些Ar1和Ar2基团,使得熔融或发泡温度在80℃和170℃之间。树脂可以由乙炔基芳基苯并恶嗪酮与含有柔性基团的芳族二胺的缩合制备。 这些喹唑啉酮树脂可以大量聚合,以便制备粘合剂或复合基质。
    • 7. 发明授权
    • Polyimide precursor composition and application therefrom
    • 聚酰亚胺前体组合物及其应用
    • US5104968A
    • 1992-04-14
    • US564236
    • 1990-08-08
    • Serge GonzalezPaul MariaggiGuy RabilloudBernard Sillion
    • Serge GonzalezPaul MariaggiGuy RabilloudBernard Sillion
    • C08G73/10C09D5/25H01B3/30
    • C08G73/1003C08G73/1007C08G73/1042H01B3/306Y10T428/31504
    • Polyimide precursor compositions incorporating at least one compound of fula (1), at least one compound of formula (2), at least one compound of formula (3) and at least one compound of formula (4) ##STR1## in which one of the groups R.sup.3 and R.sup.4 represents a hydrogen atom and the other, in the same way as the groups R.sup.1 and R.sup.2, which can be the same or different, in each case represent a hydrocarbon group having 1 to 16 carbon atoms, m is a number between 5 and 20, n is an integer between 1 and 5 and R.sup.5 represents a hydrogen atom, a halogen atom, a hydrocarbon group with 1 to 16 carbon atoms, or a group of formula R.sup.6 --O-- in which R.sup.6 represents a hydrocarbon group having 1 to 16 carbon atoms. The preferred composition contains 30 to 70% by weight of dry matter of compounds of formulas (1), (2) and (3), in which the groups R.sup.1, R.sup.2 and one of the groups R.sup.3 and R.sup.4 is a methyl or ethyl group and the compound of formula (4) is benzyl alcohol. These compositions are usable as smoothing and/or protective coatings for metals, metal alloys or other substrates and in particular in the electrical and electronic industries, e.g. for the formation of dielectric films.
    • 引入至少一种式(1)化合物,至少一种式(2)化合物,至少一种式(3)化合物和至少一种式(4)化合物的聚酰亚胺前体组合物 图像(2)(3)(4)其中R3和R4中的一个代表氢原子,另一个与R1和R2基团相同,可以相同 或者不同,在每种情况下都表示具有1至16个碳原子的烃基,m是5至20之间的数,n是1和5之间的整数,R 5表示氢原子,卤素原子,具有1个 至16个碳原子的基团,或其中R 6表示具有1至16个碳原子的烃基的式R6-O-基团。 优选的组合物包含30至70重量%的式(1),(2)和(3)化合物的干物质,其中基团R 1,R 2和基团R 3和R 4中的一个是甲基或乙基 并且式(4)的化合物是苄醇。 这些组合物可用作金属,金属合金或其它基材的平滑和/或保护涂层,特别是在电气和电子工业中。 用于形成介电膜。