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    • 4. 发明授权
    • Laser beam scanning method for maintaining a linear beam intensity over
the led and laser oscilation regions and implementing apparatus
    • 激光束扫描方法,用于在LED和激光振荡区域和实施装置上保持线性光束强度
    • US4814791A
    • 1989-03-21
    • US110403
    • 1987-10-20
    • Yuji OharaHideo WatanabeTakashi Shoji
    • Yuji OharaHideo WatanabeTakashi Shoji
    • H04N1/40H04N1/407G01D9/42H04N1/23
    • H04N1/4005H04N1/40037H04N1/4078
    • A laser beam recording method and apparatus are constituted for recording a continuous tone image by scanning a laser beam emitted by a semiconductor laser on a photosensitive material by a beam scanning system, and controlling a drive current for the semiconductor laser based on a light emission level instructing signal corresponding to an image signal, thereby to modulate the intensity of the laser beam. The laser beam intensity is detected, and a feedback signal corresponding to the detected intensity is fed back to the light emission level instructing signal. The light emission level instructing signal is corrected by a correction table to compensate for nonlinearity of drive current-optical output characteristics of the semiconductor laser and/or nonlinearity of incident light intensity-optical transmittance characteristics of an optical element of the beam scanning system, thereby to make linear the relationship between the intensity of the laser beam based on the corrected light emission level instructing signal and the uncorrected light emission level instructing signal.
    • 一种激光束记录方法和装置,用于通过用光束扫描系统扫描由半导体激光器发射的激光束在感光材料上记录连续色调图像,并且基于发光水平控制半导体激光器的驱动电流 指示对应于图像信号的信号,从而调制激光束的强度。 检测激光束强度,将与检测出的强度对应的反馈信号反馈给发光电平指示信号。 通过校正表校正发光电平指示信号,以补偿半导体激光器的驱动电流 - 光输出特性的非线性和/或光束扫描系统的光学元件的入射光强度 - 光透射特性的非线性,从而 基于校正的发光电平指示信号和未校正的发光电平指示信号来使激光束的强度之间的关系成线性。
    • 7. 发明申请
    • APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD
    • 用于焊接粉末的装置和将焊剂粉末加入电子电路板的方法
    • US20120292377A1
    • 2012-11-22
    • US13522547
    • 2011-01-18
    • Takashi ShojiTakekazu Sakai
    • Takashi ShojiTakekazu Sakai
    • B23K3/06B23K1/20
    • H05K3/3478B23K1/0016B23K1/203B23K3/06B23K2101/42H05K2203/0292H05K2203/0425H05K2203/1527H05K2203/1554
    • Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container.
    • 公开了一种用于粘附焊料粉末以将焊料粉末细微地附着到电子电路板的装置以及将焊料粉末粘附到电子电路板的方法。 用于粘附焊料粉末的装置包括容纳电子电路板和焊料粉末的容器; 设置在所述容器中的用于保持所述电子电路板的板保持部,使得其表面大致面向上下方向; 倾斜装置,其将容器的初始位置设定为容器沿第一方向倾斜的倾斜位置,并且使容器沿与第一方向相反的第二方向从初始位置倾斜,并使容器倾斜 回到第一个方向; 以及设置有偏心马达的振动装置,所述偏心马达设置在容器的底部的中心,通过旋转轴的旋转而向容器的底部提供振动;以及控制装置,用于将偏心马达的旋转轴设置在 与容器的倾斜方向相同的方向。
    • 8. 发明申请
    • METHOD OF PRODUCING CIRCUIT BOARD
    • 生产电路板的方法
    • US20120042511A1
    • 2012-02-23
    • US13266379
    • 2010-04-12
    • Takashi ShojiTakekazu Sakai
    • Takashi ShojiTakekazu Sakai
    • H05K3/00
    • H05K3/3478H05K3/3489H05K2203/041H05K2203/043H05K2203/124Y10T29/49124Y10T29/49126Y10T29/49155Y10T29/49156
    • Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.
    • 提供一种制造电路板的方法,其可以通过防止在形成焊料凸块期间的焊料剥离和针状晶体的产生来稳定地提供正常的电路板。 制造电路板的方法包括以下步骤:通过向电路板的端子的表面施加粘附性赋予化合物来形成粘合剂层; 将焊料颗粒附着到粘合剂层上; 将包括有机碱的氢卤酸盐的活化剂施加到焊料颗粒上,并通过在等于或低于焊料熔点的温度下加热焊料颗粒所附着的电路板来固定焊料颗粒; 将焊剂施加到已经固定有焊料颗粒的电路板上; 并通过加热电路板来熔化焊料颗粒。