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    • 1. 发明专利
    • Wafer scale die handling
    • AU2005227167B2
    • 2010-12-23
    • AU2005227167
    • 2005-02-23
    • ZIPTRONIX INC
    • FOUNTAIN GAIUS G JRENQUIST PAUL MPETTEWAY CARL T
    • H01L23/495
    • A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.
    • 2. 发明专利
    • Wafer scale die handling
    • AU2005227167A1
    • 2005-10-06
    • AU2005227167
    • 2005-02-23
    • ZIPTRONIX INC
    • FOUNTAIN GAIUS G JRENQUIST PAUL MPETTEWAY CARL T
    • H01L23/495
    • A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.
    • 3. 发明专利
    • WAFER SCALE DIE HANDLING
    • CA2558507A1
    • 2005-10-06
    • CA2558507
    • 2005-02-23
    • ZIPTRONIX INC
    • FOUNTAIN GAIUS G JRPETTEWAY CARL TENQUIST PAUL M
    • H01L21/67H01L23/495
    • A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.
    • 4. 发明申请
    • WAFER SCALE DIE HANDLING
    • WO2005091868A3
    • 2009-03-26
    • PCT/US2005005641
    • 2005-02-23
    • ZIPTRONIX INCENQUIST PAUL MFOUNTAIN GAIUS G JRPETTEWAY CARL T
    • ENQUIST PAUL MFOUNTAIN GAIUS G JRPETTEWAY CARL T
    • H01L23/495
    • H01L21/67333H01L2924/0002Y10S414/135Y10S414/14Y10S414/141H01L2924/00
    • A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.
    • 一种华夫饼包装置,包括在所述构件的表面中具有凹部以容纳来自至少一个半导体晶片的模具的构件。 该元件与半导体晶片处理设备和/或半导体晶片处理兼容。 优选地,构件容纳来自半导体晶片的至少大部分管芯。 此外,提供了一种半导体器件组装方法,其从单个华夫饼包装置中去除裸片,将来自单个华夫饼包装置的管芯放置在半导体封装上,以从放置的管芯组装集成电路所需的所有管芯部件,并将 放置在半导体封装中以形成集成电路。 提供了另一种半导体器件组装方法,其从至少一个华夫饼包装置去除管芯,将来自至少一个华夫饼包装置的管芯放置在半导体封装上,以从集成电路所需的放置的管芯器件组件中组装,并将 放置在半导体封装中以形成集成电路。