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1. 发明申请

US20050213949A1 Heating configuration for use in thermal processing chambers 有权
公开(公告)号：US20050213949A1
公开(公告)日：2005-09-29
申请号：US11132539
申请日：2005-05-19
申请人： Zion Koren , Conor O'Carroll , Shuen Choy , Paul Timans , Rudy Cardema , James Taoka , Arieh Strod
发明人： Zion Koren , Conor O'Carroll , Shuen Choy , Paul Timans , Rudy Cardema , James Taoka , Arieh Strod
IPC分类号： C23C16/48 , C30B25/10 , C30B31/12 , H01L21/00 , A21B2/00 , F26B19/00
CPC分类号： H01L21/67115 , C23C16/481 , C30B25/105 , C30B31/12
摘要： An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

2. 发明申请

US20070297775A1 Heating Configuration for Use in Thermal Processing Chambers 有权
标题翻译：加热配置用于热处理室
公开(公告)号：US20070297775A1
公开(公告)日：2007-12-27
申请号：US11853414
申请日：2007-09-11
申请人： Zion Koren , Conor O'Carroll , Shuen Choy , Paul Timans , Rudy Santo Cardema , James Taoka , Arieh Strod
发明人： Zion Koren , Conor O'Carroll , Shuen Choy , Paul Timans , Rudy Santo Cardema , James Taoka , Arieh Strod
IPC分类号： F26B3/30
CPC分类号： H01L21/67115 , C23C16/481 , C30B25/105 , C30B31/12
摘要： An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.
摘要翻译：公开了一种用于热处理半导体晶片的设备。该装置包括加热装置，其包含用于将光能发射到晶片上的组装线性灯。线性灯可以放置在各种配置中。根据本发明，用于调节光能源的总体辐照度分布的调谐装置包括在加热装置中。调谐装置可以是例如灯或激光器。

3. 发明授权

US5730803A Apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold body 失效
标题翻译：将热量从热静电卡盘转移到下面的冷体的装置和方法
公开(公告)号：US5730803A
公开(公告)日：1998-03-24
申请号：US605823
申请日：1996-02-23
申请人： Robert Steger , James Taoka , Gregory Shmunis
发明人： Robert Steger , James Taoka , Gregory Shmunis
IPC分类号： C23C16/458 , C23C16/46 , H01L21/00 , H01L21/683 , C23C16/00
CPC分类号： C23C16/463 , C23C16/4586 , C23C16/46 , C23C16/466 , H01L21/67109 , H01L21/6831 , H01L21/6833 , Y10T29/41
摘要： The present invention discloses an apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold plate. Further, the overall structure of the electrostatic chuck in combination with the heat transfer apparatus of the present invention permits the thermal and pressure isolation of the high-temperature, vacuum process chamber containing the work piece processing surface of the electrostatic chuck from the low-temperature, atmospheric pressured heat transfer apparatus of the present invention. In a preferred embodiment of the heat transfer apparatus, the apparatus comprises: an electrostatic chuck body having a buried electrode for high voltage DC and RF electrical input and a buried heating element, whereby the electrostatic chuck can be heated; a controlled heat transfer apparatus, including a heat transfer plate having a first surface in thermal contact with the electrostatic chuck body and a second surface in contact with at least one heat transfer thermal well; a cold body in thermal contact with the at least one heat transfer thermal well; and a thermal grease between the thermal well and the cold body.
摘要翻译：本发明公开了一种用于将热量从热静电吸盘传送到下面的冷板的装置和方法。此外，与本发明的传热装置结合的静电卡盘的整体结构允许将包含静电卡盘的工件处理表面的高温真空处理室的热和压力隔离从低温本发明的大气压力传热装置。在传热装置的优选实施例中，该装置包括：具有用于高压DC和RF电输入的掩埋电极和埋入加热元件的静电卡盘体，由此可以加热静电卡盘; 一种受控传热装置，包括具有与静电吸盘主体热接触的第一表面的传热板和与至少一个传热热井接触的第二表面; 与所述至少一个传热热井热接触的冷体; 以及热井和冷体之间的导热油脂。

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