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1. 发明申请

US20070106404A1 Multi-channel speaker system and a connection system thereof 有权
标题翻译：多声道扬声器系统及其连接系统
公开(公告)号：US20070106404A1
公开(公告)日：2007-05-10
申请号：US10554431
申请日：2004-03-18
申请人： Yun Chung , Moon Song
发明人： Yun Chung , Moon Song
IPC分类号： G06F17/00 , H04B3/00
CPC分类号： H04R5/04 , H04R2420/03 , H04S3/00
摘要： The present invention relates to a multi-channel speaker system and a wiring device thereof. The wiring device for a multi-channel speaker system according to an embodiment of the present invention comprises a serial audio signal circuit and a plurality of audio signal separating circuits. The serial audio signal circuit SAC generates a single serial digital audio signal by synthesizing the plurality of analog signals that are generated by the analog audio signal generating circuit, and outputs the same. The audio signal separating circuit receives the serial digital audio signal and separates a corresponding digital signal, and it converts the separated digital signal to an analog signal. Therefore, the plurality of speakers can be connected to the serial audio signal circuit SAC through a single series wire or at least two parallel wires.
摘要翻译：本发明涉及一种多声道扬声器系统及其配线装置。根据本发明的实施例的用于多声道扬声器系统的接线装置包括串行音频信号电路和多个音频信号分离电路。串行音频信号电路SAC通过合成由模拟音频信号发生电路产生的多个模拟信号，并产生一个串行数字音频信号，并输出。音频信号分离电路接收串行数字音频信号并分离相应的数字信号，并将分离的数字信号转换为模拟信号。因此，多个扬声器可以通过单个串联线或至少两条平行线连接到串行音频信号电路SAC。

2. 发明申请

US20060171698A1 Chip scale image sensor module and fabrication method of same 审中-公开
标题翻译：芯片尺度图像传感器模块及其制造方法
公开(公告)号：US20060171698A1
公开(公告)日：2006-08-03
申请号：US11299755
申请日：2005-12-13
申请人： Jin Ryu , Moon Song
发明人： Jin Ryu , Moon Song
IPC分类号： G02B7/28
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14683 , H01L31/0203 , H01L31/02325 , H01L2224/05001 , H01L2224/05026 , H01L2224/05548 , H01L2224/16 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/1532 , H04N5/2257
摘要： The present invention provides a chip scale image sensor module and the fabrication method of the same which includes an optical filter removing specific wavelength from the light into the image sensor and a glass layer attached to the optical filter to protect a coating layer, forming pad electrodes on the backside thereof. The invention also includes an image sensor attached to the pad electrodes with redistribution pads formed from the pad electrodes in the backside, and solder balls provided on the backside of the image sensor. The invention reduces the size of the module, screens and uses good quality image sensor modules, saving the manufacturing costs, and having advantage in mass production.
摘要翻译：本发明提供了一种芯片级图像传感器模块及其制造方法，其包括从滤光器去除特定波长的光学滤波器到图像传感器中的玻璃层和附着到滤光器的玻璃层，以保护涂层，形成焊盘电极在其背面。本发明还包括附接到焊盘电极的图像传感器，其具有由背面中的焊盘电极形成的再分布焊盘，以及设置在图像传感器的背面上的焊球。本发明减小了模块的尺寸，屏幕和使用高质量的图像传感器模块，节省了制造成本，并且在批量生产中具有优势。

3. 发明申请

US20070249095A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US20070249095A1
公开(公告)日：2007-10-25
申请号：US11769489
申请日：2007-06-27
申请人： Moon Song , Dong Kim , Jin Ryu
发明人： Moon Song , Dong Kim , Jin Ryu
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/3114 , H01L24/10 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter attached on the pad electrodes of the wafer by means of a bonding agent, terminals electrically connected to the pad electrodes, respectively, in via holes formed at the other side surface of the wafer, which is opposite to the pad electrodes, and bump electrodes, each of which is connected to one side of each of the terminals. The present invention is capable of minimizing the size of a semiconductor package having an image sensor, which is referred to as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), through the application of a wafer level package technology, thereby reducing the manufacturing costs of the semiconductor package and accomplishing production on a large scale.
摘要翻译：本文公开了用于数字光学仪器的半导体封装及其制造方法。半导体封装包括由硅材料制成的晶片，并且在其一个侧表面上形成有焊盘电极，IR滤光器通过粘结剂分别附着在晶片的焊盘电极上，分别与焊盘电极电连接，在与晶片电极相对的晶片的另一侧表面上形成的通孔以及每个端子的一侧连接的凸起电极。通过采用晶片级封装技术，本发明能够使具有图像传感器（称为互补金属氧化物半导体（CMOS）或电荷耦合器件（CCD））的半导体封装的尺寸最小化，从而降低半导体封装的制造成本并大量实现生产。

4. 发明申请

US20070103075A1 Green sheet for black layers, plasma display panels using the green sheet and methods for fabricating the plasma display panels 审中-公开
标题翻译：用于黑色层的绿色片材，使用生片的等离子体显示面板和用于制造等离子体显示面板的方法
公开(公告)号：US20070103075A1
公开(公告)日：2007-05-10
申请号：US11593634
申请日：2006-11-07
申请人： Je Kim , Dae Park , Byung Seo , Moon Song , Byung Ryu , Won Jeon , Hong Lee
发明人： Je Kim , Dae Park , Byung Seo , Moon Song , Byung Ryu , Won Jeon , Hong Lee
IPC分类号： H01J17/49
CPC分类号： H01J11/44 , H01J9/02 , H01J9/2278 , H01J9/242 , H01J11/12 , H01J2211/36 , H01J2211/38 , H01J2211/444
摘要： A plasma display panel with improved brightness and reduced discharge voltage is disclosed. The plasma display panel comprises an upper panel and a lower panel facing each other through barrier ribs wherein a first dielectric layer is formed on the upper panel and second dielectric layers containing a black pigment are formed by patterning on the first dielectric layer.
摘要翻译：公开了一种具有改善的亮度和降低的放电电压的等离子体显示面板。等离子体显示面板包括通过障壁彼此面对的上面板和下面板，其中第一介电层形成在上面板上，并且包含黑色颜料的第二介电层通过图案化形成在第一介电层上。

5. 发明申请

US20070046566A1 Collision electrification particle, electronic paper display device using the same and manufacturing method thereof 审中-公开
标题翻译：碰撞带电粒子，使用其的电子纸显示装置及其制造方法
公开(公告)号：US20070046566A1
公开(公告)日：2007-03-01
申请号：US11509644
申请日：2006-08-25
申请人： Moon Song
发明人： Moon Song
IPC分类号： G03G9/00 , G09G3/00
CPC分类号： G02F1/167 , C09B67/0063 , C09B67/0097 , G02F1/1671 , G02F2001/1678
摘要： A collision electrification particle, an electronic paper display device using the same and a manufacturing method thereof are disclosed. An electrified particle stabilizing agent is coated at the outside of polymer resin in a spherical shape. As a result, only an electrified particle stabilizing agent is used without an additional electric charge controlling agent. Consequently, it is possible to easily manufacture the electronic paper display device. Furthermore, it is possible to finely control the polarity of the particle by controlling the amount and the electrification magnitude of the particle stabilizing agent.
摘要翻译：公开了一种碰撞带电粒子，使用其的电子纸显示装置及其制造方法。带电的颗粒稳定剂在聚合物树脂的外部被涂覆成球形。结果，仅使用带电的颗粒稳定剂而不需要额外的电荷控制剂。因此，可以容易地制造电子纸显示装置。此外，可以通过控制颗粒稳定剂的量和通电量来精细地控制颗粒的极性。

6. 发明申请

US20060000245A1 Balance weight for washing machine 审中-公开
标题翻译：平衡重量为洗衣机
公开(公告)号：US20060000245A1
公开(公告)日：2006-01-05
申请号：US11033886
申请日：2005-01-13
申请人： Kang Won , Moon Song
发明人： Kang Won , Moon Song
IPC分类号： D06F37/22
CPC分类号： D06F37/20
摘要： Balance weight is mounted on a tub of a washing machine, balances the tub, and reduces the vibration of the tub. The balance weight comprises a plurality of weight plates piled up, and at least one coupling member securing the weight plates to the tub. The coupling member comprises at least one first member binding the weight plates into a body, and at least one second member stably securing the bound weight plates to the tub.
摘要翻译：平衡重被安装在洗衣机的洗衣盆上，平衡桶，并减少洗涤桶的振动。平衡配重包括堆叠的多个重量板，以及将重物板固定到桶的至少一个联接构件。联接构件包括将配重板接合到主体中的至少一个第一构件，以及至少一个第二构件，其将结合的重量板稳固地固定到水桶。

7. 发明申请

US20050183471A1 Control panel assembly for washing machine 有权
标题翻译：洗衣机控制面板组件
公开(公告)号：US20050183471A1
公开(公告)日：2005-08-25
申请号：US10933426
申请日：2004-09-03
申请人： Dong Kang , Moon Song
发明人： Dong Kang , Moon Song
IPC分类号： D06F37/00 , D06F39/00
CPC分类号： D06F39/005 , H01H2219/006 , H01H2219/014 , H01H2219/0622 , H01H2231/012 , H01H2233/036
摘要： A control panel assembly for a washing machine is disclosed. The structure of the control panel assembly provided with a decoration member is greatly simplified. The control panel assembly includes a control panel mounted on an outer case of the washing machine, a first decoration member penetrating the control panel and enclosing a push button, a second decoration member enclosing the first decoration member. The second decoration member supports a rear side of the first decoration member and is supported by the control panel and the first decoration member. A transparent cover covers the control panel and supports a front portion of the first decoration member.
摘要翻译：公开了一种用于洗衣机的控制面板组件。设置有装饰构件的控制面板组件的结构大大简化。控制面板组件包括安装在洗衣机的外壳上的控制面板，穿过控制面板并包围按钮的第一装饰构件，封闭第一装饰构件的第二装饰构件。第二装饰构件支撑第一装饰构件的后侧并且由控制面板和第一装饰构件支撑。透明盖覆盖控制面板并支撑第一装饰构件的前部。

8. 发明申请

US20070046623A1 Electronic paper display device, manufacturing method and driving method thereof 有权
标题翻译：电子纸显示装置及其制造方法及其驱动方法
公开(公告)号：US20070046623A1
公开(公告)日：2007-03-01
申请号：US11509678
申请日：2006-08-25
申请人： Moon Song
发明人： Moon Song
IPC分类号： G09G3/34
CPC分类号： G09G3/344 , G02F1/133345 , G02F1/167 , G02F2001/1676 , G09G2320/0252
摘要： An electronic paper display device, a manufacturing method and a driving method thereof are disclosed. Micro protrusion members are formed at electrodes or at insulating layers. Consequently, the electrophoretic particles are prevented from being securely attached to an upper or the lower structure, and therefore, the quality of pictures is improved, and the contrast ratio of the pictures is increased. The relative sizes and the injection amounts of two kinds of electrophoretic particles are changed such that the relative sizes and the injection amounts of the electrophoretic particles are different from each other. Consequently, the driving voltage is lowered by excessively electrifying the electrophoretic particles of one kind. Protrusions are formed at the corresponding electrode such that a relatively large electric field is distributed around the electrode at which electrophoretic particles are located in the initial stage of voltage application. Consequently, the electrophoretic particles are easily separated from the electrode and moved even at low driving voltage. As such, the voltage level of the driving voltage pulse is lowered. Consequently, it is possible to further increase the response speed of the driving devices and to lower the internal voltage of the devices, thereby reducing the costs related to the driving devices.
摘要翻译：公开了一种电子纸显示装置，其制造方法和驱动方法。微电极形成于电极或绝缘层。因此，防止了电泳颗粒牢固地附着到上部或下部结构，因此提高了图像的质量，并且增加了图像的对比度。改变两种电泳粒子的相对尺寸和注射量，使得电泳粒子的相对尺寸和注射量彼此不同。因此，通过使一种电泳粒子过度带电来降低驱动电压。在相应的电极处形成突起，使得在电压施加的初始阶段，电极周围的电极分布相对较大的电场。因此，电泳粒子容易与电极分离，甚至在低驱动电压下移动。因此，驱动电压脉冲的电压电平降低。因此，可以进一步提高驱动装置的响应速度并降低装置的内部电压，从而降低与驱动装置相关的成本。

9. 发明申请

US20060170086A1 Semiconductor package and method of manufacturing the same 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20060170086A1
公开(公告)日：2006-08-03
申请号：US11296300
申请日：2005-12-08
申请人： Moon Song , Dong Kim , Jin Ryu
发明人： Moon Song , Dong Kim , Jin Ryu
IPC分类号： H01L21/50 , H01L23/02
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/3114 , H01L24/10 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter attached on the pad electrodes of the wafer by means of a bonding agent, terminals electrically connected to the pad electrodes, respectively, in via holes formed at the other side surface of the wafer, which is opposite to the pad electrodes, and bump electrodes, each of which is connected to one side of each of the terminals. The present invention is capable of minimizing the size of a semiconductor package having an image sensor, which is referred to as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), through the application of a wafer level package technology, thereby reducing the manufacturing costs of the semiconductor package and accomplishing production on a large scale.
摘要翻译：本文公开了用于数字光学仪器的半导体封装及其制造方法。半导体封装包括由硅材料制成的晶片，并且在其一个侧表面上形成有焊盘电极，IR滤光器通过粘结剂分别附着在晶片的焊盘电极上，分别与焊盘电极电连接，在与晶片电极相对的晶片的另一侧表面上形成的通孔以及每个端子的一侧连接的凸起电极。通过采用晶片级封装技术，本发明能够使具有图像传感器（称为互补金属氧化物半导体（CMOS）或电荷耦合器件（CCD））的半导体封装的尺寸最小化，从而降低半导体封装的制造成本并大量实现生产。

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