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1. 发明申请

US20110097597A1 IMMERSION TIN SILVER PLATING IN ELECTRONICS MANUFACTURE 有权
标题翻译：电子制造中的镀银镀银
公开(公告)号：US20110097597A1
公开(公告)日：2011-04-28
申请号：US12607375
申请日：2009-10-28
申请人： Yung-Herng Yau , Xingping Wang , Cai Wang , Robert Farrell , Pingping Ye , Edward J. Kudrak, JR. , Karl F. Wengenroth , Joseph A. Abys
发明人： Yung-Herng Yau , Xingping Wang , Cai Wang , Robert Farrell , Pingping Ye , Edward J. Kudrak, JR. , Karl F. Wengenroth , Joseph A. Abys
IPC分类号： B32B15/01 , B05D1/18
CPC分类号： C23C18/54 , C23C18/48 , Y10T428/12715
摘要： A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.
摘要翻译：提供了在铜基板的表面上沉积耐晶须锡基涂层的方法。该方法可用于制备包含具有表面的铜基材的制品; 以及在所述基板的表面上的锡基涂层，其中所述锡基涂层的厚度为0.5微米至1.5微米，并且具有形成铜 - 锡金属间化合物的阻力，其中所述耐铜 - 锡金属间化合物的特征在于，当制品暴露于至少七个加热和冷却循环时，其中每个循环包括使制品经受至少217℃的温度，然后冷却至约20℃的温度。并且约28℃，仍然存在不超过至少0.25微米厚的铜的锡涂层的区域。

2. 发明授权

US09175400B2 Immersion tin silver plating in electronics manufacture 有权
标题翻译：在电子制造中浸锡锡镀银
公开(公告)号：US09175400B2
公开(公告)日：2015-11-03
申请号：US12607375
申请日：2009-10-28
申请人： Yung-Herng Yau , Xingping Wang , Cai Wang , Robert Farrell , Pingping Ye , Edward J. Kudrak, Jr. , Karl F. Wengenroth , Joseph A. Abys
发明人： Yung-Herng Yau , Xingping Wang , Cai Wang , Robert Farrell , Pingping Ye , Edward J. Kudrak, Jr. , Karl F. Wengenroth , Joseph A. Abys
IPC分类号： C23C18/54 , C23C18/48
CPC分类号： C23C18/54 , C23C18/48 , Y10T428/12715
摘要： A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.
摘要翻译：提供了在铜基板的表面上沉积耐晶须锡基涂层的方法。该方法可用于制备包含具有表面的铜基材的制品; 以及在所述基板的表面上的锡基涂层，其中所述锡基涂层的厚度为0.5微米至1.5微米，并且具有形成铜 - 锡金属间化合物的阻力，其中所述耐铜 - 锡金属间化合物的特征在于，当制品暴露于至少七个加热和冷却循环时，其中每个循环包括使制品经受至少217℃的温度，然后冷却至约20℃的温度。并且约28℃，仍然存在不超过至少0.25微米厚的铜的锡涂层的区域。

3. 发明授权

US08349393B2 Silver plating in electronics manufacture 有权
公开(公告)号：US08349393B2
公开(公告)日：2013-01-08
申请号：US10902398
申请日：2004-07-29
申请人： Yung-Herng Yau , Thomas B. Richardson , Joseph A. Abys , Karl F. Wengenroth , Anthony Fiore , Chen Xu , Chonglun Fan , John Fudala
发明人： Yung-Herng Yau , Thomas B. Richardson , Joseph A. Abys , Karl F. Wengenroth , Anthony Fiore , Chen Xu , Chonglun Fan , John Fudala
IPC分类号： B05D5/00
CPC分类号： H05K1/09 , C09D1/00 , C23C18/16 , C23C18/1614 , C23C18/1616 , C23C18/1633 , C23C18/1683 , C23C18/1687 , C23C18/42 , C23C18/44 , C23C18/54 , C23C22/06 , C23C22/58 , C25D3/46 , C25D3/56 , C25D3/64 , H05K3/244 , H05K3/422 , H05K2203/0257 , H05K2203/073 , Y10S205/916
摘要： Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.

4. 发明授权

US06524644B1 Process for selective deposition of OSP coating on copper, excluding deposition on gold 有权
标题翻译：在铜上选择性沉积OSP涂层的方法，不包括在金上沉积
公开(公告)号：US06524644B1
公开(公告)日：2003-02-25
申请号：US09383718
申请日：1999-08-26
申请人： Karl F. Wengenroth
发明人： Karl F. Wengenroth
IPC分类号： B05D512
CPC分类号： B23K1/20 , B23K35/3615 , B23K2101/40 , C23C30/00 , C23F11/10 , C23F11/149 , H05K3/282 , H05K2203/0591 , H05K2203/124
摘要： A method is provided for the selective deposition of an organic solderability preservative (OSP) coating on copper surfaces of articles such as electronic components, e.g., printed wiring boards, to serve as a protective coating and preserve the solderability of the copper surface while substantially excluding gold surfaces from attracting the same OSP coating which coating causes cosmetic defects in the form of staining and may reduce the conductivity of the gold contact surface. The method improves the conventional OSP process and utilizes a pre-treatment of the copper surface before applying the OSP coating comprising treating the cleaned and preferably micro-etched copper with an aqueous solution of benzimidazole or derivative thereof to form a precoat on the copper surface. After the pre-treatment step, the precoated copper surface is conventionally treated with a suitable OSP solution such as an aqueous solution of a substituted benzimidazole compound, preferably at the 2-position.
摘要翻译：提供了一种用于选择性地将有机可焊性防腐剂（OSP）涂层选择性沉积在诸如电子部件（例如印刷线路板）的物品的铜表面上以用作保护涂层并保持铜表面的可焊性，同时基本上排除金表面吸引相同的OSP涂层，其涂层以染色的形式引起化妆品缺陷并且可能降低金接触表面的导电性。该方法改进了常规的OSP工艺，并且在施加OSP涂层之前利用铜表面的预处理，包括用苯并咪唑或其衍生物的水溶液处理清洁并优选微蚀刻的铜，以在铜表面上形成预涂层。在预处理步骤之后，预涂铜表面通常用合适的OSP溶液如取代的苯并咪唑化合物的水溶液，优选在2-位处理。

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