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1. 发明申请

US20080023722A1 Light-emitting heat-dissipating device and packaging method thereof 审中-公开
标题翻译：发光散热装置及其封装方法
公开(公告)号：US20080023722A1
公开(公告)日：2008-01-31
申请号：US11878273
申请日：2007-07-23
申请人： Yi-Sheng Lee , Chih-Hao Yu , Chin-Ming Cheng , Yu-Ping Hsieh , Yu-Ching Chang , Yi-Hong Huang
发明人： Yi-Sheng Lee , Chih-Hao Yu , Chin-Ming Cheng , Yu-Ping Hsieh , Yu-Ching Chang , Yi-Hong Huang
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： F21V29/503 , F21K9/00 , F21V29/51 , F21V29/677 , F21V29/763 , F21V29/87 , H01L25/0753 , H01L33/648 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H05K1/0203 , H05K3/107 , H05K2201/0919 , H05K2201/1028 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting heat-dissipating device includes at least one light-emitting chip and a circuit board. The circuit board has at least one recess and at least one thermally conducting element disposed in the recess. The light-emitting chip is disposed on the thermally conducting element and connected to the circuit board via contact pads electrically connected to a circuit layout of the circuit board. In addition, the light-emitting chip is package by a filler on the circuit board. A packaging method of the light-emitting heat-dissipating device is also disclosed.
摘要翻译：发光散热装置包括至少一个发光芯片和电路板。电路板具有至少一个凹部和设置在凹部中的至少一个导热元件。发光芯片设置在导热元件上，并通过电连接到电路板的电路布局的接触垫连接到电路板。此外，发光芯片通过电路板上的填料封装。还公开了一种发光散热装置的封装方法。

2. 发明申请

US20080025023A1 Light-emitting heat-dissipating device and manufacturing method thereof 审中-公开
标题翻译：发光散热装置及其制造方法
公开(公告)号：US20080025023A1
公开(公告)日：2008-01-31
申请号：US11878253
申请日：2007-07-23
申请人： Yu-Ping Hsieh , Yi-Sheng Lee , Chin-Ming Cheng , Chih-Hao Yu , Yu-Ching Chang , Yi-Hong Huang
发明人： Yu-Ping Hsieh , Yi-Sheng Lee , Chin-Ming Cheng , Chih-Hao Yu , Yu-Ching Chang , Yi-Hong Huang
IPC分类号： F21V29/00 , H05K3/34
CPC分类号： F21V29/51 , F21V29/508 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H05K1/0204 , H05K1/0306 , H05K3/0061 , H05K3/3421 , H05K2201/09036 , H05K2201/09745 , H05K2201/10106 , H05K2201/10416 , Y10T29/49144 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting heat-dissipating device includes a substrate and at least a light-emitting package module capable of generating heat. The substrate includes at least a recess and at least one thermally conducting element disposed in the recess. The light-emitting package module is disposed on the thermally conducting element and electrically connected to the substrate of the substrate via solder joints. A manufacturing method of the light-emitting heat-dissipating device is also disclosed.
摘要翻译：发光散热装置包括基板和至少能产生热量的发光封装模块。衬底至少包括凹部和设置在凹部中的至少一个导热元件。发光封装模块设置在导热元件上，并通过焊点与基板的基板电连接。还公开了一种发光散热装置的制造方法。

3. 发明申请

US20090034275A1 Light-emitting device and heat-dissipating module thereof 审中-公开
标题翻译：发光装置及其散热模块
公开(公告)号：US20090034275A1
公开(公告)日：2009-02-05
申请号：US12068508
申请日：2008-02-07
申请人： Chin-Ming Cheng , Yu-Ping Hsieh , Yi-Sheng Lee
发明人： Chin-Ming Cheng , Yu-Ping Hsieh , Yi-Sheng Lee
IPC分类号： F21V29/00
CPC分类号： F28D15/0266 , F21K9/00 , F21V29/67 , F21V29/74 , F21V29/763
摘要： A light-emitting device is provided and includes a circuit, at least one heat-conducting member, a plurality of light-emitting elements, at least one heat-dissipating member and a power supply. The circuit board has at least one trench for the heat-conducting member to be disposed. The plurality of light-emitting element is disposed on the heat-conducting member. The heat dissipating member is disposed on the circuit board and connected to the heat-conducting member. The power supply, is electrically connected with the circuit board to provide the power of the light-emitting elements.
摘要翻译：提供一种发光装置，其包括电路，至少一个导热构件，多个发光元件，至少一个散热构件和电源。电路板具有至少一个用于导热构件被设置的沟槽。多个发光元件设置在导热部件上。散热构件设置在电路板上并连接到导热构件。电源与电路板电连接以提供发光元件的功率。

4. 发明申请

US20070197371A1 Dielectric glass-ceramic composition, dielectric glass-ceramic substrate and manufacturing method thereof 审中-公开
标题翻译：介电玻璃陶瓷组合物，电介质玻璃陶瓷基板及其制造方法
公开(公告)号：US20070197371A1
公开(公告)日：2007-08-23
申请号：US11699028
申请日：2007-01-29
申请人： Chih-Hung Wei , Yu-Ping Hsieh , Chin-Yuan Chiu
发明人： Chih-Hung Wei , Yu-Ping Hsieh , Chin-Yuan Chiu
IPC分类号： C04B35/47 , C03C14/00
CPC分类号： C03C14/004 , C03C3/064 , C03C2214/04 , H05K1/0306
摘要： A dielectric glass-ceramic substrate composed of a dielectric glass-ceramic composition is disclosed. The dielectric glass-ceramic composition includes a ceramic material and a Ba—B—Si glass material. Also, a method of manufacturing a dielectric glass-ceramic substrate includes steps of: mixing a ceramic material and a Ba—B—Si glass material with an organic carrier, forming the ceramic material, the Ba—B—Si glass material and the organic carrier as a pre-mold; and firing the pre-mold to form the dielectric glass-ceramic substrate at a low temperature.
摘要翻译：公开了由电介质玻璃 - 陶瓷组合物构成的电介质玻璃陶瓷基片。电介质玻璃 - 陶瓷组合物包括陶瓷材料和Ba-B-Si玻璃材料。此外，制造电介质玻璃 - 陶瓷基板的方法包括以下步骤：将陶瓷材料和Ba-B-Si玻璃材料与有机载体混合，形成陶瓷材料，Ba-B-Si玻璃材料和有机物载体作为预模具; 并且在低温下烧制预模以形成电介质玻璃 - 陶瓷衬底。

5. 发明申请

US20090165499A1 Glass-ceramic composition, slurry, and method for manufacturing dielectric ceramic component with high frequency 审中-公开
标题翻译：玻璃陶瓷组合物，浆料和高频介电陶瓷组件的制造方法
公开(公告)号：US20090165499A1
公开(公告)日：2009-07-02
申请号：US12219732
申请日：2008-07-28
申请人： Chin-Hung Wei , Yu-Ping Hsieh
发明人： Chin-Hung Wei , Yu-Ping Hsieh
IPC分类号： C03C3/066 , C03C3/062 , C03B8/02
CPC分类号： C03C3/066 , C03C14/004 , C03C2214/04
摘要： The invention discloses a glass-ceramic composition, a slurry, and a method for manufacturing a dielectric ceramic component with high frequency. The glass-ceramic composition comprises 5-30 wt % of aluminum oxide and 70-95 wt % of BiZnBSiAl glass. The invention mixes the glass-ceramic composition with an organic carrier to make a slurry, processes the slurry into green body, and then densities the green body to obtain dielectric ceramic component with high frequency, which can be sintered and densified under low temperature. Accordingly, the product of quality factor and resonance frequency of the component can meet the requirements of high quality factor and dielectric constant for industries.
摘要翻译：本发明公开了一种玻璃 - 陶瓷组合物，浆料和用于制造高频介电陶瓷组件的方法。玻璃 - 陶瓷组合物包含5-30重量％的氧化铝和70-95重量％的BiZnBSiAl玻璃。本发明将玻璃陶瓷组合物与有机载体混合制成浆料，将浆料加工成生坯，然后使生坯密实，得到高频电介质陶瓷组分，可在低温下烧结和致密化。因此，组件的质量因子和谐振频率的乘积可以满足行业高品质因数和介电常数的要求。

6. 发明申请

US20080295888A1 CONCENTRATION PHOTOVOLTAIC MODULE 审中-公开
标题翻译：浓缩光伏模块
公开(公告)号：US20080295888A1
公开(公告)日：2008-12-04
申请号：US12052375
申请日：2008-03-20
申请人： Jong-Yen Lai , Chih-Hung Wei , Yu-Ping Hsieh
发明人： Jong-Yen Lai , Chih-Hung Wei , Yu-Ping Hsieh
IPC分类号： H01L31/04
CPC分类号： H01L31/0547 , H01L24/48 , H01L31/02008 , H01L31/0543 , H01L2224/48091 , H01L2224/48472 , H01L2924/00014 , H01L2924/01004 , H01L2924/16195 , H01L2924/16315 , H01L2924/30105 , Y02E10/52 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A concentration photovoltaic module includes a substrate, a first electrode, a second electrode, a solar cell, at least one electrical connecting element and a frame. The first electrode and the second electrode are disposed in different predetermined positions of the substrate to form a first electrode and a second electrode, respectively. The solar cell is disposed on the first electrode. The electrical connecting element electrically interconnects the second electrode and the solar cell. The frame straddles on the substrate, wherein the solar cell is located in the frame.
摘要翻译：集中光伏模块包括基板，第一电极，第二电极，太阳能电池，至少一个电连接元件和框架。第一电极和第二电极设置在基板的不同的预定位置，分别形成第一电极和第二电极。太阳能电池设置在第一电极上。电连接元件电连接第二电极和太阳能电池。框架横跨在基板上，其中太阳能电池位于框架中。

7. 发明申请

US20080081199A1 Ceramic substrate and fabricating method thereof 审中-公开
标题翻译：陶瓷基板及其制造方法
公开(公告)号：US20080081199A1
公开(公告)日：2008-04-03
申请号：US11889132
申请日：2007-08-09
申请人： Chih-Hung Wei , Yu-Ping Hsieh
发明人： Chih-Hung Wei , Yu-Ping Hsieh
IPC分类号： B32B18/00
CPC分类号： C04B35/6455 , C04B35/63416 , C04B35/6342 , C04B35/63488 , C04B37/005 , C04B2235/36 , C04B2237/04 , C04B2237/10 , C04B2237/32 , C04B2237/34 , C04B2237/62 , C04B2237/68 , H01L21/4807 , H01L23/15 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/1291 , H05K3/4629 , H05K2201/0195 , H05K2203/1126 , H05K2203/1476 , H01L2924/00
摘要： A fabricating method for a ceramic substrate includes the steps of: providing a ceramic thin plate and a pre-mold plate; stacking the ceramic thin plate and the pre-mold plate together; and sintering the ceramic thin plate and the pre-mold plate, both of which jointly form the ceramic substrate. Also, a ceramic substrate composed of a ceramic thin plate and a pre-mold plate is disclosed. The ceramic substrate is an LTCC substrate, and the pre-mold plate is formed by mixing a ceramic material and an inorganic adhesive including crystallized or non-crystallized glass or a glass ceramic, or the inorganic adhesive has properties of a worse chemical activity than other materials, a sintering temperature lower than that of the ceramic material, and being in a liquid phase during a sintering process.
摘要翻译：陶瓷基板的制造方法包括以下步骤：提供陶瓷薄板和预模板; 将陶瓷薄板和预模板堆叠在一起; 并烧结陶瓷薄板和预模板，两者共同形成陶瓷基板。另外，公开了由陶瓷薄板和预模板构成的陶瓷基板。陶瓷基板是LTCC基板，通过混合陶瓷材料和包括结晶或非结晶玻璃或玻璃陶瓷的无机粘合剂形成预模板，或者无机粘合剂具有比其他化学活性差的特性材料，烧结温度低于陶瓷材料，并且在烧结过程中处于液相。

8. 发明申请

US20080078493A1 Fabricating method of ceramic thin plate 审中-公开
标题翻译：陶瓷薄板的制造方法
公开(公告)号：US20080078493A1
公开(公告)日：2008-04-03
申请号：US11889141
申请日：2007-08-09
申请人： Chih-Hung Wei , Yu-Ping Hsieh
发明人： Chih-Hung Wei , Yu-Ping Hsieh
IPC分类号： B29C65/02
CPC分类号： C04B35/645
摘要： A fabricating method of a ceramic thin plate includes the steps of providing at least one first pre-mold plate and at least two second pre-mold plates; stacking up the first pre-mold plate and the second pre-mold plates so that the first pre-mold plate is disposed and sandwiched between the two second pre-mold plates; and sintering the first pre-mold plate and the second pre-mold plates at the sintering temperature of the first pre-mold plate so as to make the first pre-mold plate to form the ceramic thin plate. The sintering temperature of the second pre-mold plate is higher than that of the first pre-mold plate.
摘要翻译：陶瓷薄板的制造方法包括以下步骤：提供至少一个第一预模板和至少两个第二预模板; 堆叠第一预模板和第二预模板，使得第一预模板被布置并夹在两个第二预模板之间; 以及在所述第一预模板的烧结温度下烧结所述第一预模板和所述第二预模板，以使所述第一预模板形成所述陶瓷薄板。第二预模板的烧结温度高于第一预模板的烧结温度。

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