专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100229134A1 LAYOUT VERIFICATION METHOD 审中-公开
标题翻译：布局验证方法
公开(公告)号：US20100229134A1
公开(公告)日：2010-09-09
申请号：US12700117
申请日：2010-02-04
申请人： Yutaka MIZUNO , Tomoyuki Yamada
发明人： Yutaka MIZUNO , Tomoyuki Yamada
IPC分类号： G06F17/50
CPC分类号： G06F17/5081
摘要： A layout verification method for verifying a layout of a semiconductor device by a computer having a memory storing layout data and information of operation conditions for a plurality of operation modes in which the semiconductor device is expected to assume during its testing and practical use, the semiconductor device including a semiconductor substrate of one conductivity type, a plurality of wells accommodating at least one of the circuit elements and being applicable to a plurality of different bias voltages in dependence of the operation modes, the method includes specifying combination of all the adjacent pairs of the wells located adjacently to each other within the semiconductor substrate, and the distance of each of all the adjacent pairs of the wells in reference to the layout data, determining, for each of the wells.
摘要翻译：一种用于通过计算机验证半导体器件的布局的布局验证方法，所述计算机具有存储布局数据的存储器以及半导体器件在其测试和实际应用期间期望呈现的多种操作模式的操作条件的信息，半导体包括一个导电类型的半导体衬底的器件，容纳至少一个电路元件的多个阱，并且可以根据操作模式应用于多个不同的偏置电压，该方法包括指定所有相邻对的组合在半导体衬底内彼此相邻的阱以及相对于布局数据的阱的所有相邻对中的每一个的距离，为每个阱确定。

2. 发明授权

US08541871B2 Multilayered lead frame for a semiconductor light-emitting device 有权
标题翻译：用于半导体发光器件的多层引线框架
公开(公告)号：US08541871B2
公开(公告)日：2013-09-24
申请号：US12716938
申请日：2010-03-03
申请人： Hidekazu Tomohiro , Masayuki Fujii , Norio Satou , Tomoyuki Yamada , Tomio Kusano
发明人： Hidekazu Tomohiro , Masayuki Fujii , Norio Satou , Tomoyuki Yamada , Tomio Kusano
IPC分类号： H01L23/495
CPC分类号： H01L33/62 , H01L23/49582 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/85439 , H01L2224/85464 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2224/45099 , H01L2924/00
摘要： A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.
摘要翻译：通过以大致整体的方式施加镀镍（102），镀钯（103）和镀金（104）的方式形成用于半导体器件的引线框架（100），以引导诸如铜薄板的框架体（101）并且进一步将银电镀（105）选择性地施加到将被半导体器件的封装封装的内部部分的一部分。引线框架（100）还可以包括封装的基部。镀银有助于内部部件的良好的光反射率和引线接合效率，而闪镀电镀有助于在封装外部的外部部件具有优异的耐腐蚀性和焊接效率。

3. 发明授权

US08112183B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US08112183B2
公开(公告)日：2012-02-07
申请号：US12260211
申请日：2008-10-29
申请人： Tomoyuki Yamada
发明人： Tomoyuki Yamada
IPC分类号： G06F19/00
CPC分类号： H01L21/67109 , H01L21/67253
摘要： A substrate processing apparatus detects malfunction of mechanisms in MFC. An inert gas supply line, a first shut-off valve shutting off the inert gas supply, a process gas supply line, and a second shut-off valve shutting off the process gas supply are installed upstream of the MFC. A gas supply pipe connected to a process chamber, a third shut-off valve shutting off gas supply to the gas supply pipe, an exhaust vent line which is exhaustible, and a fourth shut-off valve shutting off gas supply to the exhaust vent line are installed downstream of the MFC. A main control unit determines that the MFC is abnormal if a transition time exceeds a previously set time when the MFC transitions from a closed state to an opened state while the shut-off valves are in a closed state.
摘要翻译：基板处理装置检测MFC中的机构的故障。惰性气体供给管线，关闭惰性气体源的第一截止阀，处理气体供应管线和关闭工艺气体供应的第二截止阀安装在MFC的上游。连接到处理室的气体供给管，关闭气体供给管的气体供给的第三截止阀，可排出的排气管，以及关闭排气管线的气体供给的第四截止阀安装在MFC的下游。如果在关闭阀处于关闭状态时，当MFC从关闭状态转换到打开状态时，如果转换时间超过预先设定的时间，则主控制单元确定MFC异常。

4. 发明申请

US20110300981A1 FRICTION DRIVE BELT 审中-公开
标题翻译：摩擦驱动皮带
公开(公告)号：US20110300981A1
公开(公告)日：2011-12-08
申请号：US13202414
申请日：2010-02-24
申请人： Shinji Takahashi , Kenichiro Furuta , Hiroyuki Shiriike , Tomoyuki Yamada , Hiroyuki Tachibana
发明人： Shinji Takahashi , Kenichiro Furuta , Hiroyuki Shiriike , Tomoyuki Yamada , Hiroyuki Tachibana
IPC分类号： F16G1/06
CPC分类号： C08K3/346 , C08K3/06 , C08K3/26 , C08K5/04 , C08K7/26 , C08L23/16 , C08L77/00 , C08L91/00 , C08L2205/16 , C08L2312/00 , F16G5/20 , C08L21/00
摘要： A friction drive belt (B) includes a belt body (10) that is wrapped around pulleys in contact therewith to transmit power. At least a pulley contact portion (15) of the belt main body (10) is made of a rubber composition containing 30-80 parts by mass of at least one layered silicate selected from a smectite group and a vermiculite group, per 100 parts by mass of raw rubber containing an ethylene-α-olefin elastomer.
摘要翻译：摩擦传动带（B）包括带状体（10），所述带体（10）缠绕在与其接触的皮带轮上以传递动力。带主体（10）的至少一个滑轮接触部分（15）由橡胶组合物制成，该橡胶组合物含有30-80质量份选自蒙脱石组和蛭石组中的至少一种层状硅酸盐，每100份含有乙烯-α-烯烃弹性体的生橡胶的质量。

5. 发明授权

US07692277B2 Multilayered lead frame for a semiconductor light-emitting device 有权
标题翻译：用于半导体发光器件的多层引线框架
公开(公告)号：US07692277B2
公开(公告)日：2010-04-06
申请号：US10542419
申请日：2004-01-13
申请人： Hidekazu Tomohiro , Masayuki Fujii , Norio Satou , Tomoyuki Yamada , Tomio Kusano
发明人： Hidekazu Tomohiro , Masayuki Fujii , Norio Satou , Tomoyuki Yamada , Tomio Kusano
IPC分类号： H01L23/495
CPC分类号： H01L33/62 , H01L23/49582 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/85439 , H01L2224/85464 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2224/45099 , H01L2924/00
摘要： A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.
摘要翻译：通过以大致整体的方式施加镀镍（102），镀钯（103）和镀金（104）的方式形成用于半导体器件的引线框架（100），以引导诸如铜薄板的框架体（101）并且进一步将银电镀（105）选择性地施加到将被半导体器件的封装封装的内部部分的一部分。引线框架（100）还可以包括封装的基部。镀银有助于内部部件的良好的光反射率和引线接合效率，而闪镀电镀有助于在封装外部的外部部件具有优异的耐腐蚀性和焊接效率。

6. 发明申请

US20080263002A1 Base Sequence Retrieval Apparatus 审中-公开
标题翻译：基本序列检索装置
公开(公告)号：US20080263002A1
公开(公告)日：2008-10-23
申请号：US10594644
申请日：2005-03-31
申请人： Shinichi Morishita , Tomoyuki Yamada
发明人： Shinichi Morishita , Tomoyuki Yamada
IPC分类号： G06F7/06 , G06F17/30
CPC分类号： G16B30/00 , G16B20/00
摘要： An apparatus, method, etc. that in designing of the base sequence of, for example, siRNA, realize high-speed retrieval any genes containing analogous base sequences without omission. Accordingly, retrieval is carried out in such a manner that two partial sequences of given length and any extra part are identified from inputted base sequences, and that hamming distance being the number of corresponding bases incompatible with each other is divided and assigned to the partial sequences and extra part and out of the two partial sequences, one with an assigned number not greater is selected and retrieved.
摘要翻译：在设计例如siRNA的碱基序列的装置，方法等中，实现高速检索任何含有类似碱基序列而不被遗漏的基因。因此，以从输入的基本序列识别给定长度和任何额外部分的两个部分序列，并且将彼此不相容的相应基数的汉明距离划分并分配给部分序列的方式进行检索并且选择并检索两个部分序列中的额外部分和分配数目不大的部分序列。

7. 发明授权

US07340701B2 Layout verification method and device 有权
标题翻译：布局验证方法和设备
公开(公告)号：US07340701B2
公开(公告)日：2008-03-04
申请号：US11224129
申请日：2005-09-13
申请人： Tomoyuki Yamada
发明人： Tomoyuki Yamada
IPC分类号： G06F17/50
CPC分类号： G06F17/5081
摘要： There is provided a layout verification method including a space acquisition step of, with a wiring connected to a gate through a via as a target wiring, acquiring a space between the target wiring and a wiring adjacent thereto, a calculation step of calculating an antenna ratio according to the space between the target wiring and the adjacent wiring, the area of the gate, and the area of the target wiring, and an output step of outputting an antenna damage error when the antenna ratio exceeds a predetermined value.
摘要翻译：提供了一种布局验证方法，包括：空间获取步骤，通过通孔作为目标布线连接到栅极的布线，获取目标布线和与其相邻的布线之间的空间;计算步骤，计算天线比根据目标布线和相邻布线之间的间隔，栅极的面积和目标布线的面积，以及当天线比超过预定值时输出天线损坏误差的输出步骤。

8. 发明申请

US20070202504A1 Method Of Searching Specific Base Sequence 审中-公开
标题翻译：搜索特定基本序列的方法
公开(公告)号：US20070202504A1
公开(公告)日：2007-08-30
申请号：US10593753
申请日：2005-03-23
申请人： Shinichi Morishita , Tomoyuki Yamada , Yuki Naito
发明人： Shinichi Morishita , Tomoyuki Yamada , Yuki Naito
IPC分类号： C12Q1/68 , G06F17/30 , G06F19/00
CPC分类号： C12Q1/6869 , G16B25/00 , G16B30/00 , C12Q2525/149
摘要： It is intended to efficiently determine a base sequence specifically appearing in an expression gene. For this, providing that the expression gene consists of exons (301) . . . (306) and especially that exon (301) is united with exon (302) and exon (302) with exon (303), an aggregate of base sequences (401) (403) being a union of exon base sequences (301) . . . (305) and a boundary base sequence obtained by uniting together base sequences (404) and (405) and base sequences (406) and (407) respectively existing over boundaries between exon (301) and exon (302) and between exon (302) and exon (303) is formed, and the aggregate is searched. If a base sequence is one specifically appearing in the expression gene, the number of search results is 1 and otherwise, the number is plural.
摘要翻译：旨在有效地确定特异性出现在表达基因中的碱基序列。为此，提供表达基因由外显子（301）组成。。。（306），特别是外显子（301）与外显子（302）和外显子（302）与外显子（303）结合，作为外显子碱基序列（301）的并集的碱基序列（401）（403）的聚集体。。。（305）和通过将分别存在于外显子（301）和外显子（302）之间的边界上的基本序列（404）和（405）以及碱基序列（406）和（407）之间以及外显子（302）之间的组合而获得的边界碱基序列）和外显子（303），并搜索聚集体。如果碱基序列是表达基因中特定出现的碱基序列，则搜索结果数为1，否则为数。

9. 发明授权

US06686644B2 Semiconductor device provided with fuse and method of disconnecting fuse 有权
标题翻译：提供熔断器和断路保险丝的半导体装置
公开(公告)号：US06686644B2
公开(公告)日：2004-02-03
申请号：US10103195
申请日：2002-03-22
申请人： Tsutomu Tatematsu , Kengi Togashi , Masayuki Nakada , Toyoji Sawada , Kazuo Sukegawa , Tomoyuki Yamada , Yoshikazu Arisaka
发明人： Tsutomu Tatematsu , Kengi Togashi , Masayuki Nakada , Toyoji Sawada , Kazuo Sukegawa , Tomoyuki Yamada , Yoshikazu Arisaka
IPC分类号： H01L2900
CPC分类号： H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： A high-strength protective member made of tungsten is disposed under a disconnecting point of a fuse. This protective member is formed simultaneously with formation of a via contact portion which connects the fuse with wiring, for example.
摘要翻译：由钨制成的高强度保护构件设置在保险丝的断开点下方。例如，该保护构件同时形成连接保险丝与布线的通孔接触部分。

10. 发明授权

US10822471B2 Friction drive belt 有权
公开(公告)号：US10822471B2
公开(公告)日：2020-11-03
申请号：US13202414
申请日：2010-02-24
申请人： Shinji Takahashi , Kenichiro Furuta , Hiroyuki Shiriike , Tomoyuki Yamada , Hiroyuki Tachibana
发明人： Shinji Takahashi , Kenichiro Furuta , Hiroyuki Shiriike , Tomoyuki Yamada , Hiroyuki Tachibana
IPC分类号： F16G1/06 , C08K3/34 , C08L23/16 , F16G5/20 , C08L77/00 , C08K3/26 , C08K7/26 , C08K5/04 , C08K3/06 , C08L91/00
摘要： A friction drive belt (B) includes a belt body (10) that is wrapped around pulleys in contact therewith to transmit power. At least a pulley contact portion (15) of the belt main body (10) is made of a rubber composition containing 30-80 parts by mass of at least one layered silicate selected from a smectite group and a vermiculite group, per 100 parts by mass of raw rubber containing an ethylene-α-olefin elastomer.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式