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    • 9. 发明授权
    • Light emitting device
    • 发光装置
    • US06834977B2
    • 2004-12-28
    • US09871699
    • 2001-06-04
    • Yoshinobu SuehiroYuji TakahashiHideaki KatoKoichi KagaKiyotaka TeshimaShunsuke Ohtsuka
    • Yoshinobu SuehiroYuji TakahashiHideaki KatoKoichi KagaKiyotaka TeshimaShunsuke Ohtsuka
    • F21L400
    • G02B6/0068G02B6/0018G02B6/0028G02B6/0051H01L2224/48465Y10S362/80
    • Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is release therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.
    • 在基板的上表面和下表面上提供单独的引线和公共引线。 多个LED元件以阵列方式设置在基板的上表面上的公共引线上。 设置在基板的上表面上的公共引线通过通孔电镀连接到设置在基板的下表面上的公共引线。 从多个LED元件产生的热量通过设置在基板的上表面上的公共引线和通孔电镀传递到设置在基板的下表面上的公共引线,并将其从空气中释放。 通过这种结构,可以实现散热特性均匀化,散热效率提高,并且获得紧凑结构的发光装置,从而提高了色平衡,并且降低了不利的现象 避免了发光元件的输出和使用寿命的缩短。