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1. 发明申请

US20050189859A1 Method for aligning needle-like structures and alignment unit 失效
标题翻译：针状结构和对齐单元对齐的方法
公开(公告)号：US20050189859A1
公开(公告)日：2005-09-01
申请号：US10991105
申请日：2004-11-17
申请人： Yuji Tsuruoka , Kazuo Iwata , Kazuhiro Jindai , Hidehito Takayama , Eiichi Motai , Takashi Mori
发明人： Yuji Tsuruoka , Kazuo Iwata , Kazuhiro Jindai , Hidehito Takayama , Eiichi Motai , Takashi Mori
IPC分类号： B82B3/00 , H01J1/304 , H01J9/00 , H01J9/02
CPC分类号： B82Y10/00 , H01J1/304 , H01J9/025 , H01J2201/30469 , Y10S977/89 , Y10S977/892 , Y10S977/893
摘要： An alignment unit and an alignment method for aligning needle-like structures. The alignment unit includes a substrate having a surface and grooves defined in the surface. The grooves are sized and arranged such that when the needle-like structures are received therein, the needle-like structures are aligned.
摘要翻译：用于对准针状结构的对准单元和对准方法。对准单元包括具有限定在表面中的表面和凹槽的基底。凹槽的尺寸和布置使得当针状结构被容纳在其中时，针状结构被对准。

2. 发明授权

US07357690B2 Method for aligning needle-like structures and alignment unit 失效
标题翻译：针状结构和对齐单元对齐的方法
公开(公告)号：US07357690B2
公开(公告)日：2008-04-15
申请号：US10991105
申请日：2004-11-17
申请人： Yuji Tsuruoka , Kazuo Iwata , Kazuhiro Jindai , Hidehito Takayama , Eiichi Motai , Takashi Mori
发明人： Yuji Tsuruoka , Kazuo Iwata , Kazuhiro Jindai , Hidehito Takayama , Eiichi Motai , Takashi Mori
IPC分类号： B05D3/12 , B05D3/00
CPC分类号： B82Y10/00 , H01J1/304 , H01J9/025 , H01J2201/30469 , Y10S977/89 , Y10S977/892 , Y10S977/893
摘要： An alignment unit and an alignment method for aligning needle-like structures. The alignment unit includes a substrate having a surface and grooves defined in the surface. The grooves are sized and arranged such that when the needle-like structures are received therein, the needle-like structures are aligned.
摘要翻译：用于对准针状结构的对准单元和对准方法。对准单元包括具有限定在表面中的表面和凹槽的基底。凹槽的尺寸和布置使得当针状结构被容纳在其中时，针状结构被对准。

3. 发明申请

US20050133823A1 Method and apparatus for forming a wiring, wiring board, and ink set 审中-公开
标题翻译：用于形成布线，布线板和墨水组的方法和装置
公开(公告)号：US20050133823A1
公开(公告)日：2005-06-23
申请号：US11000012
申请日：2004-12-01
申请人： Takashi Mori , Kazuo Iwata , Yuji Tsuruoka , Osamu Nishiwaki , Hidehito Takayama , Eiichi Motai
发明人： Takashi Mori , Kazuo Iwata , Yuji Tsuruoka , Osamu Nishiwaki , Hidehito Takayama , Eiichi Motai
IPC分类号： H01L21/288 , H05K3/10 , H05K3/12 , H05K3/46 , H05K1/09
CPC分类号： H05K3/125 , H05K3/4664 , H05K2201/09881 , H05K2203/013
摘要： A method for forming a wiring according to the present invention includes supplying to a substrate a first liquid containing a first component to form a first pattern and a second liquid containing a second component to form a second pattern to come into contact with each other, the second component causing interfacial aggregation in a contact area with the first component when brought into contact with the first component, and forming a wiring pattern consisting of the first pattern and the second pattern on the substrate.
摘要翻译：根据本发明的形成布线的方法包括向基板供给包含第一部件的第一液体以形成第一图案和包含第二部件的第二液体以形成彼此接触的第二图案，第二组分在与第一组分接触时在与第一组分的接触区域中引起界面聚集，以及在衬底上形成由第一图案和第二图案组成的布线图案。

4. 发明申请

US20050104932A1 Liquid discharge apparatus and method for aligning needle-like substances 失效
标题翻译：液体排出装置和针状物质的排列方法
公开(公告)号：US20050104932A1
公开(公告)日：2005-05-19
申请号：US10990608
申请日：2004-11-17
申请人： Yuji Tsuruoka , Kazuo Iwata , Takashi Mori , Hidehito Takayama , Eiichi Motai
发明人： Yuji Tsuruoka , Kazuo Iwata , Takashi Mori , Hidehito Takayama , Eiichi Motai
IPC分类号： B82B3/00 , B41J2/14 , H01J9/00
CPC分类号： B82Y30/00 , B41J2/1433 , B41J2002/14475
摘要： A liquid discharge apparatus for aligning needle-like structures. The apparatus includes a tapered nozzle having an entrance and a discharge opening. The nozzle is tapered in such a manner that its diameter decreases towards the discharge opening. The diameter of the nozzle at the entrance is larger than the length of the needle-like structures, and the diameter of the discharge opening is larger than the diameter of the needle-like structures and smaller than the length of the needle-like structures. By passing through the nozzle, the needle-like structures are aligned.
摘要翻译：用于对准针状结构的液体排出装置。该装置包括具有入口和排出口的锥形喷嘴。喷嘴以使其直径朝着排出口减小的方式逐渐变细。入口处的喷嘴的直径大于针状结构的长度，排出口的直径大于针状结构体的直径，小于针状结构体的长度。通过喷嘴，针状结构对齐。

5. 发明授权

US07703697B2 Liquid discharge apparatus and method for aligning needle-like substances 失效
标题翻译：液体排出装置和针状物质的排列方法
公开(公告)号：US07703697B2
公开(公告)日：2010-04-27
申请号：US10990608
申请日：2004-11-17
申请人： Yuji Tsuruoka , Kazuo Iwata , Takashi Mori , Hidehito Takayama , Eiichi Motai
发明人： Yuji Tsuruoka , Kazuo Iwata , Takashi Mori , Hidehito Takayama , Eiichi Motai
IPC分类号： B05B1/08
CPC分类号： B82Y30/00 , B41J2/1433 , B41J2002/14475
摘要： A liquid discharge apparatus for aligning needle-like structures. The apparatus includes a tapered nozzle having an entrance and a discharge opening. The nozzle is tapered in such a manner that its diameter decreases towards the discharge opening. The diameter of the nozzle at the entrance is larger than the length of the needle-like structures, and the diameter of the discharge opening is larger than the diameter of the needle-like structures and smaller than the length of the needle-like structures. By passing through the nozzle, the needle-like structures are aligned.
摘要翻译：用于对准针状结构的液体排出装置。该装置包括具有入口和排出口的锥形喷嘴。喷嘴以使其直径朝着排出口减小的方式逐渐变细。入口处的喷嘴的直径大于针状结构的长度，排出口的直径大于针状结构体的直径，小于针状结构体的长度。通过喷嘴，针状结构对齐。

6. 发明授权

US08231204B2 Liquid ejection head and method for manufacturing liquid ejection head 有权
标题翻译：液体喷射头和液体喷射头的制造方法
公开(公告)号：US08231204B2
公开(公告)日：2012-07-31
申请号：US12116808
申请日：2008-05-07
申请人： Kazuhiro Jindai , Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa , Seiichi Kamiya
发明人： Kazuhiro Jindai , Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa , Seiichi Kamiya
IPC分类号： B41J2/05 , B41J2/14 , B41J2/16
CPC分类号： B41J2/14024 , B41J2/14072 , B41J2202/11
摘要： The present invention provides liquid ejection head enables a reduction in the distance between a print medium and an ejection port formation face of the liquid ejection head on which an ejection port is formed, improving the landing accuracy of droplets ejected from the liquid ejection head. A print head according to the present invention includes an element substrate and a supporting member. A supporting portion is located in the space between the element substrate and the supporting member. Connection wiring is formed on the supporting portion. The connection wiring is provided which connects wiring inside of the supporting member provided in the supporting member to the heat generating element.
摘要翻译：本发明提供了一种液体喷射头，能够减少打印介质与其上形成有喷射口的液体喷射头的喷射口形成面之间的距离，从而提高了从液体喷射头喷出的液滴的着陆精度。根据本发明的打印头包括元件基板和支撑部件。支撑部分位于元件基板和支撑部件之间的空间中。连接布线形成在支撑部分上。提供连接布线，其将设置在支撑构件中的支撑构件的内部的布线连接到发热元件。

7. 发明申请

US20090009559A1 LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD 有权
标题翻译：液体喷射头和制造液体喷射头的方法
公开(公告)号：US20090009559A1
公开(公告)日：2009-01-08
申请号：US12116808
申请日：2008-05-07
申请人： Kazuhiro Jindai , Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa , Seiichi Kamiya
发明人： Kazuhiro Jindai , Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa , Seiichi Kamiya
IPC分类号： B41J2/14
CPC分类号： B41J2/14024 , B41J2/14072 , B41J2202/11
摘要： The present invention provides liquid ejection head enables a reduction in the distance between a print medium and an ejection port formation face of the liquid ejection head on which an ejection port is formed, improving the landing accuracy of droplets ejected from the liquid ejection head. A print head according to the present invention includes an element substrate and a supporting member. A supporting portion is located in the space between the element substrate and the supporting member. Connection wiring is formed on the supporting portion. The connection wiring is provided which connects wiring inside of the supporting member provided in the supporting member to the heat generating element.
摘要翻译：本发明提供了一种液体喷射头，能够减少打印介质与其上形成有喷射口的液体喷射头的喷射口形成面之间的距离，从而提高了从液体喷射头喷出的液滴的着陆精度。根据本发明的打印头包括元件基板和支撑部件。支撑部分位于元件基板和支撑部件之间的空间中。连接布线形成在支撑部分上。提供连接布线，其将设置在支撑构件中的支撑构件的内部的布线连接到发热元件。

8. 发明申请

US20070248798A1 CIRCUIT BOARD MANUFACTURING PROCESS, CIRCUIT BOARD MANUFACTURED BY THE PROCESS, AND CIRCUIT BOARD MANUFACTURING APPARATUS 审中-公开
标题翻译：电路板制造工艺，由工艺制造的电路板和电路板制造设备
公开(公告)号：US20070248798A1
公开(公告)日：2007-10-25
申请号：US11737265
申请日：2007-04-19
申请人： Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa , Seiichi Kamiya
发明人： Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa , Seiichi Kamiya
IPC分类号： H05K3/00 , B32B15/04
CPC分类号： H05K3/125 , H05K3/4664 , H05K2201/09781 , Y10T428/24802 , Y10T428/31678
摘要： When forming circuit patterns by ejecting a minute amount of a conductive pattern solution and insulating pattern solution from a liquid ejection head in the form of an ink-jet head, a break or short circuit in a circuit caused by an ejection malfunction is prevented. During the forming process of the circuit patterns, preliminary ejection of the liquid ejection head for forming the circuit patterns is carried out toward an area without the circuit patterns. In addition, the preliminary ejection is carried out at intervals less than an ejection interruption time that might cause the ejection malfunction.
摘要翻译：当通过从喷墨头形式的液体喷射头喷出少量的导电图案溶液和绝缘图案溶液来形成电路图案时，防止由喷射故障引起的电路中断或短路。在电路图案的形成过程中，用于形成电路图形的液体喷射头的预先喷射朝向没有电路图案的区域进行。此外，预先喷射的间隔小于可能导致喷射故障的喷射中断时间。

9. 发明申请

US20060290728A1 Pattern forming method and pattern forming apparatus 有权
标题翻译：图案形成方法和图案形成装置
公开(公告)号：US20060290728A1
公开(公告)日：2006-12-28
申请号：US11447803
申请日：2006-06-06
申请人： Seiichi Kamiya , Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa
发明人： Seiichi Kamiya , Yuji Tsuruoka , Takashi Mori , Nobuhito Yamaguchi , Masao Furukawa
IPC分类号： B41J29/38 , B41J25/308
CPC分类号： B41J29/393 , H05K1/0256 , H05K1/0268 , H05K3/125 , H05K2201/0761 , H05K2201/09236 , H05K2203/013 , H05K2203/163
摘要： A plurality of conductive patterns are formed so as to be arranged in a scanning direction of a recording head. A state of each of the conductive patterns and a state between the adjacent conductive patterns are electrically checked to detect a wire break and a short circuit in the conductive patterns.
摘要翻译：多个导电图案被形成为沿记录头的扫描方向布置。电气检查每个导电图案的状态和相邻导电图案之间的状态，以检测导线图案中的断线和短路。

10. 发明授权

US07867561B2 Circuit pattern forming method and circuit pattern forming device 有权
标题翻译：电路图案形成方法和电路图案形成装置
公开(公告)号：US07867561B2
公开(公告)日：2011-01-11
申请号：US11454862
申请日：2006-06-19
申请人： Takashi Mori , Yuji Tsuruoka , Masao Furukawa , Seiichi Kamiya , Nobuhito Yamaguchi
发明人： Takashi Mori , Yuji Tsuruoka , Masao Furukawa , Seiichi Kamiya , Nobuhito Yamaguchi
IPC分类号： B41J29/393
CPC分类号： H05K3/125 , H05K3/4647 , H05K2203/013 , H05K2203/1476
摘要： A circuit pattern forming method includes a first ejection step of ejecting large droplets of a circuit pattern forming liquid onto a substrate, by causing a liquid ejection head to scan the substrate, to form first dots of the liquid on the substrate with gaps between the first dots, a second ejection step of ejecting, from the liquid ejection head, before the first dots formed on the substrate solidify, and while the liquid ejection head is caused to scan the substrate in the first ejection step, a small droplet, which is smaller in size than the large droplets, to form a second dot of the liquid between the first dots of the liquid on the substrate and, thereby to form a liquid circuit pattern by mixing the first dots and the second dot together, and a fixing step of solidifying the liquid circuit pattern to form a circuit pattern on the substrate.
摘要翻译：电路图形形成方法包括：第一喷射步骤，通过使液体喷射头扫描基板，将形成液体的大液滴喷射到基板上，以在基板上形成液体的第一点，其中第一点，在液体喷射头之前，在形成在基板上的第一点固化之前喷射第二喷射步骤，并且当在第一喷射步骤中使液体喷射头扫描基板时，小液滴较小尺寸大于液滴的大小，在基板上的液体的第一点之间形成液体的第二点，从而通过将第一点和第二点混合在一起形成液体电路图案，并且固定步骤凝固液体电路图案以在基板上形成电路图案。

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