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1. 发明授权

US5824182A Adhesive tapes 失效
公开(公告)号：US5824182A
公开(公告)日：1998-10-20
申请号：US433243
申请日：1995-05-02
申请人： Yukinori Sakumoto , Shigeyuki Yokoyama , Akihiro Shibuya , Atsushi Koshimura
发明人： Yukinori Sakumoto , Shigeyuki Yokoyama , Akihiro Shibuya , Atsushi Koshimura
IPC分类号： C08L9/02 , C08L79/08 , C09J7/02 , C09J7/04 , C09J109/02 , C09J121/02 , C09J161/06 , H01L23/495 , H05K7/14
CPC分类号： H01L23/49558 , C09J109/02 , C09J121/02 , C09J161/06 , C09J7/0246 , C09J7/0282 , C09J7/045 , C08L79/08 , C08L9/02 , C09J2201/122 , C09J2479/086 , H01L2924/0002 , Y10T156/1093 , Y10T29/49208 , Y10T428/28 , Y10T428/2852 , Y10T428/2887 , Y10T428/2891 , Y10T428/31721
摘要： An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising (i) a resol type phenol resin, and (ii) an acrylonitrile/butadiene copolymer, in a proportion of from 100 to 500 parts by weight of said resol type phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.

2. 发明授权

US5091251A Adhesive tapes and semiconductor devices 失效
标题翻译：粘合带和半导体器件
公开(公告)号：US5091251A
公开(公告)日：1992-02-25
申请号：US528203
申请日：1990-05-24
申请人： Yukinori Sakumoto , Shigeyuki Yokoyama , Akihiro Shibuya , Nobuyuki Nakayama , Atsushi Koshimura
发明人： Yukinori Sakumoto , Shigeyuki Yokoyama , Akihiro Shibuya , Nobuyuki Nakayama , Atsushi Koshimura
IPC分类号： B32B15/08 , C09J7/02 , H01L23/495 , H05K3/38
CPC分类号： H01L21/6836 , B32B15/08 , C09J7/0242 , C09J7/0296 , H01L23/49513 , H01L23/49531 , H01L24/49 , C09J2203/326 , C09J2400/163 , H01L2221/68327 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/4911 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19107 , H05K3/386 , Y10T428/1438 , Y10T428/1443 , Y10T428/2804 , Y10T428/2839 , Y10T428/2848 , Y10T428/31721
摘要： Adhesive tapes suitable for use in wire-bonded semiconductor devices are disclosed. They are each composed of a heat-resistant substrate formed of at least one layer, a copper foil provided on one side of the substrate, and a semi-cured adhesive layer and a protective film provided successively on the other side of the substrate. Semiconductor devices fabricated using such adhesive tapes are also disclosed.

3. 发明授权

US5891566A Adhesive tapes 失效
标题翻译：胶带
公开(公告)号：US5891566A
公开(公告)日：1999-04-06
申请号：US806448
申请日：1997-02-26
申请人： Yukinori Sakumoto , Shigeyuki Yokoyama , Akihiro Shibuya , Atsushi Koshimura
发明人： Yukinori Sakumoto , Shigeyuki Yokoyama , Akihiro Shibuya , Atsushi Koshimura
IPC分类号： C08L9/02 , C08L79/08 , C09J7/02 , C09J7/04 , C09J109/02 , C09J121/02 , C09J161/06 , H01L23/495 , B32B7/12
CPC分类号： H01L23/49558 , C09J109/02 , C09J121/02 , C09J161/06 , C09J7/0246 , C09J7/0282 , C09J7/045 , C08L79/08 , C08L9/02 , C09J2201/122 , C09J2479/086 , H01L2924/0002 , Y10T156/1093 , Y10T29/49208 , Y10T428/28 , Y10T428/2852 , Y10T428/2887 , Y10T428/2891 , Y10T428/31721
摘要： An adhesive tape for electronic parts, comprising(a) a heat resistant base film, and(b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising(i) a resol type phenol resin, and(ii) an acrylonitrile/butadiene copolymer,in a proportion of from 100 to 500 parts by weight of said resol type phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer,said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.
摘要翻译：一种用于电子部件的胶带，包括（a）耐热基膜和（b）层压在所述基膜的至少一个表面上的粘合剂层，所述粘合剂层包括（i）甲阶型酚醛树脂和（ ii）丙烯腈/丁二烯共聚物，相对于每100重量份所述丙烯腈/丁二烯共聚物，所述甲阶酚醛树脂型酚醛树脂为100-500重量份，所述甲阶酚醛树脂型酚醛树脂选自双酚作为苯酚成分含有选自双酚A，烷基酚，苯酚中的至少1种的树脂，烷基酚型树脂，苯酚型树脂及其共缩合型酚醛树脂。

4. 发明授权

US5683806A Adhesive tapes 失效
标题翻译：胶带
公开(公告)号：US5683806A
公开(公告)日：1997-11-04
申请号：US739930
申请日：1996-10-30
申请人： Yukinori Sakumoto , Shigeyuki Yokoyama , Akihiro Shibuya , Atsushi Koshimura
发明人： Yukinori Sakumoto , Shigeyuki Yokoyama , Akihiro Shibuya , Atsushi Koshimura
IPC分类号： C08L9/02 , C08L79/08 , C09J7/02 , C09J7/04 , C09J109/02 , C09J121/02 , C09J161/06 , H01L23/495 , B32B7/12 , B32B27/00
CPC分类号： H01L23/49558 , C09J109/02 , C09J121/02 , C09J161/06 , C09J7/0246 , C09J7/0282 , C09J7/045 , C08L79/08 , C08L9/02 , C09J2201/122 , C09J2479/086 , H01L2924/0002 , Y10T156/1093 , Y10T29/49208 , Y10T428/28 , Y10T428/2852 , Y10T428/2887 , Y10T428/2891 , Y10T428/31721
摘要： An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising (i) a resol type phenol resin, and (ii) an acrylonitrile/butadiene copolymer, in a proportion of from 100 to 500 parts by weight of said resol phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.
摘要翻译：一种用于电子部件的胶带，包括（a）耐热基膜和（b）层压在所述基膜的至少一个表面上的粘合剂层，所述粘合剂层包括（i）甲阶型酚醛树脂和（ ii）丙烯腈/丁二烯共聚物，相对于每100重量份所述丙烯腈/丁二烯共聚物，所述甲阶酚醛树脂酚树脂为100-500重量份，所述甲阶酚醛树脂型酚醛树脂选自双酚A 酚醛树脂，酚类树脂和它们的共缩合型酚醛树脂，它们作为酚成分含有选自双酚A，烷基酚和苯酚中的至少一种。

5. 发明授权

US5277972A Adhesive tapes 失效
标题翻译：胶带
公开(公告)号：US5277972A
公开(公告)日：1994-01-11
申请号：US814236
申请日：1991-12-23
申请人： Yukinori Sakumoto , Shigeyuki Yokoyama , Akihiro Shibuya , Atsushi Koshimura
发明人： Yukinori Sakumoto , Shigeyuki Yokoyama , Akihiro Shibuya , Atsushi Koshimura
IPC分类号： C08L9/02 , C08L79/08 , C09J7/02 , C09J109/02 , C09J161/06 , H01L23/495 , B32B7/12
CPC分类号： H01L23/49558 , C09J109/02 , C09J161/06 , C09J7/0246 , C09J7/0282 , C08L79/08 , C08L9/02 , C09J2201/122 , C09J2479/086 , H01L2924/0002 , Y10T428/28 , Y10T428/2848 , Y10T428/2874 , Y10T428/2887 , Y10T428/31721
摘要： An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising(i) a resol type phenol resin, and(ii) an acrylonitrile/butadiene copolymer, in a proportion of from 100 to 500 parts by weight of said resol type phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.
摘要翻译：一种用于电子部件的胶带，包括（a）耐热基膜和（b）层压在所述基膜的至少一个表面上的粘合剂层，所述粘合剂层包括（i）甲阶型酚醛树脂和（ ii）丙烯腈/丁二烯共聚物，相对于每100重量份所述丙烯腈/丁二烯共聚物，所述甲阶酚醛树脂型酚醛树脂为100-500重量份，所述甲阶酚醛树脂型酚醛树脂选自双酚作为苯酚成分含有选自双酚A，烷基酚，苯酚中的至少1种的树脂，烷基酚型树脂，苯酚型树脂及其共缩合型酚醛树脂。

6. 发明授权

US5033615A Wrapped glass cap article 失效
标题翻译：包装玻璃帽文章
公开(公告)号：US5033615A
公开(公告)日：1991-07-23
申请号：US311158
申请日：1989-02-15
申请人： Takeshi Shima , Atsushi Koshimura , Yukinori Sakumoto , Fuminori Aikawa
发明人： Takeshi Shima , Atsushi Koshimura , Yukinori Sakumoto , Fuminori Aikawa
IPC分类号： B65D85/86 , B65D73/02 , H01L21/00 , H01L23/00 , H01L27/14 , H01L31/02
CPC分类号： H01L21/67126 , Y10T428/239
摘要： Disclosed is wrapped glass cap article, comprising at least one glass cap and a pair of plastic films having located therein the at least one glass cap, at least one of the pair of plastic films being imparted on its inner surface with a weak adhesiveness so that the glass cap is tightly sealed due to the weak adhesiveness of the plastic film. The article gives rise to glass caps with less contamination when the plastic film is peeled off.
摘要翻译：公开了一种包装的玻璃帽制品，其包括至少一个玻璃盖和一对塑料膜，所述玻璃盖和一对塑料膜位于其中至少一个玻璃盖，所述一对塑料膜中的至少一个在其内表面上具有弱粘附性，使得由于塑料膜的粘合性弱，玻璃盖密封。当塑料膜剥离时，该物品产生较少污染的玻璃帽。

7. 发明授权

US5032438A Adhesive tapes for die bonding 失效
标题翻译：贴胶胶带
公开(公告)号：US5032438A
公开(公告)日：1991-07-16
申请号：US356768
申请日：1989-05-25
申请人： Yukinori Sakumoto , Atsushi Koshimura , Masaki Tsushima
发明人： Yukinori Sakumoto , Atsushi Koshimura , Masaki Tsushima
IPC分类号： C09J7/02 , H01L21/58
CPC分类号： H01L24/83 , C09J7/02 , H01L24/27 , H01L24/29 , H01L2224/2919 , H01L2224/32245 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , Y10T428/1476 , Y10T428/266 , Y10T428/269 , Y10T428/2839
摘要： An adhesive tape for die bonding is disclosed, comprising a release film having a release layer on at least one side of a support and an adhesive layer attached to said release layer, wherein the exposed surface of said adhesive layer is a mirror-like surface having an average roughness on center line (Ra) of not more than 2.5 .mu.m and a maximal height (Rmax) of not more than 20 .mu.m.
摘要翻译：公开了一种用于芯片接合的粘合带，其包括在支撑体的至少一侧上具有剥离层的脱模膜和附着到所述剥离层的粘合剂层，其中所述粘合剂层的暴露表面是具有中心线（Ra）的平均粗糙度不大于2.5μm，最大高度（Rmax）不大于20μm。

8. 发明授权

US4933219A Adhesive tapes for die bonding 失效
标题翻译：贴胶胶带
公开(公告)号：US4933219A
公开(公告)日：1990-06-12
申请号：US325090
申请日：1989-03-20
申请人： Yukinori Sakumoto , Atsushi Koshimura , Hiroshi Matsushita , Masaki Tsushima
发明人： Yukinori Sakumoto , Atsushi Koshimura , Hiroshi Matsushita , Masaki Tsushima
IPC分类号： C09J7/02 , H01L21/52 , H01L21/58
CPC分类号： H01L24/83 , C09J7/0203 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L2221/68327 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32245 , H01L2224/83101 , H01L2224/83192 , H01L2224/8385 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , Y10S428/906
摘要： An adhesive tape for die bonding is disclosed, comprising a continuous tape wound on a reel, the continuous tape having a structure that an adhesive layer composed mainly of a filler and a binder comprised of an epoxy resin and a polyester resin is laminated on a release film. According to the adhesive tape for die bonding of the invention, bonding of semiconductor elements can be attained with good workability and high reliability by very easily handling of the adhesive tape.
摘要翻译：公开了一种用于芯片接合的胶带，其包括卷绕在卷轴上的连续带，该连续带具有将主要由填料和由环氧树脂和聚酯树脂组成的粘合剂组成的粘合剂层层压在释放电影。根据本发明的芯片接合用胶带，通过非常容易地处理粘合带，可以获得良好的加工性和高可靠性的半导体元件的接合。

9. 发明授权

US5298304A Adhesive tapes for tape automated bonding 失效
标题翻译：用于胶带自动粘接的胶带
公开(公告)号：US5298304A
公开(公告)日：1994-03-29
申请号：US980230
申请日：1992-11-23
申请人： Hitoshi Narushima , Yoshikazu Tsukamoto , Tadahiro Oishi , Atsushi Koshimura
发明人： Hitoshi Narushima , Yoshikazu Tsukamoto , Tadahiro Oishi , Atsushi Koshimura
IPC分类号： H01L23/14 , C09J7/02
CPC分类号： H01L23/145 , H01L2924/0002 , Y10T428/14 , Y10T428/1471 , Y10T428/2826 , Y10T428/2852 , Y10T428/287 , Y10T428/2874 , Y10T428/2887 , Y10T428/2896
摘要： This invention relates to an adhesive tape for tape automated bonding (TAB). A first type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by comprising at least resol-type phenol resin and polyamide resin, wherein from 2 to 35% of said resol-type resin is contained in the adhesive layer. A second type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by having at least two layers: one comprising at least polyamide resin and being laminated on one surface of said organic-insulating film and; other comprising at least polyamide resin and resol-type resin and being laminated on other surface of said protective film.
摘要翻译：本发明涉及一种胶带自动接合用粘合带（TAB）。根据本发明的用于TAB的粘合带的第一类型具有层压在有机绝缘膜上的保护膜和粘合剂层。该粘合剂层的特征在于至少包含甲阶酚醛树脂型酚醛树脂和聚酰胺树脂，其中在粘合剂层中含有2〜35％的甲阶酚醛树脂型树脂。根据本发明的第二种用于TAB的粘合带具有层压在有机绝缘膜上的保护膜和粘合剂层。该粘合剂层的特征在于具有至少两个层：一个至少包含聚酰胺树脂并层压在所述有机绝缘膜的一个表面上; 其它至少包含聚酰胺树脂和甲阶酚醛树脂，并且层压在所述保护膜的其他表面上。

10. 发明授权

US5096990A Resin composition for inner coat of semiconductor chip 失效
标题翻译：半导体芯片内层用树脂组合物
公开(公告)号：US5096990A
公开(公告)日：1992-03-17
申请号：US423113
申请日：1989-10-19
申请人： Kazuhiro Takayanagi , Masayuki Tsuchida , Atsushi Koshimura , Nobumasa Ohtake , Tamio Kimura
发明人： Kazuhiro Takayanagi , Masayuki Tsuchida , Atsushi Koshimura , Nobumasa Ohtake , Tamio Kimura
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70
摘要： Resin compositions for the inner coat of semiconductors which include(A) 100 parts by weight of a polysiloxane having vinyl groups and having a viscosity of 100 to 800cP at 25.degree. C., said polysiloxane having a general formula ##STR1## in which V represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, R represents a methyl group or a phenyl group and both k and l represent natural numbers which are variables within the range of 0.01.ltoreq.l/(k+l).ltoreq.0.2,(B) 1 to 35 parts by weight of a polysiloxane haivng a viscosity of 2 to 500cP at 25.degree. C., said polysiloxane having a general formula ##STR2## in which Me represents a methyl group, and both m and n represent natural numbers which are variables within the range of 0.05.ltoreq.n/(M+n).ltoreq.0.3,(C) 0.1 to 20% by weight of a organopolysiloxane per total amount of the above-described (A) plus (B), the organopolysiloxane having, per molecule, at least one hydrogen atom bound with a silicon atom and at lest one group having the general formula (R.sub.1 O).sub.3 SiCH.sub.2 CH.sub.2 -- in which R.sub.1 represents a lower alkyl group or a group R.sub.2 (OCH.sub.2 CH.sub.2).sub.p -- in which R.sub.2 represents a methyl group or an ethyl group and p represents a positive number of 3 or less, and(D) platinum catalyst for the addition reaction are provided.
摘要翻译：用于半导体内层的树脂组合物包括：（A）100重量份具有乙烯基的聚硅氧烷，在25℃下的粘度为100至800cP，所述聚硅氧烷具有通式“IMAGE”，其中V表示乙烯基，Me表示甲基，Ph表示苯基，R表示甲基或苯基，k和l都表示自然数，其为0.01≤l/（k + 1）范围内的变量），（B）1〜35重量份在25℃下粘度为2〜500cP的聚硅氧烷，所述聚硅氧烷具有通式“IMAGE”，其中Me表示甲基，两者均为 m和n表示作为0.05≤n/（M + n）≤0.3的变量的自然数，（C）相对于上述（a）的总量的有机聚硅氧烷的0.1〜20重量％ A）加上（B），每分子具有至少一个与硅原子结合的氢原子和至少一个组合的有机聚硅氧烷 g为通式（R1O）3SiCH2CH2-，其中R1表示低级烷基或R2（OCH2CH2）p-，R2表示甲基或乙基，p表示正数3以下，（ D）用于加成反应的铂催化剂。

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