专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120012963A1 MICRO DEVICE PACKAGING 审中-公开
标题翻译：微型设备包装
公开(公告)号：US20120012963A1
公开(公告)日：2012-01-19
申请号：US13145493
申请日：2009-02-27
申请人： Zhuqing Zhang , Steve P. Hanson , Chien-Hua Chen
发明人： Zhuqing Zhang , Steve P. Hanson , Chien-Hua Chen
IPC分类号： H01L31/0216
CPC分类号： G02B5/284 , B81B2201/0292 , B81B2201/047 , B81C1/00888 , G02B1/11 , H01L2924/16235
摘要： In one embodiment, a method for making an optical micro device package includes: providing a substrate wafer having a plurality of solid state light sensors integrate therein; providing a transparent cover wafer coated with a material that alters the transparency characteristics of the cover wafer; forming a layer of light sensitive, photo definable adhesive material on the substrate wafer; selectively removing part of the layer of adhesive material in a pattern for a plurality of adhesive spacers between the substrate wafer and the cover wafer with each spacer surrounding a corresponding one of the light sensors; bonding the substrate wafer and the cover wafer together at the spacers to form a wafer assembly in which each spacer surrounds and seals a corresponding one of the light sensors within a cavity bounded by a spacer and the two wafers; and singulating individual device packages from the wafer assembly.
摘要翻译：在一个实施例中，一种用于制造光学微器件封装的方法包括：提供具有集成在其中的多个固态光传感器的衬底晶片; 提供涂覆有改变覆盖晶片的透明特性的材料的透明盖晶片; 在衬底晶片上形成一层光敏的可光定义粘合剂材料; 在衬底晶片和覆盖晶片之间的多个粘合剂间隔物的图案中选择性地去除粘合剂材料层的一部分，每个间隔物环绕相应的一个光传感器; 将衬底晶片和覆盖晶片在间隔件处结合在一起以形成晶片组件，其中每个间隔件在由间隔件和两个晶片限定的空腔内围绕并密封相应的一个光传感器; 以及从晶片组件分离单个器件封装。

2. 发明授权

US09446590B2 Diagonal openings in photodefinable glass 有权
标题翻译：可光限定玻璃中的对角开口
公开(公告)号：US09446590B2
公开(公告)日：2016-09-20
申请号：US14421975
申请日：2012-08-16
申请人： Chien-Hua Chen , Silam J. Choy , Brett E. Dahlgren
发明人： Chien-Hua Chen , Silam J. Choy , Brett E. Dahlgren
IPC分类号： B41J2/14 , B41J2/16 , B41J27/20
CPC分类号： B41J2/1433 , B41J2/14145 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1634 , B41J27/20 , B41J2002/14419 , Y10T428/24314
摘要： In one example, a method for making diagonal openings in photodefinable glass includes exposing part of a body of photodefinable glass to a beam of light oriented diagonally to a surface of the body at an angle of 5° or greater measured with respect to a normal to the surface of the body and removing some or all of the part of the body exposed to the light beam to form a diagonal opening in the body.
摘要翻译：在一个实例中，用于在可光限定玻璃中制造斜开口的方法包括将可光限定玻璃体的一部分暴露于相对于正常对准的5°或更大的角度测量的5°或更大的角度对角定向到身体的表面的光束身体的表面并且去除暴露于光束的身体的部分或全部部分以在体内形成对角线开口。

3. 发明授权

US09266326B2 Piezoelectric actuator and method of making a piezoelectric actuator 有权
标题翻译：压电致动器和制造压电致动器的方法
公开(公告)号：US09266326B2
公开(公告)日：2016-02-23
申请号：US14397333
申请日：2012-07-25
申请人： James Elmer Abbott, Jr. , Chien-Hua Chen , Jeffrey R. Pollard
发明人： James Elmer Abbott, Jr. , Chien-Hua Chen , Jeffrey R. Pollard
IPC分类号： B41J2/14 , B41J2/145 , H01L41/053 , H01L41/22 , B41J2/16
CPC分类号： B41J2/14201 , B41J2/145 , B41J2/1618 , B41J2/1623 , B41J2/1642 , B41J2/1646 , H01L41/053 , H01L41/0973 , H01L41/22 , H01L41/313 , Y10T29/42
摘要： In one example, a piezoelectric actuator includes a piezoelectric material, a first conductor on a first part of the piezoelectric material, and a membrane bonded to the first conductor with an adhesive. The first conductor has a root mean square surface roughness of at least 10 nm at the bonding interface with the membrane.
摘要翻译：在一个示例中，压电致动器包括压电材料，压电材料的第一部分上的第一导体和用粘合剂结合到第一导体的膜。第一导体在与膜的结合界面处具有至少10nm的均方根粗糙度。

4. 发明授权

US08864289B2 Drop detection 有权
标题翻译：跌落检测
公开(公告)号：US08864289B2
公开(公告)日：2014-10-21
申请号：US13985393
申请日：2011-03-20
申请人： Alexander Govyadinov , Chien-Hua Chen
发明人： Alexander Govyadinov , Chien-Hua Chen
IPC分类号： B41J2/125 , B41J2/045 , G01V8/16 , G01V8/24 , B41J2/165
CPC分类号： G01V8/24 , B41J2/04558 , B41J2/04561 , B41J2/04586 , B41J2/125 , B41J2/16579 , B41J2/16585 , B41J2/2142 , B41J2/2146 , G01N21/53 , G01V8/16
摘要： A drop detector assembly is provided including an ejection element to eject a fluid drop, a light guide to selectively receive light scattered off of the fluid drop, and a light detector formed in the light guide to detect light received by the light guide.
摘要翻译：提供一种液滴检测器组件，其包括用于喷射液滴的喷射元件，用于选择性地接收从液滴散射的光的光导;以及形成在光导中的光检测器，用于检测光导所接收的光。

5. 发明授权

US08853819B2 Semiconductor structure with passive element network and manufacturing method thereof 有权
标题翻译：无源元网络的半导体结构及其制造方法
公开(公告)号：US08853819B2
公开(公告)日：2014-10-07
申请号：US13338087
申请日：2011-12-27
申请人： Chien-Hua Chen , Teck-Chong Lee , Hsu-Chiang Shih , Meng-Wei Hsieh
发明人： Chien-Hua Chen , Teck-Chong Lee , Hsu-Chiang Shih , Meng-Wei Hsieh
IPC分类号： H01L27/08 , H01L23/498 , H01L49/02 , H01L23/64 , H01L23/522 , H01L23/14 , H01L27/01 , H01L25/065 , H01L21/768 , H01L23/60
CPC分类号： H01L27/016 , H01L21/76898 , H01L23/147 , H01L23/49822 , H01L23/49827 , H01L23/5227 , H01L23/5228 , H01L23/60 , H01L23/64 , H01L25/0657 , H01L28/10 , H01L28/20 , H01L28/40 , H01L2224/16 , H01L2225/06517 , H01L2225/06572 , H01L2924/1461 , H01L2924/00
摘要： The present invention relates to a semiconductor structure having an integrated passive network and a method for making the same. The semiconductor structure includes a substrate which can be an interposer. The substrate can include a plurality of conductive vias. In various embodiments, the substrate includes a dielectric layer disposed thereon, the dielectric layer having an opening forming a straight hole allowing electrical connection between the passive network and the conductive via. The passive network includes a series of patterned dielectric and conductive layers, forming passive electronic components. In an embodiment, the passive device includes a common resistor coupled to a pair of inductors, each of the inductors coupled to a capacitor. In another embodiment, the passive device includes a resistor and an inductor electrically connected to each other, a bottom surface of the inductor coplanar with a bottom surface of the resistor.
摘要翻译：本发明涉及一种具有集成无源网络的半导体结构及其制造方法。半导体结构包括可以是插入件的衬底。衬底可以包括多个导电通孔。在各种实施例中，衬底包括设置在其上的电介质层，电介质层具有形成直孔的开口，允许无源网络和导电通孔之间的电连接。无源网络包括一系列图案化的电介质层和导电层，形成无源电子元件。在一个实施例中，无源器件包括耦合到一对电感器的公共电阻器，每个电感器耦合到电容器。在另一个实施例中，无源器件包括电阻器和电感器，它们彼此电连接，电感器的底表面与电阻器的底表面共面。

6. 发明授权

US08497577B2 Micro electrical mechanical system 有权
标题翻译：微机电系统
公开(公告)号：US08497577B2
公开(公告)日：2013-07-30
申请号：US11870306
申请日：2007-10-10
申请人： Chien-Hua Chen , David M. Craig , Charles C. Haluzak
发明人： Chien-Hua Chen , David M. Craig , Charles C. Haluzak
IPC分类号： H01L23/12
CPC分类号： B81B7/007 , H01L2924/16235
摘要： An apparatus includes a Micro Electrical Mechanical System (MEMS) having electrical contacts and a MEMS device in electrical communication with the electrical contacts. A lid is oriented over the MEMS device and not the electrical contacts. The lid has a base region and a top region, the base region being wider in dimension than the top region and oriented in closer proximity to the MEMS device than the top region.
摘要翻译：一种装置包括具有电触头的微机电系统（MEMS）和与电触头电连通的MEMS装置。盖子定位在MEMS器件上，而不是电触头。盖子具有基部区域和顶部区域，基底区域的尺寸比顶部区域宽，并且被定向成比顶部区域更靠近MEMS装置。

7. 发明授权

US08368173B2 Semiconductor package and method for making the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US08368173B2
公开(公告)日：2013-02-05
申请号：US12795357
申请日：2010-06-07
申请人： Chien-Hua Chen , Teck-Chong Lee
发明人： Chien-Hua Chen , Teck-Chong Lee
IPC分类号： H01L27/08
CPC分类号： H01L28/40 , H01L21/76898 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/48 , H01L25/16 , H01L28/10 , H01L28/60 , H01L2224/48227 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a base material, a first metal layer, a first dielectric layer, a first upper electrode and a first protective layer. The first metal layer is disposed on a first surface of the base material, and includes a first inductor and a first lower electrode. The first dielectric layer is disposed on the first lower electrode. The first upper electrode is disposed on the first dielectric layer, and the first upper electrode, the first dielectric layer and the first lower electrode form a first capacitor. The first protective layer encapsulates the first inductor and the first capacitor. Whereby, the first inductor and the first lower electrode of the first capacitor are disposed on the same layer, so that the thickness of the product is reduced.
摘要翻译：半导体封装及其制造方法技术领域本发明涉及半导体封装及其制造方法。半导体封装包括基底材料，第一金属层，第一介电层，第一上电极和第一保护层。第一金属层设置在基材的第一表面上，并且包括第一电感器和第一下电极。第一介电层设置在第一下电极上。第一上电极设置在第一电介质层上，第一上电极，第一电介质层和第一下电极形成第一电容器。第一保护层封装第一电感器和第一电容器。由此，第一电容器的第一电感器和第一下电极设置在同一层上，从而减小了产品的厚度。

8. 发明授权

US08336981B2 Determining a healthy fluid ejection nozzle 有权
标题翻译：确定健康的液体喷嘴
公开(公告)号：US08336981B2
公开(公告)日：2012-12-25
申请号：US12575943
申请日：2009-10-08
申请人： Chien-Hua Chen , Donald W. Schulte , Terry Mcmahon , Ying-Chih Liao , David D. Hall
发明人： Chien-Hua Chen , Donald W. Schulte , Terry Mcmahon , Ying-Chih Liao , David D. Hall
IPC分类号： B41J29/38
CPC分类号： B41J2/14153 , B41J2002/14354 , Y10T29/49401
摘要： A method of determining a healthy fluid ejection nozzle includes measuring changes in impedance across the nozzle as fluid passes through it. A printhead includes a metal probe that intersects an ink nozzle and an integrated circuit to sense a change in impedance across the nozzle through the metal probe.
摘要翻译：确定健康的流体喷射喷嘴的方法包括测量流体穿过喷嘴时的阻抗的变化。打印头包括与墨水喷嘴相交的金属探针和集成电路，用于感测通过金属探针穿过喷嘴的阻抗变化。

9. 发明授权

US08039205B2 Fluidic MEMS device 有权
标题翻译：流体MEMS器件
公开(公告)号：US08039205B2
公开(公告)日：2011-10-18
申请号：US11948891
申请日：2007-11-30
申请人： Chien-Hua Chen , Xia feng Yang
发明人： Chien-Hua Chen , Xia feng Yang
IPC分类号： G03F7/20
CPC分类号： F04B43/046 , B01D57/02 , B01D61/18 , B01D63/081 , B01D63/088 , B01D67/003 , B01D2323/30 , B01D2323/50 , B01D2325/08 , B01J19/0093 , B01J2219/00783 , B01J2219/0081 , B01J2219/00833 , B01J2219/00853 , B01J2219/00873 , B01J2219/00891 , B01J2219/00909 , B01J2219/00912 , B01J2219/00943 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L3/502753 , B01L7/525 , B01L2200/027 , B01L2200/10 , B01L2200/12 , B01L2300/0654 , B01L2300/0681 , B01L2300/1827 , B01L2400/0415 , B01L2400/0439 , B01L2400/0442 , B01L2400/0638 , B81B2201/058 , B81C1/00119 , F04B19/24 , G01N21/05 , G01N2021/0346 , Y10T436/11 , Y10T436/117497 , Y10T436/118339 , Y10T436/25 , Y10T436/25375 , Y10T436/2575
摘要： A method includes depositing a sacrificial material on a substrate, and depositing a polymer layer on the substrate and the sacrificial material. The method further includes removing the sacrificial material to at least partially define boundaries of at least one fluidic channel of a fluidic micro electromechanical system (MEM) device, the at least one fluidic channel is at least partially defined by a portion of the polymer layer and a portion of the substrate.
摘要翻译：一种方法包括将牺牲材料沉积在基底上，以及在基底和牺牲材料上沉积聚合物层。该方法还包括去除牺牲材料以至少部分地限定流体微机电系统（MEM）装置的至少一个流体通道的边界，所述至少一个流体通道至少部分地由聚合物层的一部分限定，衬底的一部分。

10. 发明授权

US07866364B2 Fabrication tool for bonding 有权
标题翻译：用于粘接的加工工具
公开(公告)号：US07866364B2
公开(公告)日：2011-01-11
申请号：US11413333
申请日：2006-04-28
申请人： Chien-Hua Chen , Troy D. Schwinabart , William M. Atkinson
发明人： Chien-Hua Chen , Troy D. Schwinabart , William M. Atkinson
IPC分类号： G02B6/00
CPC分类号： H01L21/67092
摘要： A fabrication tool presses a first device surface against a second device surface after the first and the second device surfaces have been plasma activated, to bond the first device surface with the second device surface. The fabrication tool includes a bonding piston to exert force on the first device surface to press the first device surface against the second device surface. The fabrication tool also includes a pressure plate situated between the bonding piston and the first device surface. The fabrication tool further includes a mechanism to ensure that the force exerted by the bonding piston on the first device surface via the pressure plate is initially exerted at one or more first locations on the first device surface and subsequently exerted at one or more second locations on the first device surface.
摘要翻译：在第一和第二装置表面已被等离子体激活之后，制造工具将第一装置表面压靠第二装置表面，以将第一装置表面与第二装置表面结合。制造工具包括粘合活塞，以在第一装置表面施加力以将第一装置表面压靠第二装置表面。制造工具还包括位于接合活塞和第一装置表面之间的压力板。制造工具还包括机构，以确保由第一装置表面经由压板施加的结合活塞的力最初施加在第一装置表面上的一个或多个第一位置上，随后在一个或多个第二位置上施加第一个设备表面。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式