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1. 发明授权

US07744257B2 Heat dissipation device for LED lamp 失效
标题翻译： LED灯具散热装置
公开(公告)号：US07744257B2
公开(公告)日：2010-06-29
申请号：US12024961
申请日：2008-02-01
申请人： Zhi-Yong Zhou , Guang Yu , Qiao-Li Ding
发明人： Zhi-Yong Zhou , Guang Yu , Qiao-Li Ding
IPC分类号： F21V29/00 , F28D15/02
CPC分类号： F21V29/763 , F21K9/00 , F21V29/51 , F21V29/75 , F21Y2105/10 , F21Y2115/10 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device adapted for removing heat from LED modules of an LED lamp includes a plurality of heat sinks, a plurality of fin sets and a plurality of heat pipes extending through the fin sets and thermally connecting the heat sinks and the fin sets together. The heat sinks each have a base plate with a bottom surface which is kept in contact with corresponding LED modules and a plurality of fins arranged on a top surface of the base plate. Each of the fin sets consists of a plurality of flakes and defines a plurality of air passages between the flakes. Air can flow through the heat dissipation device from a place thereunder to a place thereabove via the air passages between the flakes of the fin sets.
摘要翻译：适用于从LED灯的LED模块去除热量的散热装置包括多个散热片，多个散热片组和多个热管，其延伸穿过翅片组并将散热片和散热片组热连接在一起。散热片各自具有底板，底板与相应的LED模块保持接触，并且布置在基板的顶表面上的多个散热片。每个翅片组由多个薄片组成并且在薄片之间限定多个空气通道。空气可以通过散热装置的片之间的空气通道从散热装置从其下方的一个地方流过上方。

2. 发明授权

US07810950B2 LED lamp having a vapor chamber for dissipating heat generated by LEDS of the LED lamp 失效
标题翻译： LED灯具有用于散发LED灯的LEDS产生的热量的蒸气室
公开(公告)号：US07810950B2
公开(公告)日：2010-10-12
申请号：US12131111
申请日：2008-06-01
申请人： Zhi-Yong Zhou , Qiao-Li Ding
发明人： Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： F21S4/00 , F21V21/00
CPC分类号： F21V29/004 , F21K9/00 , F21V29/51 , F21V29/763 , F21Y2115/10
摘要： A heat dissipation device includes a heat conductive member, a fin unit coupled to a bottom surface of the heat conductive member and a plurality of LED modules attached to a top surface of the heat conductive member. The heat conductive member consists of a first plate, a second plate parallel to the first plate and a plurality of posts sandwiched between the first and second plates. Peripheries of the first and second plate are in a hermetical conjunction with each other to form a chamber containing a phase-changeable working fluid therein. The first and second plates therein define a plurality of through orifices. The posts each define therein a screwed orifice which is in alignment with corresponding through orifices of the first and second plates respectively and threadedly receives a screw extending through the LED module.
摘要翻译：散热装置包括导热构件，耦合到导热构件的底表面的翅片单元和附接到导热构件的顶表面的多个LED模块。导热构件包括第一板，平行于第一板的第二板和夹在第一板和第二板之间的多个柱。第一和第二板的周边彼此密封结合以形成其中包含相变工作流体的室。其中的第一和第二板限定多个通孔。所述柱分别在其中限定有螺纹孔口，所述螺纹孔口分别对应于所述第一和第二板的对应的通孔，并且螺纹地容纳延伸穿过所述LED模块的螺钉。

3. 发明授权

US07694721B2 Miniature liquid cooling device having an integral pump 失效
标题翻译：具有整体泵的微型液体冷却装置
公开(公告)号：US07694721B2
公开(公告)日：2010-04-13
申请号：US11309612
申请日：2006-08-31
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/473 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).
摘要翻译：微型液体冷却装置包括壳体（10），其具有附接在发热电子部件上的基部（16），用于吸收由电子部件产生的热量。壳体包括安装在基座上的外壁（12）和安装在外壁上的顶盖（15）。收容空间由外壳封闭。吸热构件（40）安装在基座上并被容纳在容纳空间中以与壳体内的液体进行热交换。叶轮（21）可旋转地安装在容纳空间中并且在吸热构件上方。当叶轮旋转时，驱动液体经由液体入口（122）流入液体冷却装置，然后流过吸热构件，并最终经由液体出口（124）从液体冷却装置流出。

4. 发明申请

US20100014966A1 FASTENING DEVICE FOR FANS 失效
标题翻译：风扇装置
公开(公告)号：US20100014966A1
公开(公告)日：2010-01-21
申请号：US12241066
申请日：2008-09-30
申请人： Zhi-Yong Zhou , Qiao-Li Ding , Hai-Bing Cao
发明人： Zhi-Yong Zhou , Qiao-Li Ding , Hai-Bing Cao
IPC分类号： F04D29/64 , F16B21/08
CPC分类号： F04D29/64 , Y10T24/42
摘要： A fastening device is used for connecting a first and a second fan together. The two fans each have an upper flange and a lower flange and a cylindrical body interconnecting the upper flange and the lower flange. The fastening device includes a plate-shaped pad and two resilient portions respectively extending perpendicularly from two opposite sides of the pad. The two resilient portions respectively extend through the lower flange of the first fan and the upper flange of the second fan, pressing against the first fan and the second fan toward each other. The pad is sandwiched between the lower flange of the first fan and the upper flange of the second fan.
摘要翻译：紧固装置用于将第一和第二风扇连接在一起。两个风扇各自具有上凸缘和下凸缘以及连接上凸缘和下凸缘的圆柱体。紧固装置包括板形垫和分别从垫的两个相对侧垂直延伸的两个弹性部分。两个弹性部分分别延伸穿过第一风扇的下凸缘和第二风扇的上凸缘，将第一风扇和第二风扇朝向彼此压靠。垫片夹在第一风扇的下凸缘和第二风扇的上凸缘之间。

5. 发明授权

US07447029B2 Vapor chamber for dissipation heat generated by electronic component 失效
标题翻译：用于电子部件产生的散热的蒸气室
公开(公告)号：US07447029B2
公开(公告)日：2008-11-04
申请号：US11308231
申请日：2006-03-14
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A vapor chamber includes a base (100) for contacting a heat-generating component (500), a cover (200), a first porous capillary sheet (300) located in the base and a second porous capillary sheet (400) located in the cover and facing the first porous capillary sheet. The base comprises a block (130) extending from the base to thermally connect with the cover. The cover is mounted on the base and forms a hermetically sealed container together with the base. The first and second porous capillary sheets together form an enclosure and are contained in the container, and the block extends through the first and second porous capillary sheets and engage therewith.
摘要翻译：蒸气室包括用于接触发热部件（500），盖（200），位于基座中的第一多孔毛细管板（300）和位于所述第二多孔毛细管板（400）中的基座（100）覆盖并面向第一多孔毛细管片。基座包括从基座延伸以与盖子热连接的块体（130）。盖子安装在基座上，与基座一起形成一个密封的容器。第一和第二多孔毛细管片一起形成外壳并容纳在容器中，并且块延伸穿过第一和第二多孔毛细管片并与其接合。

6. 发明申请

US20080053641A1 MINIATURE LIQUID COOLING DEVICE HAVING AN INTEGRAL PUMP 失效
标题翻译：具有整体泵的微型液体冷却装置
公开(公告)号：US20080053641A1
公开(公告)日：2008-03-06
申请号：US11309612
申请日：2006-08-31
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： B29C47/88 , F24H3/02
CPC分类号： H01L23/473 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).
摘要翻译：微型液体冷却装置包括壳体（10），其具有附接在发热电子部件上的基部（16），用于吸收由电子部件产生的热量。壳体包括安装在基座上的外壁（12）和安装在外壁上的顶盖（15）。收容空间由外壳封闭。吸热构件（40）安装在基座上并被容纳在容纳空间中以与壳体内的液体进行热交换。叶轮（21）可旋转地安装在容纳空间中并且在吸热构件上方。当叶轮旋转时，驱动液体经由液体入口（122）流入液体冷却装置，然后流过吸热构件，并最终经由液体出口（124）从液体冷却装置流出。

7. 发明申请

US20070165380A1 MEMORY MODULE ASSEMBLY INCLUDING A CLIP FOR MOUNTING A HEAT SINK THEREON 审中-公开
标题翻译：存储模块组件，其中包括用于安装散热片的夹子
公开(公告)号：US20070165380A1
公开(公告)日：2007-07-19
申请号：US11306896
申请日：2006-01-16
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly (1) includes a printed circuit board (30) having an electronic heat-generating component (40) thereon, a heat sink (20) and a clip (10) for securing the heat sink onto the heat-generating component mounted on the printed circuit board. The heat sink includes a base (22) and a plurality of fins (24) arranged on the base. A recess (28) is defined extending across the fins. The clip includes a retaining portion (12) resting against a face of the printed circuit board opposite the heat sink and an elastic pressing portion (16) spaced from the retaining portion. The pressing portion is received in the recess of the heat sink and resiliently presses the base of the heat sink toward the heat-generating component, whereby the clip clamps the heat sink and the printed circuit board therebetween.
摘要翻译：存储模块组件（1）包括其上具有电子发热部件（40）的印刷电路板（30），散热器（20）和夹子（10），用于将散热器固定到发热部件安装在印刷电路板上。散热器包括基座（22）和布置在基座上的多个翅片（24）。限定延伸穿过翅片的凹部（28）。夹子包括一个保持部分（12），该保持部分靠在与散热器相对的印刷电路板的表面上，以及与保持部分间隔的弹性按压部分（16）。按压部分被容纳在散热器的凹部中，并将散热片的基座弹性地压向发热部件，由此夹子将散热片和印刷电路板夹在其间。

8. 发明授权

US08377214B2 Vapor chamber and method for manufacturing the same 失效
标题翻译：蒸气室及其制造方法
公开(公告)号：US08377214B2
公开(公告)日：2013-02-19
申请号：US12534880
申请日：2009-08-04
申请人： Sheng-Chao Zhang , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Sheng-Chao Zhang , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： C23C16/00
CPC分类号： F28D15/0233 , F28D15/046 , F28F2225/04 , F28F2240/00 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , Y10T29/49888 , H01L2924/00
摘要： A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a supporting plate received in the casing and a plurality of supporting posts. The supporting plate defines a plurality of fixing holes therein. The supporting posts are engagingly received in the fixing holes of the supporting plate. Top and bottom ends of the supporting posts engage with the wick structure to reinforce a structure of the vapor chamber.
摘要翻译：蒸气室包括容纳工作液体的密封扁平壳体，布置在壳体内表面上的芯结构，容纳在壳体中的支撑板和多个支撑柱。支撑板在其中限定多个固定孔。支撑柱被卡合在支撑板的固定孔中。支撑柱的顶端和底端与油绳结构接合以加强蒸气室的结构。

9. 发明授权

US07942557B2 LED lamp having active heat dissipation structure 失效
标题翻译： LED灯具有主动散热结构
公开(公告)号：US07942557B2
公开(公告)日：2011-05-17
申请号：US12238422
申请日：2008-09-25
申请人： Zhi-Yong Zhou , Qiao-Li Ding
发明人： Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： F21V29/00
CPC分类号： F21V29/67 , F21V29/763 , F21Y2115/10
摘要： An LED lamp includes a heat sink, a centrifugal blower and a plurality of LED modules. The heat sink includes a base plate defining an air intake adjacent to an end of the base plate and a plurality of fins extending downwardly from a bottom surface of the base plate, between the air intake and an opposite remote end of the base plate. The centrifugal blower is mounted on the bottom surface of the base plate and located between the air intake and the fins. The LED modules are fixed on a top surface of the base plate of the heat sink. The housing engages with the base plate to enclose the centrifugal blower and the fins therein and cooperates with the base plate to define an exhaust port between the opposite remote end of the base plate and a corresponding sidewall of the housing.
摘要翻译： LED灯包括散热器，离心鼓风机和多个LED模块。散热器包括限定与基板的端部相邻的进气口的底板和从基板的底表面向下延伸的多个翅片，位于进气口和基板的相对的远端之间。离心鼓风机安装在基板的底面上，位于进气口和散热片之间。 LED模块固定在散热器底板的顶面上。壳体与基板接合以将离心鼓风机和翅片封闭在其中并与底板协作以在基板的相对的远端和壳体的相应侧壁之间限定排气口。

10. 发明授权

US07457122B2 Memory module assembly including a clip for mounting a heat sink thereon 失效
标题翻译：存储器模块组件，包括用于在其上安装散热器的夹子
公开(公告)号：US07457122B2
公开(公告)日：2008-11-25
申请号：US11309225
申请日：2006-07-13
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： H05K7/20
CPC分类号： G11C5/143 , H01L23/3672 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.
摘要翻译：存储模块组件包括其上具有发热电子部件（14）的印刷电路板（10）和安装在印刷电路板的相对侧上的第一和第二散热板（20），（30）。第一散热板包括从其一侧延伸的第一钩（24），第一钩包括从第一散热板的端部延伸的阻挡部分（242）和从第一散热板的一端延伸的第一接合部分（244）用于抵抗印刷电路板和第二散热板的抵抗部分的自由端。第二散热板在其一侧限定了与第一钩接合的凹部（34）。第一和第二散热板的另一侧彼此接合以将印刷电路板夹在第一和第二散热板之间。

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