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1. 发明申请

US20120085383A1 SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：太阳能电池模块及其制造方法
公开(公告)号：US20120085383A1
公开(公告)日：2012-04-12
申请号：US13159663
申请日：2011-06-14
申请人： Young-Sang Cho , So-Young Lim , Tae-Hong Min , Ki-Won Choi
发明人： Young-Sang Cho , So-Young Lim , Tae-Hong Min , Ki-Won Choi
IPC分类号： H01L31/05
CPC分类号： H01L31/0512 , H01L31/0201 , H01L31/048 , H01L31/0504 , H01L31/0508 , Y02E10/50
摘要： A solar cell module having a reduced thickness using a flip-chip approach includes a transparent substrate, a transparent electrode interconnection disposed on the transparent substrate, and a plurality of solar cells disposed on the transparent electrode interconnection, each solar cell having at least one protrusion formed on one surface of the solar cell, the protrusion being bonded to the transparent electrode interconnection.
摘要翻译：使用倒装芯片方法具有减小的厚度的太阳能电池模块包括透明基板，布置在透明基板上的透明电极互连以及设置在透明电极互连上的多个太阳能电池，每个太阳能电池具有至少一个突起形成在太阳能电池的一个表面上，该突起与透明电极互连结合。

2. 发明申请

US20120085393A1 SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：太阳能电池模块及其制造方法
公开(公告)号：US20120085393A1
公开(公告)日：2012-04-12
申请号：US13154696
申请日：2011-06-07
申请人： Young-Sang Cho , So-Young Lim , Tae-Hong Min
发明人： Young-Sang Cho , So-Young Lim , Tae-Hong Min
IPC分类号： H01L31/05 , H01L31/048
CPC分类号： H01L31/0504 , H01L31/02013 , H01L31/048 , Y02E10/50
摘要： A solar cell module includes a circuit board, a plurality of solar cells disposed on a first surface of the circuit board, a plurality of metal terminals formed on the first surface of the circuit board, and a plurality of wires electrically connecting the plurality of solar cells and the metal terminals. The circuit board has a second surface opposite to the first surface, the rear surface comprising openings corresponding to the metal terminals, the openings exposing the metal terminals to an exterior of the solar cell module, thus forming contact terminals for the solar cell module.
摘要翻译：太阳能电池模块包括电路板，设置在电路板的第一表面上的多个太阳能电池，形成在电路板的第一表面上的多个金属端子，以及电连接多个太阳能电池电池和金属端子。电路板具有与第一表面相对的第二表面，后表面包括对应于金属端子的开口，开口将金属端子暴露于太阳能电池模块的外部，从而形成用于太阳能电池模块的接触端子。

3. 发明授权

US07046870B2 Method of fabricating multi-layered printed circuit board for optical waveguides 有权
标题翻译：制造光波导多层印刷电路板的方法
公开(公告)号：US07046870B2
公开(公告)日：2006-05-16
申请号：US10610820
申请日：2003-07-02
申请人： Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang , Kyu-Hyok Yim
发明人： Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang , Kyu-Hyok Yim
IPC分类号： G02B6/12 , G02B6/13
CPC分类号： G02B6/43 , G02B6/3608 , G02B6/4201 , G02B6/4214 , G02B6/428 , H05K1/0274 , H05K3/4611 , H05K2203/063 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T156/1064
摘要： Disclosed is a method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method comprises pre-routing a portion of an adhesive meeting the optical waveguide to remove said portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad.
摘要翻译：公开了一种制造多层PCB的方法，其中将光波导部件插入到PCB中，使得预浸胶粘合剂不阻挡光波导的光信号入口。该方法包括预先路由满足光波导的粘合剂部分以去除所述部分，处理粘合剂防止漏水层，以防止粘合剂阻挡光波导的光信号入口，布置光波导，粘合剂和覆铜层压板上的粘合剂防止层，并将光波导，预浸料和粘合剂防止层彼此组合成单一结构。粘合防止层选自预浸料，单面覆铜层压板，热固化树脂，散热器和未包覆层。

4. 发明授权

US06811704B2 Method for anion removal by forming chemical precipitation under an electric field and continuous process for anion removal 失效
标题翻译：通过在电场下形成化学沉淀和阴离子去除的连续方法进行阴离子去除的方法
公开(公告)号：US06811704B2
公开(公告)日：2004-11-02
申请号：US10278007
申请日：2002-10-22
申请人： Young-Sang Cho , Jae-Ik Kim , Jae-Chun Oh , Jin-Seong Yoon
发明人： Young-Sang Cho , Jae-Ik Kim , Jae-Chun Oh , Jin-Seong Yoon
IPC分类号： C02F162
CPC分类号： C02F1/5245 , C02F2101/10 , C02F2101/105 , C02F2101/12 , C02F2101/163 , Y10S210/912
摘要： The present disclosure relates to a method for removing anions such as nitrate ion, sulfate ion, chloride ion, and phosphate ion existing in underground water, surface water or waste water. The method involves adding alumina cement and a calcium compound to the water containing the anion followed by applying an electric field thereto, thereby forming a chemical precipitate which is an insoluble complex salt. The disclosure also relates to a continuous process for removing the anion by continuously performing the above method for removing anions.
摘要翻译：本公开涉及一种去除存在于地下水，地表水或废水中的硝酸根离子，硫酸根离子，氯离子和磷酸根离子等阴离子的方法。该方法包括向含有阴离子的水中加入氧化铝水泥和钙化合物，然后向其施加电场，从而形成化学沉淀物，其为不溶性络盐。本公开还涉及通过连续进行上述除去阴离子的方法除去阴离子的连续方法。

5. 发明申请

US20070152329A1 Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same 有权
标题翻译：散热用半导体芯片，带状布线基板和使用其的磁带封装
公开(公告)号：US20070152329A1
公开(公告)日：2007-07-05
申请号：US11488057
申请日：2006-07-18
申请人： Young-Sang Cho , Dong-Han Kim
发明人： Young-Sang Cho , Dong-Han Kim
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L23/4985 , H01L24/06 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01004 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00
摘要： A semiconductor chip, a tape package of the chip and a tape wiring substrate of the chip may be configured so as to effectively radiate heat generated from the chip externally through certain wiring patterns connected to certain pads. In an example, the chip may include a plurality of input pads along at least one edge of an active surface. The input pads may include power pads and ground pads. The chip may include a plurality of output pads along edges of the active surface, outside of the input pads. The power pads and the ground pads may be located at a central area of the at least one edge.
摘要翻译：半导体芯片，芯片的带封装和芯片的带布线基板可以被配置为通过连接到某些焊盘的某些布线图案有效地辐射从芯片产生的热。在一个示例中，芯片可以沿着有源表面的至少一个边缘包括多个输入焊盘。输入焊盘可以包括电源焊盘和接地焊盘。芯片可以包括沿着有源表面的边缘的多个输出焊盘，在输入焊盘的外部。电源焊盘和接地焊盘可以位于至少一个边缘的中心区域。

6. 发明申请

US20060182385A1 Method of fabricating multi-layered printed circuit board for optical waveguides 失效
标题翻译：制造光波导多层印刷电路板的方法
公开(公告)号：US20060182385A1
公开(公告)日：2006-08-17
申请号：US11401915
申请日：2006-04-12
申请人： Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang , Kyu-Hyok Yim
发明人： Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang , Kyu-Hyok Yim
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , G02B6/3608 , G02B6/4201 , G02B6/4214 , G02B6/428 , H05K1/0274 , H05K3/4611 , H05K2203/063 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T156/1064
摘要： Disclosed is a method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method comprises pre-routing a portion of an adhesive meeting the optical waveguide to remove said portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad. Therefore, the method is advantageous in that the prepreg and the adhesive weeping prevention layer are pre-routed to prevent epoxy resin from blocking the optical signal entrance of the optical waveguide, thereby facilitating precise interfacing of optical signals.
摘要翻译：公开了一种制造多层PCB的方法，其中将光波导部件插入到PCB中，使得预浸胶粘合剂不阻挡光波导的光信号入口。该方法包括预先路由满足光波导的粘合剂部分以去除所述部分，处理粘合剂防止漏水层，以防止粘合剂阻挡光波导的光信号入口，布置光波导，粘合剂和覆铜层压板上的粘合剂防止层，并将光波导，预浸料和粘合剂防止层彼此组合成单一结构。粘合防止层选自预浸料，单面覆铜层压板，热固化树脂，散热器和未包覆层。因此，该方法的优点在于预浸布和粘合剂防止漏水层被预先布线以防止环氧树脂阻挡光波导的光信号入口，从而有助于光信号的精确接口。

7. 发明申请

US20050205201A1 Method of attaching optical waveguide component to printed circuit board 失效
标题翻译：将光波导部件安装到印刷电路板的方法
公开(公告)号：US20050205201A1
公开(公告)日：2005-09-22
申请号：US11126676
申请日：2005-05-11
申请人： Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang , Kyu-Hyok Yim
发明人： Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang , Kyu-Hyok Yim
IPC分类号： H05K3/32 , G02B6/42 , G02B6/43 , H05K1/02 , B32B31/00
CPC分类号： H05K1/0274 , G02B6/423 , G02B6/4236 , G02B6/43 , Y10T29/49126 , Y10T156/1062 , Y10T156/1064 , Y10T156/1082 , Y10T156/109 , Y10T156/1304 , Y10T156/1309
摘要： Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.
摘要翻译：公开了通过使用粘合带预粘合和主粘接将光波导部件附着到作为双面或多层印刷电路板的印刷电路板的方法。在附着到印刷电路板之前，优选对光波导部件进行等离子体表面处理以给出其表面粗糙度。本方法的优点在于，光波导部件可以以改善的平坦度和精确对准的方式附着到印刷电路板，而不会对光波导部件造成化学或热损伤。

8. 发明授权

US06839476B2 Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board 失效
标题翻译：多层印刷电路板和多层印刷电路板层之间耦合光信号的方法
公开(公告)号：US06839476B2
公开(公告)日：2005-01-04
申请号：US10417357
申请日：2003-04-16
申请人： Young-Woo Kim , Byoung-Ho Rhee , Dek-Gin Yang , Young-Sang Cho , Kyu-Hyok Yim
发明人： Young-Woo Kim , Byoung-Ho Rhee , Dek-Gin Yang , Young-Sang Cho , Kyu-Hyok Yim
IPC分类号： G02B6/42 , G02B6/43 , G02B6/12
CPC分类号： G02B6/43 , G02B6/122 , G02B6/30 , G02B6/3636 , G02B6/3652
摘要： Disclosed herein is an optical signal coupling block, and a multi-layer printed circuit board and the method for coupling optical signals between layers of a multi-layer printed circuit board (PCB) using optical signal coupling blocks. The optical signals between the layers are coupled through the steps of forming a plurality of optical via holes in the multi-layer PCB to which optical waveguides for transmitting optical signals are attached; inserting the optical signal coupling blocks into the plural optical via holes such that the optical signal coupling blocks are connected to the optical waveguides to transmit the optical signals; forming at least one connection part to couple optical signals between the optical waveguides and the optical signal coupling blocks; and interconnecting the optical waveguides and the optical signal coupling blocks by aligning positions of the optical waveguides and the optical signal coupling blocks.
摘要翻译：本文公开了一种光信号耦合块和多层印刷电路板以及使用光信号耦合块在多层印刷电路板（PCB）的层之间耦合光信号的方法。层之间的光信号通过在多层PCB中形成多个光通孔的步骤耦合，多层PCB中连接有用于传输光信号的光波导; 将光信号耦合块插入到多个光通孔中，使得光信号耦合块连接到光波导以传输光信号; 形成至少一个连接部分以在所述光波导和所述光信号耦合块之间耦合光信号; 以及通过对准光波导和光信号耦合块的位置来互连光波导和光信号耦合块。

9. 发明申请

US20110225927A1 STEEL-CONCRETE COMPOSITE BEAM AND CONSTRUCTION METHOD USING SAME 审中-公开
标题翻译：钢 - 混凝土复合梁及其构造方法
公开(公告)号：US20110225927A1
公开(公告)日：2011-09-22
申请号：US13124997
申请日：2009-07-08
申请人： Jeom-Han Kim , Young-Sang Cho , Eun-Ho Jeong , Kyoung-Hun Lee
发明人： Jeom-Han Kim , Young-Sang Cho , Eun-Ho Jeong , Kyoung-Hun Lee
IPC分类号： E04C3/293 , E04C3/04 , E04B1/38
CPC分类号： E04C3/293
摘要： A steel-concrete composite beam includes a long rectangular steel frame; concrete members installed at only both ends of the steel frame, excluding a center portion thereof; a prestressable reinforcement buried in the concrete member; and a stirrup reinforcement arranged to the concrete member with a regular gap thereto to surround a lower flange of the steel frame.
摘要翻译：钢筋混凝土复合梁包括长方形钢框架; 仅在钢框架的两端安装的混凝土构件，不包括其中心部分; 埋在混凝土构件中的预应力钢筋; 以及将钢筋加固件布置到具有规则间隙的混凝土构件上以围绕钢框架的下凸缘。

10. 发明授权

US07033457B2 Method of attaching optical waveguide component to printed circuit board 失效
标题翻译：将光波导部件安装到印刷电路板的方法
公开(公告)号：US07033457B2
公开(公告)日：2006-04-25
申请号：US11126676
申请日：2005-05-11
申请人： Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang , Kyu-Hyok Yim
发明人： Young-Woo Kim , Young-Sang Cho , Dek-Gin Yang , Kyu-Hyok Yim
IPC分类号： B32B37/00 , G02B6/00
CPC分类号： H05K1/0274 , G02B6/423 , G02B6/4236 , G02B6/43 , Y10T29/49126 , Y10T156/1062 , Y10T156/1064 , Y10T156/1082 , Y10T156/109 , Y10T156/1304 , Y10T156/1309
摘要： Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.
摘要翻译：公开了通过使用粘合带预粘合和主粘接将光波导部件附着到作为双面或多层印刷电路板的印刷电路板的方法。在附着到印刷电路板之前，优选对光波导部件进行等离子体表面处理以给出其表面粗糙度。本方法的优点在于，光波导部件可以以改善的平坦度和精确对准的方式附着到印刷电路板，而不会对光波导部件造成化学或热损伤。

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