专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130234305A1 3D TRANSMISSION LINES FOR SEMICONDUCTORS 有权
标题翻译：用于半导体的3D传输线
公开(公告)号：US20130234305A1
公开(公告)日：2013-09-12
申请号：US13415906
申请日：2012-03-09
申请人： Yu-Ling LIN , Hsiao-Tsung YEN , Feng Wei KUO , Ho-Hsiang CHEN , Chin-Wei KUO
发明人： Yu-Ling LIN , Hsiao-Tsung YEN , Feng Wei KUO , Ho-Hsiang CHEN , Chin-Wei KUO
IPC分类号： H01L23/58 , H01L21/28
CPC分类号： H01L23/60 , H01L23/5222 , H01L23/5225 , H01L23/66 , H01L25/0657 , H01L2223/6627 , H01L2225/06527 , H01L2225/06537 , H01L2924/0002 , H01L2924/00
摘要： A transmission line structure for semiconductor RF and wireless circuits, and method for forming the same. The transmission line structure includes embodiments having a first die including a first substrate, a first insulating layer, and a ground plane, and a second die including a second substrate, a second insulating layer, and a signal transmission line. The second die may be positioned above and spaced apart from the first die. An underfill is disposed between the ground plane of the first die and the signal transmission line of the second die. Collectively, the ground plane and transmission line of the first and second die and underfill forms a compact transmission line structure. In some embodiments, the transmission line structure may be used for microwave applications.
摘要翻译：用于半导体RF和无线电路的传输线结构及其形成方法。传输线结构包括具有包括第一衬底，第一绝缘层和接地平面的第一裸片的实施例，以及包括第二衬底，第二绝缘层和信号传输线的第二裸片。第二管芯可以位于第一管芯的上方并与之隔开。在第一管芯的接地面和第二管芯的信号传输线之间设置底部填充物。总的来说，第一和第二模具和底部填充物的接地平面和传输线形成紧凑的传输线结构。在一些实施例中，传输线结构可用于微波应用。

2. 发明申请

US20120299778A1 ANTENNA USING THROUGH-SILICON VIA 有权
标题翻译：天线使用硅胶通过
公开(公告)号：US20120299778A1
公开(公告)日：2012-11-29
申请号：US13114828
申请日：2011-05-24
申请人： Hsiao-Tsung YEN , Jhe-Ching LU , Yu-Ling LIN , Chin-Wei KUO , Min-Chie JENG
发明人： Hsiao-Tsung YEN , Jhe-Ching LU , Yu-Ling LIN , Chin-Wei KUO , Min-Chie JENG
IPC分类号： H01Q1/38 , H01P11/00
CPC分类号： H01Q1/50 , G06F17/5068 , H01L23/48 , H01L23/481 , H01L23/66 , H01L25/0657 , H01L25/074 , H01L2223/6616 , H01L2223/6677 , H01L2225/06531 , H01L2225/06541 , H01L2225/06548 , H01L2924/0002 , H01L2924/10253 , H01L2924/10272 , H01L2924/10329 , H01L2924/10333 , H01L2924/10335 , H01L2924/1421 , H01L2924/1461 , H01Q1/2283 , H01Q1/38 , H01Q5/357 , H01Q9/0421 , H01Q9/0442 , H01Q9/145 , Y10T29/49016 , H01L2924/00
摘要： An antenna includes a substrate and a top plate disposed over the substrate. At least one feed line is connected to the top plate, and each feed line comprises a first through-silicon via (TSV) structure passing through the substrate. At least one ground line is connected to the top plate, and each ground line comprises a second TSV structure passing through the substrate. The top plate is electrically conductive, and the at least one feed line is arranged to carry a radio frequency signal. The at least one ground line is arranged to be coupled to a ground.
摘要翻译：天线包括衬底和设置在衬底上的顶板。至少一个进料管线连接到顶板，并且每个进料管线包括穿过基材的第一穿硅通孔（TSV）结构。至少一个接地线连接到顶板，并且每个接地线包括穿过衬底的第二TSV结构。顶板是导电的，并且至少一个馈线布置成承载射频信号。所述至少一个接地线被布置成联接到地面。

3. 发明申请

US20110298551A1 INTEGRATED CIRCUITS AND METHODS OF FORMING THE SAME 有权
标题翻译：集成电路及其形成方法
公开(公告)号：US20110298551A1
公开(公告)日：2011-12-08
申请号：US12795734
申请日：2010-06-08
申请人： Hsiao-Tsung YEN , Hsien-Pin HU , Jhe-Ching LU , Chin-Wei KUO , Ming-Fa CHEN , Sally LIU
发明人： Hsiao-Tsung YEN , Hsien-Pin HU , Jhe-Ching LU , Chin-Wei KUO , Ming-Fa CHEN , Sally LIU
IPC分类号： H03B5/12 , H01L21/329 , H01L29/93
CPC分类号： H01L27/016 , H01L29/93
摘要： A three-dimensional integrated circuit includes a semiconductor substrate where the substrate has an opening extending through a first surface and a second surface of the substrate and where the first surface and the second surface are opposite surfaces of the substrate. A conductive material substantially fills the opening of the substrate to form a conductive through-substrate-via (TSV). An active circuit is disposed on the first surface of the substrate, an inductor is disposed on the second surface of the substrate and the TSV is electrically coupled to the active circuit and the inductor. The three-dimensional integrated circuit may include a varactor formed from a dielectric layer formed in the opening of the substrate such that the conductive material is disposed adjacent the dielectric layer and an impurity implanted region disposed surrounding the TSV such that the dielectric layer is formed between the impurity implanted region and the TSV.
摘要翻译：三维集成电路包括半导体衬底，其中衬底具有延伸穿过衬底的第一表面和第二表面的开口，并且第一表面和第二表面与衬底相对的表面。导电材料基本上填充衬底的开口以形成导电的通过衬底通孔（TSV）。有源电路设置在衬底的第一表面上，电感器设置在衬底的第二表面上，并且TSV电耦合到有源电路和电感器。三维集成电路可以包括由形成在基板的开口中的电介质层形成的变容二极管，使得导电材料邻近介电层设置，以及设置在TSV周围的杂质注入区域，使得介电层形成在杂质注入区和TSV。

4. 发明申请

US20120139867A1 CAPACITIVE TOUCH APPARATUS 审中-公开
标题翻译：电容触摸装置
公开(公告)号：US20120139867A1
公开(公告)日：2012-06-07
申请号：US13293467
申请日：2011-11-10
申请人： Sean CHANG , Chii-How CHANG , Chin-Wei KUO
发明人： Sean CHANG , Chii-How CHANG , Chin-Wei KUO
IPC分类号： G06F3/044
CPC分类号： G06F3/044 , G06F3/0416
摘要： A capacitive touch apparatus includes a first touch unit, a first voltage difference retrieving unit, a first feedback signal generating unit, and a control unit. The first touch unit has a touch substrate and a first conductive layer. The first voltage difference retrieving unit is electrically connected with the first conductive layer and outputs a first voltage signal and a second voltage signal. The first feedback signal generating unit outputs a first feedback signal according to the variation of the voltage difference between the first voltage signal and the second voltage signal. The control unit receives the first feedback signal for computing the touch position and outputs a power signal to the first voltage difference retrieving unit. Hence, the capacitive touch apparatus improves the sensing speed and reduces the manufacturing cost by the simple circuit design.
摘要翻译：电容式触摸装置包括第一触摸单元，第一电压差检索单元，第一反馈信号生成单元和控制单元。第一触摸单元具有触摸基板和第一导电层。第一电压差检索单元与第一导电层电连接并输出第一电压信号和第二电压信号。第一反馈信号发生单元根据第一电压信号和第二电压信号之间的电压差的变化输出第一反馈信号。控制单元接收用于计算触摸位置的第一反馈信号，并将功率信号输出到第一电压差检索单元。因此，电容式触摸装置通过简单的电路设计提高了感测速度并降低了制造成本。

5. 发明申请

US20120139560A1 TOUCH APPARATUS 审中-公开
公开(公告)号：US20120139560A1
公开(公告)日：2012-06-07
申请号：US13010578
申请日：2011-01-20
申请人： Sean CHANG , Chii-How CHANG , Chin-Wei KUO
发明人： Sean CHANG , Chii-How CHANG , Chin-Wei KUO
IPC分类号： G01R27/26
CPC分类号： G06F3/044 , G06F3/0418
摘要： A touch apparatus includes a touch unit, a detecting unit, and a compensation unit. The touch unit has a touch substrate and at least one conductive layer. The conductive layer is disposed on the touch substrate. The detecting unit is electrically connected with the conductive layer of the touch unit and outputs a driving signal to the conductive layer. A first parasitic capacitance is formed between the detecting unit and a ground. The compensation unit is electrically connected with the detecting unit and the touch unit and outputs a compensation signal to the first parasitic capacitance. Hence, the touch apparatus can eliminate the parasitic capacitance effect.
摘要翻译：触摸装置包括触摸单元，检测单元和补偿单元。触摸单元具有触摸基板和至少一个导电层。导电层设置在触摸基板上。检测单元与触摸单元的导电层电连接，并向导电层输出驱动信号。在检测单元和地之间形成第一寄生电容。补偿单元与检测单元和触摸单元电连接，并将补偿信号输出到第一寄生电容。因此，触摸装置可以消除寄生电容效应。

6. 发明申请

US20120176330A1 TOUCH MODULE AND ANALYZING METHOD FOR TOUCHING COORDINATION THEREOF 审中-公开
标题翻译：触控模块和分析方法进行协调
公开(公告)号：US20120176330A1
公开(公告)日：2012-07-12
申请号：US13348269
申请日：2012-01-11
申请人： Sean CHANG , Chin-Wei KUO
发明人： Sean CHANG , Chin-Wei KUO
IPC分类号： G06F3/041
CPC分类号： G06F3/044 , G06F3/0416
摘要： A touch module and an analyzing method for a touching coordinate are disclosed. The touch module includes a plurality of sensing lines, which includes a first sensing line, a second sensing line and a third sensing line. The second sensing line is located between the first sensing line and the third sensing line. The analyzing method includes the steps of: calculating a first calculation value according to a first sensing signal from the first sensing line and a second sensing signal from the second sensing line; calculating a second calculation value according to the second sensing signal and a third sensing signal from the third sensing line; and calculating a touching coordinate value according to the first calculation value, the second calculation value and a reference value.
摘要翻译：公开了一种用于触摸坐标的触摸模块和分析方法。触摸模块包括多个感测线，其包括第一感测线，第二感测线和第三感测线。第二感测线位于第一感测线和第三感测线之间。分析方法包括以下步骤：根据来自第一感测线的第一感测信号和来自第二感测线的第二感测信号计算第一计算值; 根据第二感测信号计算第二计算值和从第三感测线路计算第三感测信号; 以及根据第一计算值，第二计算值和参考值计算触摸坐标值。

7. 发明申请

US20110193658A1 FILTER USING A WAVEGUIDE STRUCTURE 有权
标题翻译：滤波器使用波形结构
公开(公告)号：US20110193658A1
公开(公告)日：2011-08-11
申请号：US12701170
申请日：2010-02-05
申请人： Chia-Chung CHEN , Chewn-Pu JOU , Chin-Wei KUO
发明人： Chia-Chung CHEN , Chewn-Pu JOU , Chin-Wei KUO
IPC分类号： H01P1/203
CPC分类号： H01P1/20345
摘要： A representative filter comprises a silicon-on-insulator substrate having a top surface, a metal shielding positioned above the top surface of the silicon-on-insulator substrate, and a band-pass filter device positioned above the metal shielding. The band-pass filter device includes a first port, a second port, and a coupling metal positioned between the first and second ports.
摘要翻译：代表性滤波器包括具有顶表面的绝缘体上硅衬底，位于绝缘体上硅衬底的顶表面上方的金属屏蔽以及位于金属屏蔽上方的带通滤波器器件。带通滤波器装置包括位于第一和第二端口之间的第一端口，第二端口和耦合金属。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式