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1. 发明授权

US09108840B2 MEMS microphone and method for packaging the same 有权
标题翻译： MEMS麦克风和包装方法相同
公开(公告)号：US09108840B2
公开(公告)日：2015-08-18
申请号：US13581823
申请日：2010-12-30
申请人： Zhe Wang , Qinglin Song , Shengli Pang , Fanghui Gu
发明人： Zhe Wang , Qinglin Song , Shengli Pang , Fanghui Gu
IPC分类号： B81B3/00 , H04R19/00 , H04R31/00 , B81C1/00 , H04R1/02
CPC分类号： B81B3/0018 , B81B2201/0257 , B81B2207/015 , B81C1/00158 , B81C1/00246 , H04R1/021 , H04R19/005 , H04R31/00 , H04R2201/003
摘要： The present invention relates to a MEMS microphone and a method of manufacturing the same, the MEMS microphone comprising: a monolithic silicon chip incorporating an acoustic sensing element and one or more conditioning CMOS integrated circuits; a silicon-based carrier chip having an acoustic cavity; a substrate for surface mounting the assembly of the monolithic chip and the silicon-based carrier chip thereon; a conductive cover attached and electrically connected to the substrate to accommodates the assembly of the monolithic chip and the silicon-based carrier chip; and an acoustic port formed on either the conductive cover or the substrate for an external acoustic wave to reach the acoustic sensing element, wherein the monolithic silicon chip, the silicon-based carrier chip and the acoustic port are configured in such a way that the diaphragm of the acoustic sensing element can be vibrated by the external sound wave from one side thereof.
摘要翻译： MEMS麦克风及其制造方法技术领域本发明涉及一种MEMS麦克风及其制造方法，该MEMS麦克风包括：包含声学感测元件和一个或多个调节CMOS集成电路的单片硅芯片; 具有声腔的硅基载体芯片; 用于将单片芯片和硅基载体芯片的组件表面安装在其上的基板; 导电盖，其附接并电连接到所述基板以容纳所述单片芯片和所述硅基载体芯片的组装; 以及形成在导电盖或用于外部声波的基板上的声波端口到达声学感测元件，其中单片硅芯片，硅基载体芯片和声学端口被构造成使得隔膜的声学传感元件可以通过外部声波从其一侧振动。

2. 发明申请

US20140008740A1 MEMS MICROPHONE AND METHOD FOR PACKAGING THE SAME 有权
标题翻译： MEMS麦克风及其包装方法
公开(公告)号：US20140008740A1
公开(公告)日：2014-01-09
申请号：US13581823
申请日：2010-12-30
申请人： Zhe Wang , Qinglin Song , Shengli Pang , Fanghui Gu
发明人： Zhe Wang , Qinglin Song , Shengli Pang , Fanghui Gu
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81B3/0018 , B81B2201/0257 , B81B2207/015 , B81C1/00158 , B81C1/00246 , H04R1/021 , H04R19/005 , H04R31/00 , H04R2201/003
摘要： The present invention relates to a MEMS microphone and a method of manufacturing the same, the MEMS microphone comprising: a monolithic silicon chip incorporating an acoustic sensing element and one or more conditioning CMOS integrated circuits; a silicon-based carrier chip having an acoustic cavity; a substrate for surface mounting the assembly of the monolithic chip and the silicon-based carrier chip thereon; a conductive cover attached and electrically connected to the substrate to accommodates the assembly of the monolithic chip and the silicon-based carrier chip; and an acoustic port formed on either the conductive cover or the substrate for an external acoustic wave to reach the acoustic sensing element, wherein the monolithic silicon chip, the silicon-based carrier chip and the acoustic port are configured in such a way that the diaphragm of the acoustic sensing element can be vibrated by the external sound wave from one side thereof.
摘要翻译： MEMS麦克风及其制造方法技术领域本发明涉及一种MEMS麦克风及其制造方法，该MEMS麦克风包括：包含声学感测元件和一个或多个调节CMOS集成电路的单片硅芯片; 具有声腔的硅基载体芯片; 用于将单片芯片和硅基载体芯片的组件表面安装在其上的基板; 导电盖，其附接并电连接到所述基板以容纳所述单片芯片和所述硅基载体芯片的组装; 以及形成在导电盖或用于外部声波的基板上的声波端口到达声学感测元件，其中单片硅芯片，硅基载体芯片和声学端口被构造成使得隔膜的声学传感元件可以通过外部声波从其一侧振动。

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