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    • 4. 发明授权
    • Operating methods of flash memory and decoding circuits thereof
    • 闪存及其解码电路的操作方法
    • US08908434B2
    • 2014-12-09
    • US13021381
    • 2011-02-04
    • Yvonne LinTien-Chun Yang
    • Yvonne LinTien-Chun Yang
    • G11C16/00G11C16/14G11C16/12H01L27/15G11C16/04G11C16/32
    • G11C16/14G11C16/0408G11C16/12G11C16/32H01L27/15
    • A FLASH memory cell includes a control gate over a floating gate over a substrate. A wall line and an erase gate each is disposed adjacent to a respective sidewall of the control gate. A first source/drain (S/D) region is disposed in the substrate and adjacent to a sidewall of the wall line. A second S/D region is disposed in the substrate and adjacent to the sidewall of the floating gate. A method of operating the FLASH memory cell includes applying a first voltage level to the control gate. A second voltage level is applied to the word line. The second voltage level is lower than the first voltage level. A third voltage level is applied to the first S/D region. A fourth voltage level is applied to the second S/D region. The fourth voltage level is higher than the third voltage level. The erase gate is electrically floating.
    • 闪存单元包括位于衬底上的浮动栅极上的控制栅极。 壁线和擦除栅极分别邻近控制栅极的相应侧壁设置。 第一源极/漏极(S / D)区域设置在衬底中并且邻近壁线的侧壁。 第二S / D区域设置在衬底中并且与浮动栅极的侧壁相邻。 一种操作闪速存储单元的方法包括将第一电压电平施加到控制栅极。 第二个电压电平被施加到字线。 第二电压电平低于第一电压电平。 第三电压电平施加到第一S / D区域。 第四电压电平施加到第二S / D区域。 第四电压电平高于第三电压电平。 擦除门电浮动。
    • 8. 发明授权
    • Test structure for measuring effect of trench isolation on oxide in a memory device
    • 沟槽隔离对存储器件中氧化物的影响的测试结构
    • US06859748B1
    • 2005-02-22
    • US10190420
    • 2002-07-03
    • Nian YangZhigang WangTien-Chun Yang
    • Nian YangZhigang WangTien-Chun Yang
    • H01L23/544G01R27/29G01S31/00
    • H01L22/34
    • An apparatus for measuring effects of isolation processes (280) on an oxide layer (286) in a memory device (255) is described. In one embodiment, the apparatus comprises a structure (110) comprised of an array (110c) of memory devices (255). A testing unit (120) is coupled with the structure (110). The testing unit (120) is for performing various electrical tests on the array (110c) of memory devices (255). The testing unit (120) is also for providing data regarding each memory device (255) in the array (110c) of memory devices (255). An analyzer (120) is coupled with the structure (110) for analyzing results of the various electrical tests. This determines the condition of the oxide layer (286) of each memory device (255) in the array of memory devices (110c).
    • 描述了用于测量隔离过程(280)对存储器件(255)中的氧化物层(286)的影响的装置。 在一个实施例中,该装置包括由存储器件(255)的阵列(110c)组成的结构(110)。 测试单元(120)与结构(110)耦合。 测试单元(120)用于在存储器件(255)的阵列(110c)上执行各种电测试。 测试单元(120)还用于提供关于存储器件(255)的阵列(110c)中的每个存储器件(255)的数据。 分析器(120)与结构(110)耦合,用于分析各种电气测试的结果。 这决定了存储器件阵列(110c)中每个存储器件(255)的氧化物层(286)的状态。