专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09543269B2 System-level packaging methods and structures 有权
标题翻译：系统级封装方法和结构
公开(公告)号：US09543269B2
公开(公告)日：2017-01-10
申请号：US13984929
申请日：2012-03-22
申请人： Yujuan Tao , Lei Shi , Honghui Wang
发明人： Yujuan Tao , Lei Shi , Honghui Wang
IPC分类号： H01L23/00 , H01L23/538 , H01L25/065 , H01L25/00 , H01L23/498 , H01L25/16
CPC分类号： H01L24/95 , H01L23/49816 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L24/96 , H01L25/0657 , H01L25/16 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/131 , H01L2224/16148 , H01L2224/24011 , H01L2224/24146 , H01L2224/24195 , H01L2224/24226 , H01L2224/25171 , H01L2224/32225 , H01L2224/48149 , H01L2224/73204 , H01L2224/73265 , H01L2224/73267 , H01L2224/8203 , H01L2224/82101 , H01L2224/96 , H01L2225/06506 , H01L2225/06513 , H01L2225/06524 , H01L2924/15311 , H01L2224/82 , H01L2924/00014 , H01L2924/00 , H01L2924/014
摘要： A system-level packaging method includes providing a packaging substrate having a first functional surface and a second surface with wiring arrangement within the packaging substrate and between the first functional surface and the second surface. The method also includes forming at least two package layers on the first functional surface of the packaging substrate, wherein each package layer is formed by subsequently forming a mounting layer, a sealant layer, and a wiring layer. Further, the method includes forming a top sealant layer and planting connection balls on the second functional surface of the packaging substrate.
摘要翻译：一种系统级封装方法包括提供具有第一功能表面和第二表面的封装衬底，该封装衬底具有在封装衬底内以及第一功能表面和第二表面之间的布线布置。该方法还包括在封装衬底的第一功能表面上形成至少两个封装层，其中每个封装层通过随后形成安装层，密封剂层和布线层而形成。此外，该方法包括在包装基板的第二功能表面上形成顶部密封剂层和种植连接球。

2. 发明申请

US20130320535A1 THREE-DIMENSIONAL SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES 有权
标题翻译：三维系统级包装方法和结构
公开(公告)号：US20130320535A1
公开(公告)日：2013-12-05
申请号：US13984967
申请日：2012-03-22
申请人： Yujuan Tao , Lei Shi , Honghui Wang
发明人： Yujuan Tao , Lei Shi , Honghui Wang
IPC分类号： H01L23/485 , H01L21/58 , H01L25/00
CPC分类号： H01L23/485 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/80 , H01L24/82 , H01L25/00 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/24195 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/00013 , H01L2924/014 , H01L2924/19105 , H05K1/185 , H01L2924/00014 , H01L2224/29099 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29599
摘要： A 3D system-level packaging method includes providing a packaging substrate, forming a glue layer on the substrate, and attaching a first chip layer at an opposite side of a functional surface of the first chip layer on the packaging substrate through the glue layer. The method also includes forming a first sealant layer on the packaging substrate at a same side attached with the first chip layer and exposing bonding pads of the first chip layer. The method also includes forming first vias in the first sealant layer, forming first vertical metal wiring in the first vias, and forming a first horizontal wiring layer on the sealant layer interconnecting the first chip layer and the first vertical metal wiring. Further, the method includes forming a plurality of package layers on the first sealant layer, and each of the plurality of package layers includes a chip layer, a sealant layer covering the chip layer, and vertical metal wiring and a horizontal wiring layer interconnecting adjacent package layers.
摘要翻译： 3D系统级封装方法包括提供封装衬底，在衬底上形成胶层，并通过胶层在封装衬底上的第一芯片层的功能表面的相对侧附着第一芯片层。该方法还包括在与第一芯片层相连的同一侧在封装衬底上形成第一密封剂层并且暴露第一芯片层的焊盘。该方法还包括在第一密封剂层中形成第一通孔，在第一通孔中形成第一垂直金属布线，以及在互连第一芯片层和第一垂直金属布线的密封剂层上形成第一水平布线层。此外，该方法包括在第一密封剂层上形成多个封装层，并且多个封装层中的每一个包括芯片层，覆盖芯片层的密封剂层和垂直金属布线以及互连相邻封装的水平布线层层。

3. 发明申请

US20130320534A1 SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES 有权
标题翻译：系统级包装方法和结构
公开(公告)号：US20130320534A1
公开(公告)日：2013-12-05
申请号：US13984929
申请日：2012-03-22
申请人： Yujuan Tao , Lei Shi , Honghui Wang
发明人： Yujuan Tao , Lei Shi , Honghui Wang
IPC分类号： H01L23/00 , H01L23/498
CPC分类号： H01L24/95 , H01L23/49816 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L24/96 , H01L25/0657 , H01L25/16 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/131 , H01L2224/16148 , H01L2224/24011 , H01L2224/24146 , H01L2224/24195 , H01L2224/24226 , H01L2224/25171 , H01L2224/32225 , H01L2224/48149 , H01L2224/73204 , H01L2224/73265 , H01L2224/73267 , H01L2224/8203 , H01L2224/82101 , H01L2224/96 , H01L2225/06506 , H01L2225/06513 , H01L2225/06524 , H01L2924/15311 , H01L2224/82 , H01L2924/00014 , H01L2924/00 , H01L2924/014
摘要： A system-level packaging method includes providing a packaging substrate having a first functional surface and a second surface with wiring arrangement within the packaging substrate and between the first functional surface and the second surface. The method also includes forming at least two package layers on the first functional surface of the packaging substrate, wherein each package layer is formed by subsequently forming a mounting layer, a sealant layer, and a wiring layer. Further, the method includes forming a top sealant layer and planting connection balls on the second functional surface of the packaging substrate.
摘要翻译：一种系统级封装方法包括提供具有第一功能表面和第二表面的封装衬底，该封装衬底具有在封装衬底内以及第一功能表面和第二表面之间的布线布置。该方法还包括在封装衬底的第一功能表面上形成至少两个封装层，其中每个封装层通过随后形成安装层，密封剂层和布线层而形成。此外，该方法包括在包装基板的第二功能表面上形成顶部密封剂层和种植连接球。

4. 发明授权

US09099448B2 Three-dimensional system-level packaging methods and structures 有权
标题翻译：三维系统级封装方法和结构
公开(公告)号：US09099448B2
公开(公告)日：2015-08-04
申请号：US13984967
申请日：2012-03-22
申请人： Yujuan Tao , Lei Shi , Honghui Wang
发明人： Yujuan Tao , Lei Shi , Honghui Wang
IPC分类号： H01L23/48 , H01L23/52 , H01L23/02 , H01L23/485 , H01L25/00 , H01L21/58 , H01L23/538 , H05K1/18
CPC分类号： H01L23/485 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/80 , H01L24/82 , H01L25/00 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/24195 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/00013 , H01L2924/014 , H01L2924/19105 , H05K1/185 , H01L2924/00014 , H01L2224/29099 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29599
摘要： A 3D system-level packaging method includes providing a packaging substrate, forming a glue layer on the substrate, and attaching a first chip layer at an opposite side of a functional surface of the first chip layer on the packaging substrate through the glue layer. The method also includes forming a first sealant layer on the packaging substrate at a same side attached with the first chip layer and exposing bonding pads of the first chip layer. The method also includes forming first vias in the first sealant layer, forming first vertical metal wiring in the first vias, and forming a first horizontal wiring layer on the sealant layer interconnecting the first chip layer and the first vertical metal wiring. Further, the method includes forming a plurality of package layers on the first sealant layer, and each of the plurality of package layers includes a chip layer, a sealant layer covering the chip layer, and vertical metal wiring and a horizontal wiring layer interconnecting adjacent package layers.
摘要翻译： 3D系统级封装方法包括提供封装衬底，在衬底上形成胶层，并通过胶层在封装衬底上的第一芯片层的功能表面的相对侧附着第一芯片层。该方法还包括在与第一芯片层相连的同一侧在封装衬底上形成第一密封剂层并且暴露第一芯片层的焊盘。该方法还包括在第一密封剂层中形成第一通孔，在第一通孔中形成第一垂直金属布线，以及在互连第一芯片层和第一垂直金属布线的密封剂层上形成第一水平布线层。此外，该方法包括在第一密封剂层上形成多个封装层，并且多个封装层中的每一个包括芯片层，覆盖芯片层的密封剂层和垂直金属布线以及互连相邻封装的水平布线层层。

5. 发明申请

US20140375347A1 LINE DETECTING APPARATUS AND METHOD FOR ARRAY SUBSTRATE 有权
标题翻译：线检测装置和阵列基板的方法
公开(公告)号：US20140375347A1
公开(公告)日：2014-12-25
申请号：US14359222
申请日：2013-11-01
申请人： Honghui Wang
发明人： Honghui Wang
IPC分类号： G01R31/26 , G09G3/00
CPC分类号： G01R31/2607 , G09G3/006
摘要： A line detecting apparatus and a line detecting method for an array substrate relates to the field of line detecting technology. The detecting method comprises: arranging an input terminal sensor (30) at a signal input terminal of a wire to be detected, arranging one output terminal sensor (40, 41, 42, 43) at a signal output terminal of the wire to be detected, and arranging other output terminal sensor (40, 41, 42, 43) at a signal output terminal of another wire adjacent to the wire to be detected; measuring an output voltage of the wire to be detected by a voltage detector; and determining the line conduction condition of the wire to be detected according to the output voltage as measured. When the sensors perform line scan, the coordinate of the specific location where the short-circuit or open-circuit occurs can be found directly without performing scan by PDS or AOI, thus simplifying the technical processes, shortening the time for detecting, and saving the production cost.
摘要翻译：阵列基板的线检测装置和线检测方法涉及线检测技术领域。检测方法包括：将输入端子传感器（30）布置在要检测的导线的信号输入端，将一个输出端子传感器（40,41,42,43）布置在待检测的导线的信号输出端并且将另一输出端子传感器（40,41,42,43）布置在与要检测的导线相邻的另一导线的信号输出端子处; 测量由电压检测器检测的导线的输出电压; 以及根据所测量的输出电压来确定要检测的导线的线路导通状态。当传感器进行扫描时，可以直接找到发生短路或开路的特定位置的坐标，而不用PDS或AOI执行扫描，从而简化了技术过程，缩短了检测时间，并节省了生产成本。

6. 发明授权

US06741382B1 Acousto-optic activity for acoustic imaging 失效
标题翻译：声学成像的声光活动
公开(公告)号：US06741382B1
公开(公告)日：2004-05-25
申请号：US10611057
申请日：2003-07-01
申请人： Milind M. Sonpatki , Honghui Wang , Jaswinder S. Sandhu
发明人： Milind M. Sonpatki , Honghui Wang , Jaswinder S. Sandhu
IPC分类号： G02F111
CPC分类号： G02F1/116 , G02F2201/16
摘要： A first medium having an acousto-optic activity and a second medium are combined to form a net medium having a net acousto-optic activity greater than the acousto-optic activity of the first medium, where the improvement is substantiated via measurements made at specific viewing conditions, and where the second medium can be chosen because it effects at least one of three key properties of the net medium.
摘要翻译：具有声光活性的第一介质和第二介质被组合以形成具有大于第一介质的声光活性的净声光活性的净介质，其中通过在特定观察下进行的测量证实了改进条件，以及可以选择第二介质的位置，因为它影响网络介质的三个关键属性中的至少一个。

7. 发明授权

US06321023B1 Serial imager for birefringent detector acoustic imaging systems 有权
标题翻译：用于双折射检测器声学成像系统的串行成像仪
公开(公告)号：US06321023B1
公开(公告)日：2001-11-20
申请号：US09597649
申请日：2000-06-20
申请人： Honghui Wang , Jaswinder S. Sandhu , Witold J. Popek
发明人： Honghui Wang , Jaswinder S. Sandhu , Witold J. Popek
IPC分类号： G02F111
CPC分类号： G02F1/116
摘要： A computer-readable signal bearing medium (10) has components (11, 21, 31) which act via a data processor (86) in an imaging system having an acoustic energy source (81) and a birefringent detector (84, 70) to record first data (14) from a first portion (61) of an object (60), the first portion attenuating first acoustic energy (12) at least part way to a first attenuation maximum (13, 43) along a first acousto-optic response (41) of the birefringent detector; to record second data (24) from a second portion (62) of the object, the second portion attenuating second acoustic energy (22) at least part way to a second attenuation maximum (23, 53) along a second acousto-optic response (51) of the birefringent detector; combines the data (32), and outputs a result.
摘要翻译：计算机可读信号承载介质（10）具有在具有声能源（81）和双折射检测器（84,70）的成像系统中经由数据处理器（86）作用的部件（11,21,31），从对象（60）的第一部分（61）记录第一数据（14），所述第一部分至少部分地将第一声能（12）衰减到沿着第一声光的第一衰减最大值（13,43）双折射检测器的响应（41）; 从物体的第二部分（62）记录第二数据（24），第二部分至少部分地沿第二声光响应（23,53）衰减第二声能（22）至第二衰减最大值（23,53） 51）双折射检测器; 组合数据（32），并输出结果。

8. 发明授权

US06628451B2 Acousto-optic reflection-active imaging 有权
标题翻译：声光反射活动成像
公开(公告)号：US06628451B2
公开(公告)日：2003-09-30
申请号：US10076187
申请日：2002-02-14
申请人： Jaswinder S Sandhu , Honghui Wang
发明人： Jaswinder S Sandhu , Honghui Wang
IPC分类号： G02F111
CPC分类号： G01N29/2418 , G01N29/11 , G01N2291/015 , G01N2291/0231 , G01N2291/044
摘要： A product and method uses acousto-optic reflection-active media having an optical reflectivity which changes with changes in acoustic energy intensity interacting with the media to form images of defects in samples when the defects reflect acoustic energy differently from known acoustically reflecting parts of the samples.
摘要翻译：产品和方法使用声光反射活性介质，其具有随着与介质相互作用的声能强度的变化而变化的光反射活性介质，以在缺陷反射声能与样品的已知声反射部分不同时形成样品中的缺陷图像。

9. 发明授权

US08396295B2 Method and system for recognizing a handwritten character 有权
标题翻译：用于识别手写字符的方法和系统
公开(公告)号：US08396295B2
公开(公告)日：2013-03-12
申请号：US13142856
申请日：2009-02-25
申请人： Jing-lian Gao , Xinchun Huang , Binghui Chen , Anjin Hu , Muyu Cai , Huaxing Lu , Zhipin Liu , Zhiai Wang , Fang Guo , Jingping Li , Honghui Wang , Chuntao Tan , Zhengwei Wu
发明人： Jing-lian Gao , Xinchun Huang , Binghui Chen , Anjin Hu , Muyu Cai , Huaxing Lu , Zhipin Liu , Zhiai Wang , Fang Guo , Jingping Li , Honghui Wang , Chuntao Tan , Zhengwei Wu
IPC分类号： G06K9/00
CPC分类号： G06K9/00416 , G06K9/00422 , G06K9/6234
摘要： The present invention discloses a method for recognizing a handwritten character, which includes the following steps of: obtaining a coarse classification template and a fine classification template; receiving a handwritten character input signal from a user, gathering a discrete coordinate sequence of trajectory points of the inputted character, and pre-processing the discrete coordinate sequence; extracting eigenvalues and calculating a multi-dimensional eigenvector of the inputted character; matching the inputted character with the coarse classification template to select a plurality of the most similar candidate character classes; and matching the eigen-transformed inputted character with sample centers of the candidate character classes selected from the fine classification template, and determining the most similar character classes among the candidate character classes. The present invention further discloses a system for recognizing a handwritten character. The present invention can recognize an inputted character fast at a high recognition precision.
摘要翻译：本发明公开了一种用于识别手写字符的方法，包括以下步骤：获得粗分类模板和精细分类模板; 从用户接收手写字符输入信号，收集输入字符的轨迹点的离散坐标序列，并预处理离散坐标序列; 提取特征值并计算输入字符的多维特征向量; 将输入的字符与粗分类模板匹配以选择多个最相似的候选字符类; 以及将所述本征变换输入字符与从所述精细分类模板中选择的候选字符类别的样本中心进行匹配，以及确定所述候选字符类别中最相似的字符类别。本发明还公开了一种用于识别手写字符的系统。本发明能够以高识别精度快速识别输入的字符。

10. 发明申请

US20110311141A1 METHOD AND SYSTEM FOR RECOGNIZING A HANDWRITTEN CHARACTER 有权
标题翻译：用于识别手写字符的方法和系统
公开(公告)号：US20110311141A1
公开(公告)日：2011-12-22
申请号：US13142856
申请日：2009-02-25
申请人： Jinglian Gao , Xinchun Huang , Binghui Chen , Anjin Hu , Muyu Cai , Huaxing Lu , Zhipin Liu , Zhiai Wang , Fang Guo , Jingping Li , Honghui Wang , Chuntao Tan , Zhengwei Wu
发明人： Jinglian Gao , Xinchun Huang , Binghui Chen , Anjin Hu , Muyu Cai , Huaxing Lu , Zhipin Liu , Zhiai Wang , Fang Guo , Jingping Li , Honghui Wang , Chuntao Tan , Zhengwei Wu
IPC分类号： G06K9/18
CPC分类号： G06K9/00416 , G06K9/00422 , G06K9/6234
摘要： The present invention discloses a method for recognizing a handwritten character, which includes the following steps of: obtaining a coarse classification template and a fine classification template; receiving a handwritten character input signal from a user, gathering a discrete coordinate sequence of trajectory points of the inputted character, and pre-processing the discrete coordinate sequence; extracting eigenvalues and calculating a multi-dimensional eigenvector of the inputted character; matching the inputted character with the coarse classification template to select a plurality of the most similar candidate character classes; and matching the eigen-transformed inputted character with sample centers of the candidate character classes selected from the fine classification template, and determining the most similar character classes among the candidate character classes. The present invention further discloses a system for recognizing a handwritten character. The present invention can recognize an inputted character fast at a high recognition precision.
摘要翻译：本发明公开了一种用于识别手写字符的方法，包括以下步骤：获得粗分类模板和精细分类模板; 从用户接收手写字符输入信号，收集输入字符的轨迹点的离散坐标序列，并预处理离散坐标序列; 提取特征值并计算输入字符的多维特征向量; 将输入的字符与粗分类模板匹配以选择多个最相似的候选字符类; 以及将所述本征变换输入字符与从所述精细分类模板中选择的候选字符类别的样本中心进行匹配，以及确定所述候选字符类别中最相似的字符类别。本发明还公开了一种用于识别手写字符的系统。本发明能够以高识别精度快速识别输入的字符。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式