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1. 发明授权

US09013891B2 3-D integrated package 有权
标题翻译： 3-D集成包装
公开(公告)号：US09013891B2
公开(公告)日：2015-04-21
申请号：US13417103
申请日：2012-03-09
申请人： Yunpeng Song , Yongsheng Liu , Hongyu Deng
发明人： Yunpeng Song , Yongsheng Liu , Hongyu Deng
IPC分类号： H05K7/00 , H05K1/00 , H05K1/18 , H05K1/14 , H05K1/11 , H01R9/00 , H01P1/04 , H01P3/00 , H01P5/08 , H05K1/02
CPC分类号： H01P5/08 , H01P1/047 , H01P3/003 , H01P3/08 , H05K1/0227 , H05K1/0243 , H05K1/0251 , H05K1/112 , H05K2201/09236
摘要： An electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.
摘要翻译：电子封装包括一个或多个绝缘层和导电传输线。导电传输线包括基本上平行于一个或多个绝缘层设置的信号迹线。导电传输线还包括电耦合到信号迹线的一个或多个信号通孔。一个或多个信号通孔被配置成穿过一个或多个绝缘层的至少一部分。电子封装还包括基本上平行于一个或多个绝缘层的一个或多个导电接地平面。地平面包括一个或多个通过地面切割的信号。通过接地切口的一个或多个信号在一个或多个信号通孔和一个或多个接地平面之间提供间隙。

2. 发明申请

US20130279139A1 TRANSISTOR OUTLINE CAN WITH IN-LINE ELECTRICAL COUPLINGS 有权
标题翻译：晶体管外形可与内部电气耦合
公开(公告)号：US20130279139A1
公开(公告)日：2013-10-24
申请号：US13452753
申请日：2012-04-20
申请人： Hongyu Deng , Yunpeng Song , Maziar Amirkiai , Martin Kalberer
发明人： Hongyu Deng , Yunpeng Song , Maziar Amirkiai , Martin Kalberer
IPC分类号： H05K7/02
CPC分类号： G02B6/4279 , G02B6/4206 , G02B6/4246 , G02B6/4263 , G02B6/428 , G02B6/4281 , G02B6/4292
摘要： An example embodiment includes a TO can including a header, an RF pin opening, an internal volume, an RF pin, a submount, and a flex circuit. The header defines the RF pin opening. The internal volume is defined by a TO can housing and an interior header surface. The RF pin extends through the RF pin opening such that a first surface connection is located in the internal volume and a second surface connection is located outside of the internal volume and extends past an exterior header surface. The submount is located in the internal volume and the submount includes a submount trace. The submount trace includes a pin connection portion in-line with the RF pin and electrically coupled to the first surface connection. The flex circuit includes a flex trace further including a flex trace connection in-line with the RF pin and electrically coupled to the second surface connection.
摘要翻译：示例性实施例包括TO可以包括报头，RF引脚开口，内部卷，RF引脚，子基座和柔性电路。标头定义RF引脚开口。内部容积由TO罐壳体和内部集管表面限定。 RF引脚延伸穿过RF引脚开口，使得第一表面连接位于内部容积中，并且第二表面连接位于内部容积的外部并且延伸经过外部集管表面。子安装板位于内部卷中，子安装板包含一个子安装架跟踪。副安装座轨迹包括与RF引脚成直线并且电耦合到第一表面连接的引脚连接部分。柔性电路包括柔性迹线，其还包括与RF引脚成直线并且电耦合到第二表面连接的挠曲迹线连接。

3. 发明授权

US08854836B2 Transistor outline can with in-line electrical couplings 有权
标题翻译：晶体管轮廓可以使用直插式电气联轴器
公开(公告)号：US08854836B2
公开(公告)日：2014-10-07
申请号：US13452753
申请日：2012-04-20
申请人： Hongyu Deng , Yunpeng Song , Maziar Amirkiai , Martin Kalberer
发明人： Hongyu Deng , Yunpeng Song , Maziar Amirkiai , Martin Kalberer
IPC分类号： H05K7/00
CPC分类号： G02B6/4279 , G02B6/4206 , G02B6/4246 , G02B6/4263 , G02B6/428 , G02B6/4281 , G02B6/4292
摘要： An example embodiment includes a TO can including a header, an RF pin opening, an internal volume, an RF pin, a submount, and a flex circuit. The header defines the RF pin opening. The internal volume is defined by a TO can housing and an interior header surface. The RF pin extends through the RF pin opening such that a first surface connection is located in the internal volume and a second surface connection is located outside of the internal volume and extends past an exterior header surface. The submount is located in the internal volume and the submount includes a submount trace. The submount trace includes a pin connection portion in-line with the RF pin and electrically coupled to the first surface connection. The flex circuit includes a flex trace further including a flex trace connection in-line with the RF pin and electrically coupled to the second surface connection.
摘要翻译：示例性实施例包括TO可以包括报头，RF引脚开口，内部卷，RF引脚，子基座和柔性电路。标头定义RF引脚开口。内部容积由TO罐壳体和内部集管表面限定。 RF引脚延伸穿过RF引脚开口，使得第一表面连接位于内部容积中，并且第二表面连接位于内部容积的外部并且延伸经过外部集管表面。子安装板位于内部卷中，子安装板包含一个子安装架跟踪。副安装座轨迹包括与RF引脚成直线并且电耦合到第一表面连接的引脚连接部分。柔性电路包括柔性迹线，其还包括与RF引脚成直线并且电耦合到第二表面连接的挠曲迹线连接。

4. 发明申请

US20120032752A1 VERTICAL QUASI-CPWG TRANSMISSION LINES 有权
标题翻译：垂直准CPWG传输线
公开(公告)号：US20120032752A1
公开(公告)日：2012-02-09
申请号：US12849629
申请日：2010-08-03
申请人： Yunpeng Song , Yanyang Zhao , Yuheng Lee , Jianying Zhou
发明人： Yunpeng Song , Yanyang Zhao , Yuheng Lee , Jianying Zhou
IPC分类号： H01P5/02
CPC分类号： H01P3/006 , H01P5/022 , H01P5/028
摘要： In one example embodiment, a coplanar waveguide signal transition element transitions high-speed signals between vertically stacked coplanar waveguide transmission lines. The signal transition element comprises one or more dielectric layers and a plurality of electrically conductive vias extending through at least a portion of the one or more dielectric layers. The vias include one or more signal vias and one or more ground vias that are configured to transition signals between the vertically stacked coplanar waveguide transmission lines. The signal transition element also comprises a ground plane disposed within the one or more dielectric layers and electrically coupled to the one or more ground vias. The ground plane has one or more openings through which the one or more signal vias respectively pass.
摘要翻译：在一个示例性实施例中，共面波导信号过渡元件在垂直堆叠的共面波导传输线之间转换高速信号。信号转换元件包括一个或多个电介质层和延伸穿过该一个或多个电介质层的至少一部分的多个导电通孔。通孔包括一个或多个信号通路和一个或多个接地通孔，其配置成在垂直堆叠的共面波导传输线之间转换信号。信号过渡元件还包括设置在一个或多个电介质层内并且电耦合到一个或多个接地通孔的接地平面。接地平面具有一个或多个开口，一个或多个信号通孔通过该开口分别通过。

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