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1. 发明授权

US07275795B2 Braking system of hybrid vehicle 有权
标题翻译：混合动力汽车制动系统
公开(公告)号：US07275795B2
公开(公告)日：2007-10-02
申请号：US10507732
申请日：2003-03-20
申请人： Mitsuhiro Nishina , Yuuji Suzuki , Tatsuji Miyata
发明人： Mitsuhiro Nishina , Yuuji Suzuki , Tatsuji Miyata
IPC分类号： B60T8/62
CPC分类号： B60W20/13 , B60K6/44 , B60K6/48 , B60K6/52 , B60L7/24 , B60T1/10 , B60T8/267 , B60T13/74 , B60T17/043 , B60T17/22 , B60T2270/602 , B60T2270/604 , B60T2270/608 , B60W10/06 , B60W10/08 , B60W10/18 , B60W10/184 , B60W10/26 , B60W20/00 , B60W30/18127 , B60W30/18136 , B60W2520/10 , B60W2520/26 , B60W2540/12 , B60W2720/403 , Y02T10/6221 , Y02T10/623 , Y02T10/6265
摘要： A hybrid system for a vehicle which can ensure a braking stability on a slippery road is provided. Therefore, the system is provided with a motor 2 a rotation force of which is transmitted to a rear wheel 7, braking actuators 57, 67 which brake the front wheel 6 and the rear wheel 7, and proportional valves 53, 63 controlling a braking force introduced into each braking actuator 57, 67. A control unit 20 is so provided that the control unit 20 calculates a required braking energy based upon a vehicle operating condition in demanding a braking and operates the motor 2 as a power generator to generate a power so as to produce the calculated braking energy, as well as controls a braking force of the front wheel 6.
摘要翻译：提供一种用于车辆的混合系统，其可以确保在滑溜的道路上的制动稳定性。因此，该系统设置有电动机2，其旋转力传递到后轮7，制动前轮6和后轮7的制动致动器57,67以及控制制动力的比例阀53,63 引入每个制动致动器57,67。控制单元20被设置成使得控制单元20基于车辆操作条件在要求制动时计算所需的制动能量，并且将作为发电机的电动机2运行以产生电力，以产生计算的制动能量，如以及控制前轮6的制动力。

2. 发明授权

US07892655B2 Ultrathin copper foil with carrier and printed circuit board using same 有权
标题翻译：超薄铜箔带载体和印刷电路板使用相同
公开(公告)号：US07892655B2
公开(公告)日：2011-02-22
申请号：US11610799
申请日：2006-12-14
申请人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
发明人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
IPC分类号： B32B15/00
CPC分类号： C25D5/10 , B32B7/06 , B32B15/08 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2457/08 , H05K3/022 , Y10T428/12812 , Y10T428/1284 , Y10T428/12847 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931 , Y10T428/24917
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.
摘要翻译：一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。

3. 发明申请

US20070154692A1 ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING SAME 有权
标题翻译：超薄铜箔与载体和印刷电路板使用相同
公开(公告)号：US20070154692A1
公开(公告)日：2007-07-05
申请号：US11610799
申请日：2006-12-14
申请人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
发明人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
IPC分类号： B32B3/00 , C25D5/10 , B32B7/00
CPC分类号： C25D5/10 , B32B7/06 , B32B15/08 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2457/08 , H05K3/022 , Y10T428/12812 , Y10T428/1284 , Y10T428/12847 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931 , Y10T428/24917
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.
摘要翻译：一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基座的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足公式：<？in-line-formula description =“In-line formula”end =“lead”？> 10 <= A /（a + b）* 100 <= 70 <？in-line-formula description = “直线公式”end =“tail”？>和打印的c 通过使用这种超薄铜箔与载体制备的电路板。

4. 发明授权

US07223481B2 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board 失效
标题翻译：用载体生产超薄铜箔的方法，由其制造的载体的超薄铜箔，印刷电路板，多层印刷电路板和薄膜电路板上的芯片
公开(公告)号：US07223481B2
公开(公告)日：2007-05-29
申请号：US10929471
申请日：2004-08-31
申请人： Yuuji Suzuki , Akira Matsuda
发明人： Yuuji Suzuki , Akira Matsuda
IPC分类号： B32B15/00
CPC分类号： C25D1/04 , H01L2924/0002 , H05K3/025 , H05K3/384 , H05K2201/0355 , H05K2201/0723 , Y10T428/12028 , Y10T428/12472 , Y10T428/12493 , Y10T428/12514 , Y10T428/12535 , Y10T428/12778 , Y10T428/12806 , H01L2924/00
摘要： An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 μm by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.
摘要翻译：本发明的目的是制造具有针孔小，表面粗糙度小，厚度小于5μm的载体的超薄铜箔，制造箔的制造方法通过使用具有载体的超薄铜箔制造精细图案的印刷电路板，多层印刷电路板和薄膜电路板上的芯片。本发明提供一种具有载体的超薄铜箔，其通过在载体铜箔的表面上依次层叠剥离层和超薄铜箔而制造，该载体铜箔的表面平滑，使得至少一个侧面的平均表面粗糙度通过化学抛光，电化学溶解或平滑电镀处理方法独立地组合了两个或更多个，或进一步组合机械抛光，Rz为0.01〜2.0μm。

5. 发明授权

US07078928B2 Semiconductor integrated circuit device 失效
标题翻译：半导体集成电路器件
公开(公告)号：US07078928B2
公开(公告)日：2006-07-18
申请号：US10736673
申请日：2003-12-17
申请人： Ryusuke Sahara , Kozaburo Kurita , Yuuji Suzuki , Mitsugu Kusunoki , Hideki Sakakibara
发明人： Ryusuke Sahara , Kozaburo Kurita , Yuuji Suzuki , Mitsugu Kusunoki , Hideki Sakakibara
IPC分类号： H03K19/00 , G01R31/28 , H03H11/26
CPC分类号： G01R31/318577
摘要： The present invention provides a semiconductor integrated circuit device equipped with at least one pulse generator which generates a pulse of a pulse with shorter than a rising time up to the full amplitude of a transfer signal.A first signal and a second signal supplied from outside through a first signal path and a second signal path are respectively transferred to the pulse generator. When a rising time up to the full amplitude at any one of buffers in the first signal path and the second signal path is longer than a pulse width of a pulse to be formed by the pulse generator, the difference in phase between the first signal and the second signal is caused to correspond to a pulse width of a first pulse.
摘要翻译：本发明提供一种配备有至少一个脉冲发生器的半导体集成电路器件，该脉冲发生器产生的脉冲脉冲短于传输信号的全幅度的上升时间。通过第一信号路径和第二信号路径从外部提供的第一信号和第二信号分别传送到脉冲发生器。当在第一信号路径和第二信号路径中的任何一个缓冲器上的上升时间达到全幅度时，脉冲发生器将形成的脉冲的脉冲宽度大于第一信号与第二信号路径之间的相位差使第二信号对应于第一脉冲的脉冲宽度。

6. 发明授权

US06939400B2 Ink, production method of the same materials for producing the same and printed matter with the same 有权
标题翻译：油墨，生产方法相同的材料用于生产相同和印刷品相同
公开(公告)号：US06939400B2
公开(公告)日：2005-09-06
申请号：US10723265
申请日：2003-11-25
申请人： Yuuji Suzuki
发明人： Yuuji Suzuki
IPC分类号： C09D11/00
CPC分类号： C09D11/037
摘要： An ink comprises 100 parts by weight of an aluminum flake containing aluminum flakes of 0.5 μm or less, more preferably 0.3 μm or less, in thickness and 20 μm2 to 2,000 μm2 in flake area in a content of 75% or more, 3 to 200 parts by weight of a binding agent, and 600 to 4,000 parts by weight of a solvent, wherein the solvent is the one containing 20 wt % or more of 3-methyl-3-methoxy-1-butanol (MMB).
摘要翻译：油墨包含100重量份的含有0.5μm或更小，更优选0.3μm或更小的铝薄片的铝薄片，厚度为20μm至2,000μm2 / > 75％以上，3〜200重量份粘合剂和600〜4000重量份溶剂的片状区域，其中溶剂为含有20重量％以上的3- 甲基-3-甲氧基-1-丁醇（MMB）。

7. 发明授权

US06924043B2 Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier 失效
标题翻译：带载体的超薄铜箔，生产方法，印刷电路板采用超薄铜箔与载体
公开(公告)号：US06924043B2
公开(公告)日：2005-08-02
申请号：US10698014
申请日：2003-10-31
申请人： Yuuji Suzuki , Akira Matsuda
发明人： Yuuji Suzuki , Akira Matsuda
IPC分类号： H05K1/09 , C25D1/04 , C25D1/22 , C25D5/10 , H05K3/02 , H05K3/38 , B32B15/00
CPC分类号： C25D5/10 , C25D1/04 , C25D1/22 , H05K3/025 , H05K3/384 , Y10T428/12438 , Y10T428/12472 , Y10T428/12493 , Y10T428/12514 , Y10T428/12771 , Y10T428/12806 , Y10T428/12847 , Y10T428/1291
摘要： An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided. The peeling layer between the carrier foil and the ultra-thin copper foil is chromium, a chromium alloy, a chromium-containing oxide hydrate layer, nickel, iron, or an alloy layer of the same or an oxide hydrate layer of the same.
摘要翻译：一种具有载体的超薄铜箔，其具有能够在使用高耐热性树脂的情况下能够承受甚至高温加工的剥离层，使得载体箔和超薄铜箔容易剥离，并且减少在不损害剥离层的剥离性的同时通过均匀镀覆的针孔数，即具有载体箔，剥离层和超薄铜箔的载体的超薄铜箔，其中剥离层和超薄铜箔之间设置有在剥离层侧的表面的触击镀层，根据需要在其上设置超薄铜层，并且由超薄铜箔构成的超薄铜箔铜或铜合金或含磷铜或含磷铜合金。载体箔和超薄铜箔之间的剥离层是铬，铬合金，含铬氧化物水合物层，镍，铁或其合金层，或者是氧化物水合物层。

8. 发明申请

US20110171486A1 COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND APPARATUS FOR PRODUCTION OF SAME, AND HIGH FREQUENCY CIRCUIT USING COPPER FOIL 审中-公开
标题翻译：用于高频电路的铜箔，用于生产它们的生产方法和装置以及使用铜箔的高频电路
公开(公告)号：US20110171486A1
公开(公告)日：2011-07-14
申请号：US13072220
申请日：2011-03-25
申请人： Takami MOTEKI , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
发明人： Takami MOTEKI , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
IPC分类号： B32B15/04 , B32B15/00 , H05K1/02
CPC分类号： C25D1/04 , C25D7/0614 , H05K1/0237 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.
摘要翻译：铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。

9. 发明申请

US20070287020A1 Surface treated electrodeposited copper foil, the production method and circuit board 失效
标题翻译：表面处理电沉积铜箔，生产方法和电路板
公开(公告)号：US20070287020A1
公开(公告)日：2007-12-13
申请号：US11808049
申请日：2007-06-06
申请人： Takahiro Saito , Sadao Matsumoto , Yuuji Suzuki
发明人： Takahiro Saito , Sadao Matsumoto , Yuuji Suzuki
IPC分类号： C22C9/00
CPC分类号： H05K3/384 , H05K2201/0355 , H05K2203/0723 , Y10T428/12431 , Y10T428/12569 , Y10T428/12903
摘要： To provide a surface treated electrodeposited copper foil having a smooth M surface with less asperity on the surface instead of an S surface affected by stripes transferred from a surface drum; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 μm or smaller and Ra is 0.2 μm or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45° C., a chloride concentration is 0.01 to 30 ppm, an adding concentration of a total of an organic sulfur based compound, low molecular weight glue and polymeric polysaccharide is 0.1 to 100 ppm and TOC (total organic carbon) is 400 ppm or smaller, and a current density is 20 to 50 A/dm2, and a surface treatment is performed on an M surface of the copper foil to attain Rz of 1.0 μm or smaller and Ra of 0.2 μm or smaller on the M surface.
摘要翻译：提供具有光滑M表面的表面处理电沉积铜箔，而不是表面受到从表面转鼓传送的条纹影响的S表面; 在M表面上进行表面处理，M表面是与电沉积铜箔中的滚筒接触的表面的相对表面，其中Rz为1.0μm或更小，并且Ra为0.2μm或更小，电沉积铜镀层为在使用硫酸铜浴的条件下进行铜箔的制造，铜浓度为50〜80g / l，硫酸浓度为30〜70g / l，溶液温度为35〜45℃。氯化物浓度为0.01〜30ppm，有机硫系化合物，低分子量胶和聚合多糖的总添加浓度为0.1〜100ppm，TOC（总有机碳）为400ppm以下，电流密度为20〜50A / dm 2，对铜箔的M面进行表面处理，使M表面的Rz为1.0μm以下，Ra为0.2μm以下。

10. 发明申请

US20070110969A1 Laminated circuit board 失效
标题翻译：层压电路板
公开(公告)号：US20070110969A1
公开(公告)日：2007-05-17
申请号：US11594134
申请日：2006-11-08
申请人： Yuuji Suzuki , Yuuki Kikuchi , Satoru Zama
发明人： Yuuji Suzuki , Yuuki Kikuchi , Satoru Zama
IPC分类号： B32B3/00
CPC分类号： H05K3/384 , B32B15/08 , B32B15/20 , H05K3/4069 , H05K2201/0272 , H05K2201/0355 , H05K2203/0307 , H05K2203/0425 , H05K2203/0723 , H05K2203/1461 , Y10T29/49124 , Y10T29/49128 , Y10T428/12438 , Y10T428/12451 , Y10T428/24917
摘要： A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2 to make surface roughness Rz of 0.3 to 10 μm and height of the projection to be 0.3 to 10 μm. Surface roughness of the original foil is 0.1 to 5 μm and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.
摘要翻译：通过使用铜箔和含有低熔点金属的导电膏，电连接的可靠性高，而不会在铜箔和导电膏金属之间的边界处产生有害的空隙和裂纹。叠层电路板是通过将至少在其一个表面侧上至少具有粗糙化处理的铜箔的多个树脂板层压而成的，其粗化投影沉积小于150mg / dm 2以使表面粗糙度Rz 为0.3〜10μm，突出部的高度为0.3〜10μm。原始箔的表面粗糙度为0.1〜5μm，粗化处理层的铜金属原子的量设定为含有低熔点金属的扩散性导电性糊状金属原子的量的4倍以下箔表面。

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