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1. 发明专利

AU2005227167B2 Wafer scale die handling 未知
公开(公告)号：AU2005227167B2
公开(公告)日：2010-12-23
申请号：AU2005227167
申请日：2005-02-23
申请人： ZIPTRONIX INC
发明人： FOUNTAIN GAIUS G JR , ENQUIST PAUL M , PETTEWAY CARL T
IPC分类号： H01L23/495
摘要： A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.

2. 发明专利

AU2005227167A1 Wafer scale die handling 未知
公开(公告)号：AU2005227167A1
公开(公告)日：2005-10-06
申请号：AU2005227167
申请日：2005-02-23
申请人： ZIPTRONIX INC
发明人： FOUNTAIN GAIUS G JR , ENQUIST PAUL M , PETTEWAY CARL T
IPC分类号： H01L23/495
摘要： A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.

3. 发明专利

CA2558507A1 WAFER SCALE DIE HANDLING 未知
公开(公告)号：CA2558507A1
公开(公告)日：2005-10-06
申请号：CA2558507
申请日：2005-02-23
申请人： ZIPTRONIX INC
发明人： FOUNTAIN GAIUS G JR , PETTEWAY CARL T , ENQUIST PAUL M
IPC分类号： H01L21/67 , H01L23/495
摘要： A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.

4. 发明申请

WO2005091868A3 WAFER SCALE DIE HANDLING 审中-公开
公开(公告)号：WO2005091868A3
公开(公告)日：2009-03-26
申请号：PCT/US2005005641
申请日：2005-02-23
申请人： ZIPTRONIX INC , ENQUIST PAUL M , FOUNTAIN GAIUS G JR , PETTEWAY CARL T
发明人： ENQUIST PAUL M , FOUNTAIN GAIUS G JR , PETTEWAY CARL T
IPC分类号： H01L23/495
CPC分类号： H01L21/67333 , H01L2924/0002 , Y10S414/135 , Y10S414/14 , Y10S414/141 , H01L2924/00
摘要： A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.
摘要翻译：一种华夫饼包装置，包括在所述构件的表面中具有凹部以容纳来自至少一个半导体晶片的模具的构件。该元件与半导体晶片处理设备和/或半导体晶片处理兼容。优选地，构件容纳来自半导体晶片的至少大部分管芯。此外，提供了一种半导体器件组装方法，其从单个华夫饼包装置中去除裸片，将来自单个华夫饼包装置的管芯放置在半导体封装上，以从放置的管芯组装集成电路所需的所有管芯部件，并将放置在半导体封装中以形成集成电路。提供了另一种半导体器件组装方法，其从至少一个华夫饼包装置去除管芯，将来自至少一个华夫饼包装置的管芯放置在半导体封装上，以从集成电路所需的放置的管芯器件组件中组装，并将放置在半导体封装中以形成集成电路。

5. 发明公开

EP1721335A4 WAFER SCALE DIE HANDLING 审中-公开
标题翻译： CHIP有关处理晶圆级
公开(公告)号：EP1721335A4
公开(公告)日：2011-01-05
申请号：EP05713952
申请日：2005-02-23
申请人： ZIPTRONIX INC
发明人： ENQUIST PAUL M , FOUNTAIN GAIUS G JR , PETTEWAY CARL T
IPC分类号： H01L23/495 , A47J45/00 , B65G47/00 , H01L21/44
CPC分类号： H01L21/67333 , H01L2924/0002 , Y10S414/135 , Y10S414/14 , Y10S414/141 , H01L2924/00

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