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1. 发明申请

US20070200098A1 Electrically Conducting Resin Composition And Container For Transporting Semiconductor-Related Parts 审中-公开
标题翻译：导电树脂组合物和运输半导体相关零件的容器
公开(公告)号：US20070200098A1
公开(公告)日：2007-08-30
申请号：US10592121
申请日：2005-04-11
申请人： Yuji Nagao , Ryuji Yamamoto
发明人： Yuji Nagao , Ryuji Yamamoto
IPC分类号： H01B1/12
CPC分类号： C08K7/06 , B82Y30/00 , C08J5/005 , C08K2201/016 , C08L101/12 , H01B1/24
摘要： The present invention relates to an electrically conductive resin composition comprising a vapor grown carbon fiber (A1) having an outer fiber diameter of 80 to 500 nm and a resin (B), characterized in that: (1) the vapor grown carbon fiber (A1) has an interlayer spacing (d002) of 0.345 nm or less and an aspect ratio of 40 to 1,000, (2) the ratio by volume of the vapor grown carbon fiber (A1) to the resin (B) (i.e., A1/B) is 0.5/99.5 to 12/88, (3) the electrically conductive resin composition has a volume resistivity value of 105 Ωcm or less, and (4) when the resin composition is heated at 80° C. for 30 minutes, the total amount of gases generated therefrom is 5 ppm or less. The present invention also relates to a resin molded product comprising the electrically conductive composition. The electrically conductive resin composition suppresses deposition of a molecular contaminant generated from a resin material onto the surface of a packaged device product. The electrically conductive resin composition of the prevent invention can prevent deterioration of the quality of the product during transportation in the container produced by molding the composition for transporting an electronics-related parts, which leads to reduction of the yield of a final product; and enables washing or thermal drying of a carrier containing electronic parts.
摘要翻译：本发明涉及包含外径为80-500nm的气相生长碳纤维（A1）和树脂（B）的导电树脂组合物，其特征在于：（1）气相生长碳纤维（A1 ）具有0.345nm或更小的层间距（d 002 002），纵横比为40-1,000，（2）气相生长碳纤维（A1）与树脂的体积比（ B）（即A1 / B）为0.5 / 99.5〜12/88，（3）导电性树脂组合物的体积电阻率值为10〜5Ωm以下，（4）将树脂组合物在80℃下加热30分钟，由此产生的气体总量为5ppm以下。本发明还涉及包含导电组合物的树脂模制产品。导电树脂组合物抑制由树脂材料产生的分子污染物沉积到包装的器件产品的表面上。防止发明的导电性树脂组合物可以防止在通过模塑用于运输电子部件的组合物而制造的容器中运输期间产品的质量劣化，这导致最终产品的产率降低; 并且能够对含有电子部件的载体进行洗涤或热干燥。

2. 发明授权

US08653177B2 Semiconductive resin composition 有权
标题翻译：半导体树脂组合物
公开(公告)号：US08653177B2
公开(公告)日：2014-02-18
申请号：US11925290
申请日：2007-10-26
申请人： Yuji Nagao , Ryuji Yamamoto
发明人： Yuji Nagao , Ryuji Yamamoto
IPC分类号： B60C1/00 , C08K3/04
CPC分类号： C08K7/06 , C08K3/041 , C08K3/046 , Y10T428/139 , Y10T428/254 , C08L69/00 , C08L71/12
摘要： The invention relates to a semiconductive resin composition containing at least two kinds of conductive fillers, wherein the difference in threshold values of percolation between at least two kinds of the conductive fillers is within a range of 10 to 50 mass %. The semiconductive resin composition of the present invention can be used widely in various form of molded products, such as component used for transport in a clean room, spin chuck, IC test socket, various rollers installed in copier, seamless belt, bearing, antistatic fiber, member for electrostatic coating, fuel tube, part around fuel or chemical tube.
摘要翻译：本发明涉及含有至少两种导电填料的半导体树脂组合物，其中至少两种导电填料之间的渗透阈值差在10至50质量％的范围内。本发明的半导体树脂组合物可广泛用于各种形式的成型制品中，例如用于在洁净室中运输的组分，旋转卡盘，IC测试插座，安装在复印机中的各种辊，无缝带，轴承，抗静电纤维，静电涂层，燃料管，燃料或化学管周围的部件。

3. 发明授权

US07879941B2 Heat-resistant sliding resin composition, production process and use therof 有权
标题翻译：耐热滑动树脂组合物，生产工艺和使用方法
公开(公告)号：US07879941B2
公开(公告)日：2011-02-01
申请号：US11795566
申请日：2006-01-20
申请人： Yuji Nagao , Ryuji Yamamoto , Satoshi Miyake
发明人： Yuji Nagao , Ryuji Yamamoto , Satoshi Miyake
IPC分类号： C08K3/04
CPC分类号： C08K7/06 , C08K2201/016 , F16C33/201
摘要： The invention relates to a heat-resistant sliding resin composition, comprising a vapor carbon fiber having a specific surface area of 10 to 50 m2/g, a mean aspect ratio of 20 to 500 and a mean fiber diameter of 50 to 200 nm and a synthetic resin, wherein a heat deflection temperature under high load (ASTM D648) is 160° C. or higher and a thermal conductivity is 0.8 W/mK or higher. The resin composition has heat resistance, heat-radiation property and sliding property. Particularly, the resin composition, which neither wears away nor abrades a soft metal member which is a counter member under high temperature and heat generative conditions, can be employed for various sliding members such as bearings.
摘要翻译：本发明涉及一种耐热滑动树脂组合物，其包含比表面积为10〜50m 2 / g，平均纵横比为20〜500，平均纤维直径为50〜200nm的蒸气碳纤维，合成树脂，其中高负载下的热变形温度（ASTM D648）为160℃以上，导热率为0.8W / m·K以上。该树脂组合物具有耐热性，散热性和滑动性。特别是，在轴承等各种滑动部件中，可以使用在高温和发热条件下既不磨损也不会磨擦作为对置部件的软质金属部件的树脂组合物。

4. 发明申请

US20070021546A1 Electrically conducting polymer and production method and use thereof 有权
标题翻译：导电聚合物及其制备方法及用途
公开(公告)号：US20070021546A1
公开(公告)日：2007-01-25
申请号：US10570140
申请日：2004-09-01
申请人： Yuji Nagao , Ryuji Yamamoto , Toshio Morita
发明人： Yuji Nagao , Ryuji Yamamoto , Toshio Morita
IPC分类号： C08K3/04
CPC分类号： C08K7/06 , C08J3/201 , C08K3/04 , C08K2201/016 , C08L101/12 , H01B1/24
摘要： The invention provides a production method of a conductive polymer, comprising a step of blending a polymer in a state of a melt viscosity of 600 Pa·s or less at a shear rate of 100 s−1 with a vapor grown carbon fiber in 1 to 15 mass at a mixing energy of 1,000 mJ/m3 or less, and a conductive polymer obtained thereby. Preferably, a vapor grown carbon fiber used has an outer fiber diameter of 80 to 500 nm, an aspect ratio of 40 to 1,000, a BET specific surface area of 4: to 30 m2/g, a do02 of 0.345 nm or less according to an X-ray diffraction method, and a ratio (Id/Ig) of 0.1 to 2 wherein Id and Ig each represent peak heights of a band ranging from 1,341 to 1,349 cm−1 and a band ranging from 1,570 to 1,578 cm−1 respectively, according to a Raman scattering spectrum. According to the invention, an excellent conductivity can be attained by compounding vapor grown carbon fiber in a smaller amount than in a conventional method.
摘要翻译：本发明提供一种导电聚合物的制备方法，包括以100s -1 -1的剪切速率将熔融粘度为600Pa·s或更低的状态的聚合物与在1000mJ / m 3以下的混合能量下，以1〜15质量份的气相生长碳纤维和由此得到的导电性聚合物。优选使用的气相生长碳纤维的外纤维直径为80〜500nm，纵横比为40〜1000，BET比表面积为4〜30m 2 / g， do02为0.345nm以下，根据X射线衍射法的比例（Id / Ig）为0.1〜2，其中Id和Ig各自表示1341〜1349cm -1的峰的峰高， / SUP>，并且根据拉曼散射光谱分别为1,570至1,578cm -1的条带。根据本发明，可以通过以比常规方法更少的量将气相生长的碳纤维复合而获得优异的导电性。

5. 发明授权

US07569161B2 Electrically conducting polymer and production method and use thereof 有权
标题翻译：导电聚合物及其制备方法及用途
公开(公告)号：US07569161B2
公开(公告)日：2009-08-04
申请号：US10570140
申请日：2004-09-01
申请人： Yuji Nagao , Ryuji Yamamoto , Toshio Morita
发明人： Yuji Nagao , Ryuji Yamamoto , Toshio Morita
IPC分类号： H01B1/24
CPC分类号： C08K7/06 , C08J3/201 , C08K3/04 , C08K2201/016 , C08L101/12 , H01B1/24
摘要： The invention provides a production method of a conductive polymer, comprising a step of blending a polymer in a state of a melt viscosity of 600 Pa·s or less at a shear rate of 100 s−1 with a vapor grown carbon fiber in 1 to 15 mass at a mixing energy of 1,000 mJ/m3 or less, and a conductive polymer obtained thereby. Preferably, a vapor grown carbon fiber used has an outer fiber diameter of 80 to 500 nm, an aspect ratio of 40 to 1,000, a BET specific surface area of 4: to 30 m2/g, a do02 of 0.345 nm or less according to an X-ray diffraction method, and a ratio (Id/Ig) of 0.1 to 2 wherein Id and Ig each represent peak heights of a band ranging from 1,341 to 1,349 cm−1 and a band ranging from 1,570 to 1,578 cm−1 respectively, according to a Raman scattering spectrum. According to the invention, an excellent conductivity can be attained by compounding vapor grown carbon fiber in a smaller amount than in a conventional method.
摘要翻译：本发明提供一种导电聚合物的制造方法，包括以100s -1的剪切速度将熔融粘度为600Pa·s以下的聚合物与气相生长碳纤维在1〜 15质量份，混合能量为1,000mJ / m 3以下，由此得到的导电性聚合物。优选使用的气相生长碳纤维的外纤维直径为80〜500nm，纵横比为40〜1000，BET比表面积为4〜30m 2 / g，do02为0.345nm以下，根据 X射线衍射法和0.1〜2的比（Id / Ig），其中Id和Ig分别表示1,341〜1349cm -1的谱带的峰高和1,570〜1578cm -1的谱带，根据拉曼散射光谱。根据本发明，可以通过以比常规方法更少的量将气相生长的碳纤维复合而获得优异的导电性。

6. 发明申请

US20080099732A1 Electroconductive Resin Composition, Production Method and Use Thereof 审中-公开
标题翻译：导电树脂组合物，其制备方法和用途
公开(公告)号：US20080099732A1
公开(公告)日：2008-05-01
申请号：US11662645
申请日：2005-09-13
申请人： Yuji Nagao , Ryuji Yamamoto
发明人： Yuji Nagao , Ryuji Yamamoto
IPC分类号： H01B1/24
CPC分类号： C08K7/06 , C08J5/042 , C08K3/04 , C08K2201/016 , C09D5/24 , C09D7/67 , C09D7/68 , C09D7/70 , C09J9/02 , C09J11/04
摘要： The electroconductive resin composition comprising 1 to 30 mass % of carbon fiber having a hollow structure, an average filament diameter of 50 to 500 nm and an average aspect ratio of 50 to 1000 and 99 to 70 mass % of resin, wherein the volume ratio of carbon fiber agglomerate to one carbon fiber filament constituting the agglomerate in the resin composition (volume of carbon fiber agglomerate/volume of a carbon fiber filament) is 1500 or less according to the invention can be uniformly dispersed in resin without agglomeration and therefore, a good electroconductivity can be achieved by addition of small amount of the composition.
摘要翻译：所述导电树脂组合物含有1〜30质量％的具有中空结构的碳纤维，平均长丝直径为50〜500nm，平均长径比为50〜1000和99〜70质量％的树脂，其中，在本发明中，碳纤维聚集体与构成树脂组合物中的附聚物的碳纤维丝（碳纤维聚集体积/碳纤维长丝的体积）为1500以下可以均匀地分散在树脂中而不凝聚，因此良好可以通过加入少量的组合物来实现导电性。

7. 发明申请

US20100173108A1 SEMICONDUCTIVE RESIN COMPOSITION 有权
标题翻译：半导体树脂组合物
公开(公告)号：US20100173108A1
公开(公告)日：2010-07-08
申请号：US11925290
申请日：2007-10-26
申请人： Yuji NAGAO , Ryuji Yamamoto
发明人： Yuji NAGAO , Ryuji Yamamoto
IPC分类号： B32B1/08 , H01B1/12 , H01B1/24 , B32B5/16
CPC分类号： C08K7/06 , C08K3/041 , C08K3/046 , Y10T428/139 , Y10T428/254 , C08L69/00 , C08L71/12
摘要： The invention relates to a semiconductive resin composition containing at least two kinds of conductive fillers, wherein the difference in threshold values of percolation between at least two kinds of the conductive fillers is within a range of 10 to 50 mass %. The semiconductive resin composition of the present invention can be used widely in various form of molded products, such as component used for transport in a clean room, spin chuck, IC test socket, various rollers installed in copier, seamless belt, bearing, antistatic fiber, member for electrostatic coating, fuel tube, part around fuel or chemical tube.
摘要翻译：本发明涉及含有至少两种导电填料的半导体树脂组合物，其中至少两种导电填料之间的渗透阈值差在10至50质量％的范围内。本发明的半导体树脂组合物可广泛用于各种形式的成型制品中，例如用于在洁净室中运输的组分，旋转卡盘，IC测试插座，安装在复印机中的各种辊，无缝带，轴承，抗静电纤维，静电涂层，燃料管，燃料或化学管周围的部件。

8. 发明申请

US20080075953A1 Electrically Conductive Composites with Resin and Vgcf, Production Process, and Use Thereof 审中-公开
标题翻译：导电复合材料与树脂和Vgcf，生产工艺及其应用
公开(公告)号：US20080075953A1
公开(公告)日：2008-03-27
申请号：US11661130
申请日：2005-08-30
申请人： Yuji Nagao , Ryuji Yamamoto
发明人： Yuji Nagao , Ryuji Yamamoto
IPC分类号： C08L101/00 , C08J3/20 , H01B1/24 , H01B13/00 , C08K7/06
CPC分类号： H01B1/24 , C08J5/042 , C08K3/04 , C08K7/06 , Y10T428/269
摘要： Conductive composites with resin, produced by mixing a vapor grown carbon fiber having a fiber diameter of 2 to 500 nm with a matrix resin in a molten state while suppressing breakage of the fiber 20% or less, exhibit conductivity higher than that of a conventional conductive composites with resin through incorporation of vapor grown carbon fiber in an amount equivalent to a conventional amount, or exhibit conductivity equal to or higher than that of a conventional conductive composites with resin through incorporation of vapor grown carbon fiber in an amount smaller than a conventional amount. In the case where the melt-mixing of the fiber with resin is performed using a co-rotating twin-screw extruder, the vapor grown carbon fiber is preferably fed to the extruder by way of side feeding. In the case where the melt-mixing is performed using a pressure kneader, resin is sufficiently melted in the kneader in advance, and vapor grown carbon fiber is fed to the molten resin.
摘要翻译：通过将纤维直径为2〜500nm的气相生长碳纤维与熔融状态的基质树脂混合，同时抑制纤维断裂20％以下而制成的导电性复合体的导电性高于常规导电性通过引入相当于常规量的气相生长碳纤维的树脂复合物，或者通过引入小于常规量的气相生长碳纤维，显示出等于或高于常规导电复合材料的导电率。在使用同向旋转双螺杆挤出机进行纤维与树脂的熔融混合的情况下，气相生长碳纤维优选通过侧进料进料至挤出机。在使用压力捏合机进行熔融混合的情况下，预先在捏合机中充分地使树脂熔融，向熔融树脂中供给蒸气生长的碳纤维。

9. 发明申请

US20080039574A1 Heat-Resistant Sliding Resin Composition, Production Process and Use Thereof 有权
标题翻译：耐热滑动树脂组合物，制造方法及其用途
公开(公告)号：US20080039574A1
公开(公告)日：2008-02-14
申请号：US11795566
申请日：2006-01-20
申请人： Yuji Nagao , Ryuji Yamamoto , Satoshi Miyake
发明人： Yuji Nagao , Ryuji Yamamoto , Satoshi Miyake
IPC分类号： C08K7/06
CPC分类号： C08K7/06 , C08K2201/016 , F16C33/201
摘要： The invention relates to a heat-resistant sliding resin composition, comprising a vapor carbon fiber having a specific surface area of 10 to 50 m2/g, a mean aspect ratio of 20 to 500 and a mean fiber diameter of 50 to 200 nm and a synthetic resin, wherein a heat deflection temperature under high load (ASTM D648) is 160° C. or higher and a thermal conductivity is 0.8 W/mK or higher. The resin composition has heat resistance, heat-radiation property and sliding property. Particularly, the resin composition, which neither wears away nor abrades a soft metal member which is a counter member under high temperature and heat generative conditions, can be employed for various sliding members such as bearings.
摘要翻译：本发明涉及一种耐热滑动树脂组合物，其包含比表面积为10至50m 2 / g，平均纵横比为20至500的蒸气碳纤维和平均纤维直径为50〜200nm的合成树脂，其中高负荷下的热变形温度（ASTM D648）为160℃以上，导热率为0.8W / m·K以上。该树脂组合物具有耐热性，散热性和滑动性。特别是，在轴承等各种滑动部件中，可以使用在高温和发热条件下既不磨损也不会磨擦作为对置部件的软质金属部件的树脂组合物。

10. 发明申请

US20070181855A1 Carbon-based electrically conducting filler, composition and use thereof 审中-公开
标题翻译：碳基导电填料，其组成和用途
公开(公告)号：US20070181855A1
公开(公告)日：2007-08-09
申请号：US10591122
申请日：2005-04-14
申请人： Yuji Nagao , Ryuji Yamamoto
发明人： Yuji Nagao , Ryuji Yamamoto
IPC分类号： H01B1/12
CPC分类号： C08J3/201 , C08J5/042 , C08J2377/00 , C08K7/06 , C08K2201/016 , F16C33/201 , H01B1/24
摘要： A conductive composition comprising a vapor grown carbon fiber having an aspect ratio of 40 to 1,000, preferably 65 to 1,000, and a specific surface area or fiber diameter of the fiber within a predetermined range, and a preferable peak intensity ratio (I0=I1360/I1580) of 0.1 to 1, wherein I1580 represents a peak height at 1,580 cm−1 and I1360 represents a peak height at 1,360 cm−1 in a Raman scattering spectrum; and a resin composition containing the composition; and a production method thereof. The present invention provides: i) a composition which exhibits stable conductivity and less deterioration in physical properties during any molding methods in a conductive plastic in which a conductive filler is dispersed in a polymer; ii) a composite material composition for precision molding which enables production of a molded product with low warpage and is excellent in mechanical properties and performance during the injection molding; and iii) a sliding member composition which exhibits durability under high temperature and heavy load and has a low friction coefficient.
摘要翻译：一种导电组合物，其包含长宽比为40〜1000，优选为65〜1000的气相生长碳纤维，以及纤维的比表面积或纤维直径在规定范围内，优选的峰强度比（I＆为0.1至1，其中I 1580表示在1580cm -1处的峰高度（以下称为1580cm -1），其中I 1580 -1和I 1360 表示拉曼散射光谱中1,360cm -1处的峰高; 和含有该组合物的树脂组合物; 及其制造方法。本发明提供：i）在将导电性填料分散在聚合物中的导电性塑料中，在任何成型方法中，表现出稳定的导电性和较小的物理性能劣化的组合物; ii）用于精密模塑的复合材料组合物，其能够生产具有低翘曲的模制产品，并且在注射成型期间机械性能和性能优异; 和iii）在高温高负荷下具有耐久性且摩擦系数低的滑动构件组合物。

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