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    • 1. 发明授权
    • Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same
    • 化学机械抛光装置的抛光垫及其制造方法
    • US07815496B2
    • 2010-10-19
    • US11706241
    • 2007-02-15
    • Young-Sam LimYoung-Nam KimGi-Jung Kim
    • Young-Sam LimYoung-Nam KimGi-Jung Kim
    • B24D11/00
    • B24B37/24B24D18/0063
    • The surface(s) of a polishing pad for polishing an object has a first portion including hydrophilic material and a second portion including hydrophobic material. The first portion of the polishing surface is located in a first region of the polishing pad and the second portion of the polishing surface is located in a second region of the polishing pad juxtaposed with the first region in the radial direction of the pad. The hydrophilic material may be a polymer resin that contains hydrophilic functional groups having OH and/or ═O at bonding sites of the polymer. The hydrophobic material may be a polymer resin that contains hydrophobic functional groups having H and/or F at bonding sites of the polymer. The polishing pad is manufactured by extruding respective lines of the hydrophilic and hydrophobic materials. The extruders and a backing are moved relative to each other such that the lines form concentric rings of the hydrophilic and hydrophobic materials.
    • 用于抛光物体的抛光垫的表面具有包括亲水材料的第一部分和包括疏水材料的第二部分。 抛光表面的第一部分位于抛光垫的第一区域中,并且抛光表面的第二部分位于抛光垫的与垫的径向方向上与第一区域并置的第二区域中。 亲水材料可以是在聚合物的键合位置处含有OH和/或= O的亲水性官能团的聚合物树脂。 疏水性材料可以是在聚合物的结合位置含有H和/或F的疏水官能团的聚合物树脂。 抛光垫通过挤出亲水和疏水材料的相应线来制造。 挤出机和背衬相对于彼此移动,使得线形成亲水和疏水材料的同心环。
    • 5. 发明申请
    • Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same
    • 化学机械抛光装置的抛光垫及其制造方法
    • US20070197143A1
    • 2007-08-23
    • US11706241
    • 2007-02-15
    • Young-Sam LimYoung-Nam KimGi-Jung Kim
    • Young-Sam LimYoung-Nam KimGi-Jung Kim
    • B24B1/00B24D11/00
    • B24B37/24B24D18/0063
    • The surface(s) of a polishing pad for polishing an object has a first portion including hydrophilic material and a second portion including hydrophobic material. The first portion of the polishing surface is located in a first region of the polishing pad and the second portion of the polishing surface is located in a second region of the polishing pad juxtaposed with the first region in the radial direction of the pad. The hydrophilic material may be a polymer resin that contains hydrophilic functional groups having OH and/or ═O at bonding sites of the polymer. The hydrophobic material may be a polymer resin that contains hydrophobic functional groups having H and/or F at bonding sites of the polymer. The polishing pad is manufactured by extruding respective lines of the hydrophilic and hydrophobic materials. The extruders and a backing are moved relative to each other such that the lines form concentric rings of the hydrophilic and hydrophobic materials.
    • 用于抛光物体的抛光垫的表面具有包括亲水材料的第一部分和包括疏水材料的第二部分。 抛光表面的第一部分位于抛光垫的第一区域中,并且抛光表面的第二部分位于抛光垫的与垫的径向方向上与第一区域并置的第二区域中。 亲水材料可以是聚合物树脂,其在聚合物的键合位置含有具有OH和/或-O的亲水性官能团。 疏水性材料可以是在聚合物的结合位置含有H和/或F的疏水官能团的聚合物树脂。 抛光垫通过挤出亲水和疏水材料的相应线来制造。 挤出机和背衬相对于彼此移动,使得线形成亲水和疏水材料的同心环。