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1. 发明授权

US08703545B2 Aluminum alloy lead-frame and its use in fabrication of power semiconductor package 有权
标题翻译：铝合金引线框架及其在功率半导体封装的制造中的应用
公开(公告)号：US08703545B2
公开(公告)日：2014-04-22
申请号：US13408185
申请日：2012-02-29
申请人： Zhiqiang Niu , Ming-Chen Lu , Yan Xun Xue , Yan Huo , Hua Pan , Guo Feng Lian , Jun Lu
发明人： Zhiqiang Niu , Ming-Chen Lu , Yan Xun Xue , Yan Huo , Hua Pan , Guo Feng Lian , Jun Lu
IPC分类号： H01L21/56 , H01L23/495
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L24/73 , H01L2224/0603 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49111 , H01L2224/73265 , H01L2924/13091 , H01L2924/15724 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor package is provided with an Aluminum alloy lead-frame without noble metal plated on the Aluminum base lead-frame. Aluminum alloy material with proper alloy composition and ratio for making an aluminum alloy lead-frame is provided. The aluminum alloy lead-frame is electroplated with a first metal electroplating layer, a second electroplating layer and a third electroplating layer in a sequence. The lead-frame electroplated with the first, second and third metal electroplating layers is then used in the fabrication process of a power semiconductor package including chip connecting, wire bonding, and plastic molding. After the molding process, the area of the lead-frame not covered by the molding compound is electroplated with a fourth metal electroplating layer that is not easy to be oxidized when exposing to air.
摘要翻译：半导体封装设置有没有贵金属的铝合金引线框架，镀在铝基底引线框架上。提供具有适当的合金组成和制造铝合金引线框架的比例的铝合金材料。铝合金引线框架依次电镀有第一金属电镀层，第二电镀层和第三电镀层。然后，利用第一，第二和第三金属电镀层电镀的引线框架用于包括芯片连接，引线接合和塑性模制的功率半导体封装的制造过程中。在模制过程之后，未被模塑料覆盖的引线框架的区域用暴露于空气中不容易氧化的第四金属电镀层电镀。

2. 发明申请

US20130221507A1 ALUMINUM ALLOY LEAD-FRAME AND ITS USE IN FABRICATION OF POWER SEMICONDUCTOR PACKAGE 有权
标题翻译：铝合金导线框架及其在功率半导体封装制造中的应用
公开(公告)号：US20130221507A1
公开(公告)日：2013-08-29
申请号：US13408185
申请日：2012-02-29
申请人： Zhiqiang Niu , Ming-Chen Lu , Yan Xun Xue , Yan Huo , Hua Pan , Guo Feng Lian , Jun Lu
发明人： Zhiqiang Niu , Ming-Chen Lu , Yan Xun Xue , Yan Huo , Hua Pan , Guo Feng Lian , Jun Lu
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L24/73 , H01L2224/0603 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49111 , H01L2224/73265 , H01L2924/13091 , H01L2924/15724 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor package is provided with an Aluminum alloy lead-frame without noble metal plated on the Aluminum base lead-frame. Aluminum alloy material with proper alloy composition and ratio for making an aluminum alloy lead-frame is provided. The aluminum alloy lead-frame is electroplated with a first metal electroplating layer, a second electroplating layer and a third electroplating layer in a sequence. The lead-frame electroplated with the first, second and third metal electroplating layers is then used in the fabrication process of a power semiconductor package including chip connecting, wire bonding, and plastic molding. After the molding process, the area of the lead-frame not covered by the molding compound is electroplated with a fourth metal electroplating layer that is not easy to be oxidized when exposing to air.
摘要翻译：半导体封装设置有没有贵金属的铝合金引线框架，镀在铝基底引线框架上。提供具有适当的合金组成和制造铝合金引线框架的比例的铝合金材料。铝合金引线框架依次电镀有第一金属电镀层，第二电镀层和第三电镀层。然后，利用第一，第二和第三金属电镀层电镀的引线框架用于包括芯片连接，引线接合和塑性模制的功率半导体封装的制造过程中。在模制过程之后，未被模塑料覆盖的引线框架的区域用暴露于空气中不容易氧化的第四金属电镀层电镀。

3. 发明申请

US20140361420A1 HYBRID PACKAGING MULTI-CHIP SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF 有权
标题翻译：混合包装多芯片半导体器件及其制备方法
公开(公告)号：US20140361420A1
公开(公告)日：2014-12-11
申请号：US13913770
申请日：2013-06-10
申请人： Hamza Yilmaz , Yan Xun Xue , Jun Lu , Peter Wilson , Yan Huo , Zhiqiang Niu , Ming-Chen Lu
发明人： Hamza Yilmaz , Yan Xun Xue , Jun Lu , Peter Wilson , Yan Huo , Zhiqiang Niu , Ming-Chen Lu
IPC分类号： H01L23/495
CPC分类号： H01L23/49568 , H01L21/4825 , H01L21/561 , H01L21/565 , H01L21/768 , H01L21/78 , H01L23/3107 , H01L23/3114 , H01L23/49503 , H01L23/4952 , H01L23/49524 , H01L23/49537 , H01L23/49541 , H01L23/49555 , H01L23/49562 , H01L23/49575 , H01L23/544 , H01L24/40 , H01L24/41 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L2223/5446 , H01L2224/0401 , H01L2224/04026 , H01L2224/06181 , H01L2224/32245 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/40245 , H01L2224/4103 , H01L2224/48091 , H01L2224/48465 , H01L2224/73104 , H01L2224/73221 , H01L2224/83801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/94 , H01L2924/00014 , H01L2924/13091 , H01L2924/181 , H01L2224/11 , H01L2224/03 , H01L2224/27 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A hybrid packaging multi-chip semiconductor device comprises a lead frame unit, a first semiconductor chip, a second semiconductor chip, a first interconnecting structure and a second interconnecting structure, wherein the first semiconductor chip is attached on a first die paddle and the second semiconductor chip is flipped and attached on a third pin and a second die paddle, the first interconnecting structure electrically connecting a first electrode at a front surface of the first semiconductor chip and a third electrode at a back surface of the second semiconductor chip and a second electrode at the front surface of the first semiconductor chip is electrically connected by second interconnecting structure.
摘要翻译：一种混合封装多芯片半导体器件，包括引线框单元，第一半导体芯片，第二半导体芯片，第一互连结构和第二互连结构，其中第一半导体芯片附接在第一裸片上，第二半导体芯片被翻转并附接在第三引脚和第二管芯焊盘上，第一互连结构电连接第一半导体芯片的前表面处的第一电极和第二半导体芯片的后表面处的第三电极和第二电极在第一半导体芯片的前表面通过第二互连结构电连接。

4. 发明授权

US09054091B2 Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures 有权
标题翻译：具有多个半导体芯片和多个互连结构的混合封装引线框架多芯片半导体器件
公开(公告)号：US09054091B2
公开(公告)日：2015-06-09
申请号：US13913770
申请日：2013-06-10
申请人： Hamza Yilmaz , Yan Xun Xue , Jun Lu , Peter Wilson , Yan Huo , Zhiqiang Niu , Ming-Chen Lu
发明人： Hamza Yilmaz , Yan Xun Xue , Jun Lu , Peter Wilson , Yan Huo , Zhiqiang Niu , Ming-Chen Lu
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L23/02 , H01L23/34 , H01L23/00 , H01L23/31 , H01L21/56
CPC分类号： H01L23/49568 , H01L21/4825 , H01L21/561 , H01L21/565 , H01L21/768 , H01L21/78 , H01L23/3107 , H01L23/3114 , H01L23/49503 , H01L23/4952 , H01L23/49524 , H01L23/49537 , H01L23/49541 , H01L23/49555 , H01L23/49562 , H01L23/49575 , H01L23/544 , H01L24/40 , H01L24/41 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L2223/5446 , H01L2224/0401 , H01L2224/04026 , H01L2224/06181 , H01L2224/32245 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/40245 , H01L2224/4103 , H01L2224/48091 , H01L2224/48465 , H01L2224/73104 , H01L2224/73221 , H01L2224/83801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/94 , H01L2924/00014 , H01L2924/13091 , H01L2924/181 , H01L2224/11 , H01L2224/03 , H01L2224/27 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A hybrid packaging multi-chip semiconductor device comprises a lead frame unit, a first semiconductor chip, a second semiconductor chip, a first interconnecting structure and a second interconnecting structure, wherein the first semiconductor chip is attached on a first die paddle and the second semiconductor chip is flipped and attached on a third pin and a second die paddle, the first interconnecting structure electrically connecting a first electrode at a front surface of the first semiconductor chip and a third electrode at a back surface of the second semiconductor chip and a second electrode at the front surface of the first semiconductor chip is electrically connected by second interconnecting structure.
摘要翻译：一种混合封装多芯片半导体器件，包括引线框单元，第一半导体芯片，第二半导体芯片，第一互连结构和第二互连结构，其中第一半导体芯片附接在第一裸片上，第二半导体芯片被翻转并附接在第三引脚和第二管芯焊盘上，第一互连结构电连接第一半导体芯片的前表面处的第一电极和第二半导体芯片的后表面处的第三电极和第二电极在第一半导体芯片的前表面通过第二互连结构电连接。

5. 发明授权

US09087828B2 Semiconductor device with thick bottom metal and preparation method thereof 有权
标题翻译：具有厚底金属的半导体器件及其制备方法
公开(公告)号：US09087828B2
公开(公告)日：2015-07-21
申请号：US13797440
申请日：2013-03-12
申请人： Hamza Yilmaz , Yan Xun Xue , Jun Lu , Ming-Chen Lu , Yan Huo , Aihua Lu
发明人： Hamza Yilmaz , Yan Xun Xue , Jun Lu , Ming-Chen Lu , Yan Huo , Aihua Lu
IPC分类号： H01L21/44 , H01L21/48 , H01L23/495 , H01L21/58 , H01L23/00 , H01L23/433 , H01L23/492
CPC分类号： H01L23/49503 , H01L21/561 , H01L21/566 , H01L21/6836 , H01L23/3121 , H01L23/3185 , H01L23/4334 , H01L23/492 , H01L23/49541 , H01L23/49568 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/97 , H01L2224/0401 , H01L2224/04026 , H01L2224/056 , H01L2224/05644 , H01L2224/1184 , H01L2224/1191 , H01L2224/13022 , H01L2224/13111 , H01L2224/13147 , H01L2224/2919 , H01L2224/32245 , H01L2224/73253 , H01L2224/94 , H01L2224/97 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/00 , H01L2924/014 , H01L2924/00014 , H01L2224/11 , H01L2224/83 , H01L2224/03
摘要： A semiconductor device with thick bottom metal comprises a semiconductor chip covered with a top plastic package layer at its front surface and a back metal layer at its back surface, the top plastic package layer surrounds sidewalls of the metal bumps with a top surface of the metal bumps exposing from the top plastic package layer, a die paddle for the semiconductor chip to mount thereon and a plastic package body.
摘要翻译：具有厚底部金属的半导体器件包括在其前表面覆盖有顶部塑料封装层的半导体芯片和在其后表面处的背面金属层，顶部塑料封装层围绕金属凸块的侧壁与金属的顶表面从顶部塑料封装层暴露的凸起，用于半导体芯片的芯片安装在其上以及塑料封装主体。

6. 发明申请

US20140264802A1 Semiconductor Device with Thick Bottom Metal and Preparation Method Thereof 有权
标题翻译：具有厚底金属的半导体器件及其制备方法
公开(公告)号：US20140264802A1
公开(公告)日：2014-09-18
申请号：US13797440
申请日：2013-03-12
申请人： Hamza Yilmaz , Yan Xun Xue , Jun Lu , Ming-Chen Lu , Yan Huo , Aihua Lu
发明人： Hamza Yilmaz , Yan Xun Xue , Jun Lu , Ming-Chen Lu , Yan Huo , Aihua Lu
IPC分类号： H01L23/495 , H01L21/58
CPC分类号： H01L23/49503 , H01L21/561 , H01L21/566 , H01L21/6836 , H01L23/3121 , H01L23/3185 , H01L23/4334 , H01L23/492 , H01L23/49541 , H01L23/49568 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/97 , H01L2224/0401 , H01L2224/04026 , H01L2224/056 , H01L2224/05644 , H01L2224/1184 , H01L2224/1191 , H01L2224/13022 , H01L2224/13111 , H01L2224/13147 , H01L2224/2919 , H01L2224/32245 , H01L2224/73253 , H01L2224/94 , H01L2224/97 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/00 , H01L2924/014 , H01L2924/00014 , H01L2224/11 , H01L2224/83 , H01L2224/03
摘要： A semiconductor device with thick bottom metal comprises a semiconductor chip covered with a top plastic package layer at its front surface and a back metal layer at its back surface, the top plastic package layer surrounds sidewalls of the metal bumps with a top surface of the metal bumps exposing from the top plastic package layer, a die paddle for the semiconductor chip to mount thereon and a plastic package body.
摘要翻译：具有厚底部金属的半导体器件包括在其前表面覆盖有顶部塑料封装层的半导体芯片和在其后表面处的背面金属层，顶部塑料封装层围绕金属凸块的侧壁与金属的顶表面从顶部塑料封装层暴露的凸起，用于半导体芯片的芯片安装在其上以及塑料封装主体。

7. 发明授权

US08259819B2 Method and apparatus for improving video quality by utilizing a unified loop filter 有权
标题翻译：利用统一的环路滤波器提高视频质量的方法和装置
公开(公告)号：US08259819B2
公开(公告)日：2012-09-04
申请号：US12635383
申请日：2009-12-10
申请人： Yu Liu , Yan Huo , Ka Man Cheng
发明人： Yu Liu , Yan Huo , Ka Man Cheng
IPC分类号： H04N11/02
CPC分类号： G06T5/20 , H04N19/117 , H04N19/147 , H04N19/196 , H04N19/463 , H04N19/82
摘要： The present invention relates to method and apparatus for improving video quality. The present invention provides a unified loop filter including: a pixel determining unit which determines the type of a pixel based on boundary strength; a similarity transforming unit which transforms a nonlinear filter into a nonlinear similarity-ordered statistics filter; and an integrating unit which integrates the nonlinear similarity-ordered statistics filter with a linear image filtering portion. The unified loop filter is applicable to filter reconstructed frames when an encoder or a decoder is processing a video signal.
摘要翻译：本发明涉及用于提高视频质量的方法和装置。本发明提供一种统一的环路滤波器，包括：像素确定单元，其基于边界强度确定像素的类型; 相似度变换单元，其将非线性滤波器变换为非线性相似性排序统计滤波器; 以及将非线性相似性排序统计滤波器与线性图像滤波部分进行积分的积分单元。统一环路滤波器适用于在编码器或解码器处理视频信号时对重构帧进行滤波。

8. 发明授权

US08165211B2 Method and apparatus of de-interlacing video 有权
标题翻译：去隔行视频的方法和装置
公开(公告)号：US08165211B2
公开(公告)日：2012-04-24
申请号：US12129891
申请日：2008-05-30
申请人： King Ngi Ngan , Jie Dong , Yan Huo
发明人： King Ngi Ngan , Jie Dong , Yan Huo
IPC分类号： H04N7/12
CPC分类号： H04N19/61 , H04N7/012 , H04N7/014 , H04N7/0142 , H04N19/80
摘要： The presently claimed invention adaptively selects a local de-interlacing method according to information from a compressed video bitstream. According to one embodiment, successive images from a video bitstream are first reconstructed. Syntax elements, selected from a macroblock type, a macroblock partition, a motion vector, a distance from a reference frame, the existence of non-zero transform coefficients and the distribution of transform coefficients, are then extracted from this bitstream. Based on the syntax elements, a de-interlacing algorithm is decided from an algorithm set for each image region in a video frame. Algorithms in the algorithm set include motion compensation, edge-based line averaging, and line averaging. Each image region is thereby interpolated using the de-interlacing algorithm and complementary motion compensation. The complementary motion compensation de-interlaces the image region using an inverse of motion vectors extracted from a bitstream clip representing neighboring frames.
摘要翻译：目前要求保护的发明根据来自压缩视频比特流的信息自适应地选择局部去隔行方法。根据一个实施例，首先重构来自视频位流的连续图像。然后从该比特流中提取从宏块类型，宏块分区，运动矢量，距参考帧的距离，非零变换系数的存在和变换系数的分布中选出的语法元素。基于语法元素，从针对视频帧中的每个图像区域的算法确定去隔行算法。算法集中的算法包括运动补偿，基于边缘的线平均和线平均。因此，使用去隔行算法和互补运动补偿来内插每个图像区域。补充运动补偿使用从表示相邻帧的比特流片段提取的运动矢量的倒数来去交织图像区域。

9. 发明申请

US20140003741A1 SCALE CHANGING DETECTION AND SCALING RATIO DETERMINATION BY USING MOTION INFORMATION 有权
标题翻译：使用运动信息进行尺度变化检测和缩放比例测定
公开(公告)号：US20140003741A1
公开(公告)日：2014-01-02
申请号：US13537086
申请日：2012-06-29
申请人： Chunhui Cui , Chun-Fu Chen , Ciao-Siang Siao , Gwo Giun LEE , Yan Huo
发明人： Chunhui Cui , Chun-Fu Chen , Ciao-Siang Siao , Gwo Giun LEE , Yan Huo
IPC分类号： G06K9/32
CPC分类号： G06T7/0024 , G06K9/50 , G06K2009/3291 , G06T7/30 , G06T2207/10016 , G06T2207/30236
摘要： This invention discloses a method for determining an area scaling ratio of an object in a video image sequence. In one embodiment, a centroid of the object is determined. One or more directed straight lines are selected, each passing through the centroid, extending from an end of the object's boundary to an opposite end thereof, and having a direction that is upward. A length scaling ratio for each directed straight line is determined by: determining a motion vector for each selected pixel on the line; computing a scalar component of the motion vector projected onto the line; estimating a change of the line's length according to the scalar components obtained for all pixels; and determining the length scaling ratio according to the change of the line's length. The area scaling ratio is computed based on the length scaling ratios for all directed straight lines.
摘要翻译：本发明公开了一种用于确定视频图像序列中的对象的区域缩放比率的方法。在一个实施例中，确定对象的质心。选择一个或多个指向的直线，每个直线通过质心，从物体边界的一端延伸到其相对端，并具有向上的方向。每个指向直线的长度缩放比例由下式确定：确定线上每个所选像素的运动矢量; 计算投影到线上的运动矢量的标量分量; 根据为所有像素获得的标量分量来估计行长度的变化; 并根据线长度的变化来确定长度缩放比例。基于所有指向直线的长度缩放比率来计算面积缩放比例。

10. 发明申请

US20110142136A1 METHOD AND APPARATUS FOR IMPROVING VIDEO QUALITY 有权
标题翻译：改善视频质量的方法和装置
公开(公告)号：US20110142136A1
公开(公告)日：2011-06-16
申请号：US12635383
申请日：2009-12-10
申请人： Yu Liu , Yan Huo , Ka Man Cheng
发明人： Yu Liu , Yan Huo , Ka Man Cheng
IPC分类号： H04B1/66 , G06K9/40
CPC分类号： G06T5/20 , H04N19/117 , H04N19/147 , H04N19/196 , H04N19/463 , H04N19/82
摘要： The present invention relates to method and apparatus for improving video quality. The present invention provides a unified loop filter including: a pixel determining unit which determines the type of a pixel based on boundary strength; a similarity transforming unit which transforms a nonlinear filter into a nonlinear similarity-ordered statistics filter; and an integrating unit which integrates the nonlinear similarity-ordered statistics filter with a linear image filtering portion. The unified loop filter is applicable to filter reconstructed frames when an encoder or a decoder is processing a video signal.
摘要翻译：本发明涉及用于提高视频质量的方法和装置。本发明提供一种统一的环路滤波器，包括：像素确定单元，其基于边界强度确定像素的类型; 相似度变换单元，其将非线性滤波器变换为非线性相似性排序统计滤波器; 以及将非线性相似性排序统计滤波器与线性图像滤波部分进行积分的积分单元。统一环路滤波器适用于在编码器或解码器处理视频信号时对重构帧进行滤波。

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