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1. 发明申请

US20120091495A1 LIGHT REFLECTING SUBSTRATE AND PROCESS FOR MANUFACTURE THEREOF 审中-公开
标题翻译：光反射基板及其制造方法
公开(公告)号：US20120091495A1
公开(公告)日：2012-04-19
申请号：US13380779
申请日：2010-06-23
申请人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
IPC分类号： H01L33/60 , C25D5/44 , C25D7/00 , G02B5/08
CPC分类号： H01L33/60 , H01L2224/16 , H01L2224/48091 , H01L2224/73265 , H01L2924/1301 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： A light reflecting substrate comprises at least: an insulating layer and a metal layer disposed in contact with the insulating layer. The total reflectivity of light in the wavelength range of more than 320 nm and not more than 700 nm is not less than 50% and the total reflectivity of light in the wavelength range of 300 nm to 320 nm is not less than 60%. The light reflecting substrate further improves the emission power of the light-emitting device when used as the substrate therefor.
摘要翻译：光反射基板至少包括：绝缘层和设置成与绝缘层接触的金属层。在大于320nm且不大于700nm的波长范围内的光的总反射率不小于50％，并且在300nm至320nm的波长范围内的光的总反射率不小于60％。光反射基板当用作基板时，进一步提高了发光装置的发光功率。

2. 发明申请

US20110043239A1 PROBE CARD 审中-公开
标题翻译：探针卡
公开(公告)号：US20110043239A1
公开(公告)日：2011-02-24
申请号：US12922378
申请日：2009-03-09
申请人： Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi , Yusuke Hatanaka
发明人： Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi , Yusuke Hatanaka
IPC分类号： G01R31/00
CPC分类号： G01R1/0735 , G01R3/00 , G01R31/2863 , H01R12/7076 , H01R12/7082 , H01R13/2414
摘要： An object of the present invention is to provide a probe card which has good stability of the connection between testing electrodes and test electrodes even after exposure to high temperatures in the burn-in test, and is less susceptible to displacements in the positions of contact between the testing electrodes and conductive portions or between the conductive portions and probe needles or the test electrodes even after repeated use of the probe card. The probe card of the present invention is a probe card which includes a testing circuit board having the testing electrodes formed so as to correspond to the test electrodes and an anisotropic conductive member electrically connecting the test electrodes with the testing electrodes. The testing electrodes are formed so that at least ends of the testing electrodes protrude from a surface of the testing circuit board, and the anisotropic conductive member is a member which has an insulating base made of an anodized aluminum film having micropores therein and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in a thickness direction of the insulating base.
摘要翻译：本发明的目的是提供一种探针卡，即使在老化试验中暴露于高温之后，测试电极和测试电极之间的连接也具有良好的稳定性，并且不太容易受到在测试电极和导电部分，或者即使在重复使用探针卡之后，在导电部分和探针或测试电极之间。本发明的探针卡是一种探针卡，其包括测试电路板，其具有形成为对应于测试电极的测试电极和将测试电极与测试电极电连接的各向异性导电部件。测试电极形成为使得测试电极的至少一端从测试电路板的表面突出，并且各向异性导电构件是具有由其中具有微孔的阳极氧化铝膜制成的绝缘基底的构件，并且多个由导电材料制成的导电路径彼此绝缘，并且在绝缘基底的厚度方向上延伸穿过绝缘基底。

3. 发明申请

US20100264036A1 MICROSTRUCTURE 审中-公开
标题翻译：微结构
公开(公告)号：US20100264036A1
公开(公告)日：2010-10-21
申请号：US12743154
申请日：2008-08-21
申请人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
IPC分类号： C25D5/02 , C25D5/48
CPC分类号： H05K3/423 , C25D11/045 , C25D11/12 , C25D11/20 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/002 , H05K2201/0116 , H05K2201/10378 , H05K2203/0315 , H05K2203/1142 , H05K2203/1476 , H01L2924/00
摘要： Disclosed is a microfine structure which can be used as an anisotropic conductive member. Also disclosed is a method for producing such a microfine structure. Specifically disclosed is a microfine structure which is composed of a base having penetrating micropores at a density of not less than 10,000,000 micropores/mm2. In this microfine structure, some penetrating micropores are filled with a substance other than the material of the base.
摘要翻译：公开了可用作各向异性导电构件的微细结构。还公开了这种微细结构的制造方法。具体公开了一种微细结构，其由具有不小于10,000,000微孔/ mm 2的密度的穿透微孔的基底组成。在这种微细结构中，一些穿透微孔填充有除基底材料之外的物质。

4. 发明授权

US07838105B2 Microstructure and method of manufacturing the same 有权
标题翻译：微结构及其制造方法
公开(公告)号：US07838105B2
公开(公告)日：2010-11-23
申请号：US11856154
申请日：2007-09-17
申请人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
IPC分类号： C25D11/06 , B32B3/26
CPC分类号： C25D11/12 , B01D67/0065 , B01D67/0088 , B01D69/02 , B01D69/12 , B01D71/02 , B01D71/024 , B01D71/025 , B01D71/027 , B01D71/34 , B01D2325/02 , C25D11/045 , C25D11/24 , Y10T428/1234 , Y10T428/249953 , Y10T428/249969 , Y10T428/24997 , Y10T428/249974
摘要： Disclosed is a microstructure comprising an aluminum anodized film bearing through micropores, wherein a surface of the microstructure is covered with a protective film for preventing hydration of the aluminum anodized film. The microstructure may be used as a porous alumina membrane filter excellent in filtration rate and its stability with time.
摘要翻译：公开了一种微结构，其包括通过微孔的铝阳极氧化膜轴承，其中微结构的表面覆盖有用于防止铝阳极氧化膜的水合的保护膜。微结构可以用作过滤速率优异的多孔氧化铝膜过滤器及其随时间的稳定性。

5. 发明申请

US20080081173A1 Microstructure and method of manufacturing the same 有权
标题翻译：微结构及其制造方法
公开(公告)号：US20080081173A1
公开(公告)日：2008-04-03
申请号：US11702189
申请日：2007-02-05
申请人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
IPC分类号： C23F1/02
CPC分类号： C25D11/20 , C25D11/12 , C25D11/24 , Y10T428/12042 , Y10T428/12056 , Y10T428/249953 , Y10T428/24997 , Y10T428/249974
摘要： In a method of manufacturing a microstructure, an aluminum member having an aluminum substrate and a micropore-bearing anodized layer present on a surface of the aluminum substrate is subjected at least to, in order, a pore-ordering treatment which involves performing one or more cycles of a step that includes a first film dissolution treatment for dissolving 0.001 to 20 wt % of a material constituting the anodized layer and an anodizing treatment which follows the first film dissolution treatment; and a second film dissolution treatment for dissolving the anodized layer, thereby obtaining the microstructure having micropores formed on a surface thereof. This method enables a microstructure having an ordered array of pits to be obtained in a short period of time.
摘要翻译：在制造微结构的方法中，具有铝基板和存在于铝基板表面上的微孔阳极氧化层的铝构件至少依次进行孔序处理，其涉及执行一个或多个包括第一膜溶解处理以使构成阳极氧化层的材料为0.001〜20重量％的步骤的循环和在第一膜溶解处理之后的阳极氧化处理; 以及用于溶解阳极氧化层的第二膜溶解处理，从而获得在其表面上形成有微孔的微结构。该方法能够在短时间内获得具有有序排列阵列的微结构。

6. 发明申请

US20080057293A1 Microstructure and method of manufacturing the same 有权
标题翻译：微结构及其制造方法
公开(公告)号：US20080057293A1
公开(公告)日：2008-03-06
申请号：US11699447
申请日：2007-01-30
申请人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
IPC分类号： B32B3/26 , C25D5/00
CPC分类号： C25D11/045 , B01J23/42 , B01J23/52 , B01J35/0013 , B01J35/006 , B01J37/0211 , B01J37/0226 , B01J37/348 , C25D11/12 , C25D11/18 , Y10T428/249953 , Y10T428/24999
摘要： A microstructure includes an anodized aluminum layer that has on a surface thereof micropores, at least some of which contain a catalyst, in a micropore array with a degree of ordering of at least 40%. A method of manufacturing the microstructure includes anodizing an aluminum member to form on its surface an anodized layer having micropores, removing the aluminum member, and supporting a catalyst on at least part of the anodized layer. The microstructure is excellent in heat resistance.
摘要翻译：微结构包括阳极氧化铝层，其表面上具有至少40％的有序度的微孔阵列中的微孔，其至少一些含有催化剂。制造微结构的方法包括阳极氧化铝构件以在其表面上形成具有微孔的阳极氧化层，去除铝构件，并在至少部分阳极氧化层上支撑催化剂。微结构耐热性优异。

7. 发明授权

US07722754B2 Microstructure and method of manufacturing the same 有权
标题翻译：微结构及其制造方法
公开(公告)号：US07722754B2
公开(公告)日：2010-05-25
申请号：US11808502
申请日：2007-06-11
申请人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
IPC分类号： C25D11/06 , B32B3/26
CPC分类号： C25D11/12 , C25D11/045 , C25D11/18 , Y10T428/249953
摘要： A method of manufacturing a microstructure wherein an aluminum member having an aluminum substrate and a micropore-bearing anodized film present on a surface of the aluminum substrate is subjected at least to, in order, a pore-ordering treatment which involves performing one or more cycles of a step that includes a first film dissolution treatment for dissolving the anodized film until a barrier layer has a thickness of 3 to 50 nm, and an anodizing treatment which follows the first film dissolution treatment; and a second film dissolution treatment for dissolving the anodized film so that a ratio of a diameter of a micropore opening “a” to a micropore diameter at a height “a/2” from a micropore bottom “b” (a/b) is in a range of 0.9 to 1.1, whereby the microstructure having micropores formed on a surface thereof is obtained. The manufacturing method enables microstructures having an ordered array of pits to be obtained in a short period of time.
摘要翻译：一种制造微结构的方法，其中具有铝基板和存在于铝基板表面上的具有微孔阳极氧化膜的铝构件至少依次进行包括执行一个或多个循环的孔序处理包括用于溶解阳极氧化膜直到阻挡层具有3至50nm的厚度的第一膜溶解处理和在第一膜溶解处理之后的阳极氧化处理的步骤; 以及用于溶解阳极化膜的第二膜溶解处理，使得微孔开口“a”的直径与微孔底部“b”（a / b）的高度“a / 2”处的微孔直径的比率为在0.9〜1.1的范围内，由此得到其表面上形成微孔的微结构。该制造方法能够在短时间内获得具有有序排列阵列的微结构。

8. 发明授权

US08742263B2 Anisotropically conductive member and method for producing the same 有权
标题翻译：各向异性导电构件及其制造方法
公开(公告)号：US08742263B2
公开(公告)日：2014-06-03
申请号：US13201784
申请日：2010-02-17
申请人： Tadabumi Tomita , Yusuke Hatanaka , Shinya Suzuki , Atsushi Matsuura , Yoshinori Hotta , Akio Uesugi
发明人： Tadabumi Tomita , Yusuke Hatanaka , Shinya Suzuki , Atsushi Matsuura , Yoshinori Hotta , Akio Uesugi
IPC分类号： H05K1/11
CPC分类号： H01R13/2435 , H01B1/023 , H01R12/7082
摘要： Provided is an anisotropically conductive member that has a dramatically increased density of disposed conductive paths, can be used as an electrically connecting member or inspection connector for electronic components such as semiconductor devices even today when still higher levels of integration have been achieved, and has excellent flexibility. The anisotropically conductive member includes an insulating base and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in the thickness direction of the insulating base, one end of each of the conductive paths protruded on one side of the insulating base, the other end of each of the conductive paths exposed or protruded on the other side thereof. The insulating base is made of a resin material and the conductive paths are formed at a density of at least 1,000,000 conductive paths/mm2.
摘要翻译：提供具有显着增加的设置导电路径密度的各向异性导电构件，甚至可以用作电连接构件或诸如半导体器件的电子部件的检查连接器，甚至在仍然具有更高的集成度的情况下也具有优异的灵活性。各向异性导电构件包括绝缘基底和由导电材料制成的多个彼此绝缘的导电路径，并且在绝缘基底的厚度方向上延伸穿过绝缘基底，每个导电路径的一端突出在绝缘基座的一侧，每个导电路径的另一端在其另一侧上露出或突出。绝缘基底由树脂材料制成，并且导电路径以至少1,000,000导电通路/ mm2的密度形成。

9. 发明申请

US20120256224A1 INSULATED SUBSTRATE, PROCESS FOR PRODUCTION OF INSULATED SUBSTRATE, PROCESS FOR FORMATION OF WIRING LINE, WIRING SUBSTRATE, AND LIGHT-EMITTING ELEMENT 审中-公开
标题翻译：绝缘基板，绝缘基板的制造工艺，布线形成工艺，布线基板和发光元件
公开(公告)号：US20120256224A1
公开(公告)日：2012-10-11
申请号：US13518770
申请日：2010-12-14
申请人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
IPC分类号： H01L33/50 , C25D11/12 , C25D11/18 , C25D5/48 , H05K1/05 , C25D7/00
CPC分类号： C25D11/24 , C23C18/1608 , C23C18/1848 , C25D5/022 , C25D11/04 , C25D11/16 , C25D11/246 , H01L33/486 , H01L33/50 , H01L33/60 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , H01L2924/10253 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is an insulating substrate which includes an aluminum substrate and an anodized film covering a whole surface of the aluminum substrate and in which the anodized film contains intermetallic compound particles with a circle equivalent diameter of 1 μm or more in an amount of up to 2,000 pcs/mm3. Also provided is a method for manufacturing the insulating substrate which includes an anodizing treatment step for anodizing the aluminum substrate. The anodized film of the insulating substrate covering the whole surface of the aluminum substrate contains intermetallic compound particles with a circle equivalent diameter of 1 μm or more in an amount of up to 2,000 pcs/mm3.
摘要翻译：提供了一种绝缘基板，其包括铝基板和覆盖铝基板的整个表面的阳极氧化膜，其中阳极氧化膜含有等于或大于等于等于2当量的金属间化合物颗粒，其数量可达2,000个 / mm3。还提供了一种用于制造绝缘基板的方法，其包括用于阳极氧化铝基板的阳极氧化处理步骤。覆盖铝基板整个表面的绝缘基板的阳极化膜含有等于或大于等于2,000个/ mm 3的圆当量直径为1μm以上的金属间化合物颗粒。

10. 发明申请

US20070219092A1 Catalyst supporting body 审中-公开
标题翻译：催化剂支撑体
公开(公告)号：US20070219092A1
公开(公告)日：2007-09-20
申请号：US11723250
申请日：2007-03-19
申请人： Yusuke Hatanaka , Yoshinori Hotta , Hirokazu Sawada , Akio Uesugi
发明人： Yusuke Hatanaka , Yoshinori Hotta , Hirokazu Sawada , Akio Uesugi
IPC分类号： B01J21/04
CPC分类号： B01J37/0226 , B01J23/42 , B01J23/52 , B01J32/00 , B01J35/002 , B01J35/1004 , B01J37/06
摘要： There is provided a catalyst supporting body including a porous alumina support and a catalyst supported on the porous alumina support in which the surface of the porous alumina support has at least one selected from the group consisting of irregularities having an average wavelength of 5 to 100 μm, irregularities having an average wavelength of 0.5 to 5 μm, and irregularities having an average wavelength of 0.01 to 0.5 μm. The catalyst supporting body has an excellent catalytic function.
摘要翻译：提供了一种催化剂载体，其包括多孔氧化铝载体和负载在多孔氧化铝载体上的催化剂，其中多孔氧化铝载体的表面具有选自平均波长为5至100μm的不规则性中的至少一种，平均波长为0.5〜5μm的凹凸，平均波长为0.01〜0.5μm的凹凸。催化剂负载体具有优异的催化功能。

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