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1. 发明申请

US20120168213A1 ANISOTROPIC CONDUCTIVE FILM AND APPARATUS INCLUDING THE SAME 有权
标题翻译：各向异性导电膜和包括其的装置
公开(公告)号：US20120168213A1
公开(公告)日：2012-07-05
申请号：US13311920
申请日：2011-12-06
申请人： Young Woo PARK , Arum Amy Yu , Nam Ju Kim , Hyun Min Choi , Jin Seong Park , Dong Seon Uh
发明人： Young Woo PARK , Arum Amy Yu , Nam Ju Kim , Hyun Min Choi , Jin Seong Park , Dong Seon Uh
IPC分类号： H05K1/09
CPC分类号： H05K3/323 , B32B7/02 , B32B27/08 , B32B27/18 , B32B27/26 , B32B27/38 , B32B2250/02 , B32B2250/24 , B32B2264/102 , B32B2264/12 , B32B2307/202 , B32B2307/706 , B32B2457/202 , C08J5/18 , C08J2363/00 , C09J163/00 , G02F1/13452 , H01R4/04 , Y10T428/1055
摘要： An apparatus includes a first member including a plurality of first electrodes on a first substrate, a second member including a plurality of second electrodes on a second substrate, the second electrodes facing the first electrodes of the first member, and an anisotropic conductive film (ACF) between the first member and the second member, the ACF having a double-layered structure and electrically connecting the first member and the second member, the ACF including an epoxy resin with a polycyclic aromatic ring and exhibiting a minimum melt viscosity of about 3,000 Pa·s to about 10,000 Pa·s at about 30° C. to about 200° C.
摘要翻译：一种装置包括：第一构件，包括在第一衬底上的多个第一电极，第二构件，在第二衬底上包括多个第二电极，第二电极面对第一构件的第一电极;以及各向异性导电膜（ACF ），所述ACF具有双层结构并且电连接所述第一构件和所述第二构件，所述ACF包括具有多环芳环的环氧树脂并且具有约3,000Pa的最小熔体粘度在约30℃至约200℃的温度下至约10,000Pa·s

2. 发明授权

US09173303B2 Anisotropic conductive film and apparatus including the same 有权
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：US09173303B2
公开(公告)日：2015-10-27
申请号：US13311920
申请日：2011-12-06
申请人： Young Woo Park , Arum Amy Yu , Nam Ju Kim , Hyun Min Choi , Jin Seong Park , Dong Seon Uh
发明人： Young Woo Park , Arum Amy Yu , Nam Ju Kim , Hyun Min Choi , Jin Seong Park , Dong Seon Uh
IPC分类号： C09K19/00 , H05K3/32 , C09J163/00 , B32B7/02 , B32B27/08 , B32B27/18 , B32B27/26 , B32B27/38 , C08J5/18 , G02F1/1345 , H01R4/04
CPC分类号： H05K3/323 , B32B7/02 , B32B27/08 , B32B27/18 , B32B27/26 , B32B27/38 , B32B2250/02 , B32B2250/24 , B32B2264/102 , B32B2264/12 , B32B2307/202 , B32B2307/706 , B32B2457/202 , C08J5/18 , C08J2363/00 , C09J163/00 , G02F1/13452 , H01R4/04 , Y10T428/1055
摘要： An apparatus includes a first member including a plurality of first electrodes on a first substrate, a second member including a plurality of second electrodes on a second substrate, the second electrodes facing the first electrodes of the first member, and an anisotropic conductive film (ACF) between the first member and the second member, the ACF having a double-layered structure and electrically connecting the first member and the second member, the ACF including an epoxy resin with a polycyclic aromatic ring and exhibiting a minimum melt viscosity of about 3,000 Pa·s to about 10,000 Pa·s at about 30° C. to about 200° C.
摘要翻译：一种装置包括：第一构件，包括在第一衬底上的多个第一电极，第二构件，在第二衬底上包括多个第二电极，第二电极面对第一构件的第一电极;以及各向异性导电膜（ACF ），所述ACF具有双层结构并且电连接所述第一构件和所述第二构件，所述ACF包括具有多环芳环的环氧树脂并且具有约3,000Pa的最小熔体粘度在约30℃至约200℃的温度下至约10,000Pa·s

3. 发明授权

US09390831B2 Electronic device using anisotropic conductive composition and film 有权
标题翻译：使用各向异性导电组合物和薄膜的电子装置
公开(公告)号：US09390831B2
公开(公告)日：2016-07-12
申请号：US13680893
申请日：2012-11-19
申请人： Kyoung Soo Park , Nam Ju Kim , Young Woo Park , Joon Mo Seo , Kyung Il Sul , Dong Seon Uh , Arum Yu , Hyun Min Choi , Jae Sun Han
发明人： Kyoung Soo Park , Nam Ju Kim , Young Woo Park , Joon Mo Seo , Kyung Il Sul , Dong Seon Uh , Arum Yu , Hyun Min Choi , Jae Sun Han
IPC分类号： H01B1/22 , H01R4/04 , H05K3/32 , C09J9/02 , H01B1/12
CPC分类号： H01B1/22 , C09J9/02 , H01B1/12 , H01B1/122 , H01R4/04 , H05K3/323
摘要： An electronic device includes a connection material formed from an adhesive composition that includes: a polymer resin; a cationic polymerization catalyst represented by Formula 1; and an organic base, where, in Formula 1, R1 may be selected from the group of hydrogen, C1-C6 alkyl, C6-C14 aryl, —C(═O)R4, —C(═O)OR5, and —C(═O)NHR6 (in which R4, R5, and R6 may each independently be selected from C1-C6 alkyl and C6-C14 aryl), R2 may be C1-C6 alkyl, and R3 may be selected from the group of a nitrobenzyl group, a dinitrobenzyl group, a trinitrobenzyl group, a benzyl group, a C1-C6 alkyl-substituted benzyl group, and a naphthylmethyl group.
摘要翻译：电子装置包括由粘合剂组合物形成的连接材料，所述粘合剂组合物包括：聚合物树脂; 由式1表示的阳离子聚合催化剂; 和有机碱，其中，在式1中，R 1可以选自氢，C 1 -C 6烷基，C 6 -C 14芳基，-C（= O）R 4，-C（= O）OR 5和-C （ΟO）NHR 6（其中R 4，R 5和R 6可各自独立地选自C 1 -C 6烷基和C 6 -C 14芳基），R 2可以是C 1 -C 6烷基，R 3可以选自硝基苄基二硝基苄基，三硝基苄基，苄基，C1-C6烷基取代的苄基和萘基甲基。

4. 发明授权

US09048240B2 Anisotropic conductive film and electronic device including the same 有权
标题翻译：各向异性导电膜和包括其的电子器件
公开(公告)号：US09048240B2
公开(公告)日：2015-06-02
申请号：US13728215
申请日：2012-12-27
申请人： Young Woo Park , Nam Ju Kim , Kyoung Soo Park , Joon Mo Seo , Kyung Il Sul , Dong Seon Uh , Arum Yu , Hyun Min Choi
发明人： Young Woo Park , Nam Ju Kim , Kyoung Soo Park , Joon Mo Seo , Kyung Il Sul , Dong Seon Uh , Arum Yu , Hyun Min Choi
IPC分类号： H01B1/00 , H01L23/48 , H01L23/538 , C09J9/02 , C08G59/22 , C08G59/24 , H01L23/00 , C08L63/00
CPC分类号： H01L23/538 , C08G59/226 , C08G59/245 , C08K2201/001 , C08K2201/011 , C09J9/02 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/16225 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29366 , H01L2224/29371 , H01L2224/29386 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/32225 , H01L2224/73204 , H01L2924/07802 , H01L2924/07811 , H01L2924/15788 , H01L2924/00 , C08L63/00 , C08K3/36 , C08K3/10
摘要： An electronic device includes an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition. The anisotropic conductive film-forming composition includes a polycyclic aromatic ring-containing epoxy resin, a fluorene epoxy resin, nano silica and conductive particles.
摘要翻译：电子器件包括各向异性导电膜作为连接材料，各向异性导电膜由各向异性导电膜形成组合物形成。各向异性导电膜形成组合物包括多环芳族环的环氧树脂，芴环氧树脂，纳米二氧化硅和导电颗粒。

5. 发明授权

US09540549B2 Anisotropic conductive film and semiconductor device bonded by the same 有权
标题翻译：各向异性导电膜和与其结合的半导体器件
公开(公告)号：US09540549B2
公开(公告)日：2017-01-10
申请号：US13718104
申请日：2012-12-18
申请人： Kyung Il Sul , Dong Seon Uh , Nam Ju Kim , Kyoung Soo Park , Young Woo Park , Joon Mo Seo , Arum Yu , Hyun Min Choi
发明人： Kyung Il Sul , Dong Seon Uh , Nam Ju Kim , Kyoung Soo Park , Young Woo Park , Joon Mo Seo , Arum Yu , Hyun Min Choi
IPC分类号： H01B1/20 , C09D5/24 , C09J9/00 , H01L23/00 , C09J163/00 , C09J9/02 , H01L23/29 , C08G59/22 , C08G59/24 , C08G59/68 , C08L63/00
CPC分类号： C09J163/00 , C08G59/226 , C08G59/24 , C08G59/687 , C08L63/00 , C08L2205/02 , C09D5/24 , C09J9/02 , H01B1/20 , H01L23/29 , H01L24/29 , H01L2224/2929 , H01L2224/29298 , H01L2224/293 , H01L2924/07802 , H01L2924/07811 , H01L2924/15788 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst.
摘要翻译：通过各向异性导电膜和各向异性导电膜组合物接合的半导体器件，各向异性导电膜包括环氧当量为约120至约180g / eq的反应性单体; 氢化环氧树脂; 和锍阳离子固化催化剂。

6. 发明授权

US08766443B2 Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same 有权
标题翻译：各向异性导电膜组合物，各向异性导电膜和与其结合的半导体器件
公开(公告)号：US08766443B2
公开(公告)日：2014-07-01
申请号：US13710728
申请日：2012-12-11
申请人： Arum Yu , Nam Ju Kim , Kyoung Soo Park , Young Woo Park , Joon Mo Seo , Kyung Il Sul , Dong Seon Uh , Hyun Min Choi
发明人： Arum Yu , Nam Ju Kim , Kyoung Soo Park , Young Woo Park , Joon Mo Seo , Kyung Il Sul , Dong Seon Uh , Hyun Min Choi
IPC分类号： H01L23/48
CPC分类号： H01B1/20 , C08K3/08 , C08K5/41 , C08K9/02 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01B1/22 , H01L23/5328 , H01L24/29 , H01L2224/2929 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/32225 , H01L2924/07802 , H01L2924/07811 , H01L2924/15788 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: where n may be an integer from 1 to about 50.
摘要翻译：用于接合电子器件的各向异性导电膜组合物可以包括由式1表示的氢化双酚A环氧单体或由式2表示的氢化双酚A环氧低聚物：其中n可以是1至约50的整数。

7. 发明授权

US10504866B2 Semiconductor device connected by anisotropic conductive film 有权
公开(公告)号：US10504866B2
公开(公告)日：2019-12-10
申请号：US14030127
申请日：2013-09-18
申请人： Young Woo Park , Joon Mo Seo , Hyun Min Choi , Ji Yeon Kim , Kyoung Soo Park , Arum Yu , Jong Hyuk Eun
发明人： Young Woo Park , Joon Mo Seo , Hyun Min Choi , Ji Yeon Kim , Kyoung Soo Park , Arum Yu , Jong Hyuk Eun
IPC分类号： B32B27/00 , B32B27/08 , B32B27/38 , H01L23/00
CPC分类号： H01L24/29 , H01L24/83 , C09J2201/602 , H01L24/27 , H01L2224/293 , H01L2224/2929 , H01L2224/2939 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29388 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/32225 , H01L2224/73204 , H01L2224/83203 , H01L2224/83862 , H01L2924/07802 , H01L2224/2929 , H01L2924/0665 , H01L2224/29344 , H01L2924/00014 , H01L2224/29339 , H01L2924/00014 , H01L2224/29355 , H01L2924/00014 , H01L2224/29347 , H01L2924/00014 , H01L2224/293 , H01L2924/014 , H01L2224/29439 , H01L2924/00014 , H01L2224/29444 , H01L2924/00014 , H01L2224/29455 , H01L2924/00014 , H01L2924/07802 , H01L2924/00
摘要： A semiconductor device includes a first connecting member having a first electrode, a second connecting member having a second electrode, and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film electrically connecting the first and second electrodes to each other. The anisotropic conductive film includes a polymer binder resin, an epoxy resin, conductive particles, and a curing agent. The epoxy resin includes a naphthalene ring-containing epoxy resin and a dicyclopentadiene ring-containing epoxy resin. The naphthalene ring-containing epoxy resin is included in an amount of 100 parts by weight to 500 parts by weight based on 100 parts by weight of the dicyclopentadiene ring-containing epoxy resin.

8. 发明授权

US08604500B2 Light emitting device and light emitting device package 有权
标题翻译：发光器件和发光器件封装
公开(公告)号：US08604500B2
公开(公告)日：2013-12-10
申请号：US13031825
申请日：2011-02-22
申请人： Hyun Min Choi , Sun Kyung Kim , Woon Kyung Choi
发明人： Hyun Min Choi , Sun Kyung Kim , Woon Kyung Choi
IPC分类号： H01L33/46 , B82Y20/00
CPC分类号： H01L33/405 , H01L33/42 , H01L33/46 , H01L2224/48091 , H01L2924/00014
摘要： Provided are a light emitting device and a light emitting device package. The light emitting device includes a transparent substrate, a light emitting structure, and a first reflection layer. The light emitting structure includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer that are disposed on a top surface of the substrate. The first reflection layer is disposed on a bottom surface of the substrate. The bottom surface of the substrate has a surface roughness of about 1 nm to about 15 nm in root mean square (RMS) value.
摘要翻译：提供了一种发光器件和发光器件封装。发光器件包括透明衬底，发光结构和第一反射层。发光结构包括设置在基板的顶表面上的第一导电类型半导体层，有源层和第二导电类型半导体层。第一反射层设置在基板的底面上。基板的底表面的均方根（RMS）值具有约1nm至约15nm的表面粗糙度。

9. 发明申请

US20110260188A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM 有权
标题翻译：发光装置，发光装置包装和照明系统
公开(公告)号：US20110260188A1
公开(公告)日：2011-10-27
申请号：US13092275
申请日：2011-04-22
申请人： Hyun Min Choi , Sun Kyung Kim , Woon Kyung CHOI
发明人： Hyun Min Choi , Sun Kyung Kim , Woon Kyung CHOI
IPC分类号： H01L33/48
CPC分类号： H01L33/46 , H01L33/22 , H01L33/382 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on, a light transmissive substrate having a refractive index lower than a refractive index of a compound semiconductor layer, and a mirror structure layer having a structure in which a first mirror layer having a first refractive index and a second mirror layer having a second refractive index different from the first refractive index are alternately stacked on each other. The first mirror layer has a thickness of W·λ/(4·n1·m), and the second mirror layer has a thickness of W·λ(4·n2·m) in which the W represents a weight constant in a range of about 1.05 to about 1.25.
摘要翻译：公开了一种发光器件，发光器件封装和照明系统。发光器件包括在其上具有折射率低于化合物半导体层的折射率的透光基板上的第一导电半导体层，有源层和第二导电半导体层的发光结构，以及反射镜具有其中具有第一折射率的第一镜层和具有不同于第一折射率的第二折射率的第二镜层的结构的结构层彼此交替堆叠。第一镜层的厚度为W·λ/（4·n1·m），第二镜层的厚度为W·λ（4·n2·m），W表示重量常数范围约1.05至约1.25。

10. 发明授权

US08431945B2 Light emitting device, light emitting device package, and lighting system 有权
标题翻译：发光装置，发光装置封装和照明系统
公开(公告)号：US08431945B2
公开(公告)日：2013-04-30
申请号：US13092275
申请日：2011-04-22
申请人： Hyun Min Choi , Sun Kyung Kim , Woon Kyung Choi
发明人： Hyun Min Choi , Sun Kyung Kim , Woon Kyung Choi
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/46 , H01L33/22 , H01L33/382 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on, a light transmissive substrate having a refractive index lower than a refractive index of a compound semiconductor layer, and a mirror structure layer having a structure in which a first mirror layer having a first refractive index and a second mirror layer having a second refractive index different from the first refractive index are alternately stacked on each other. The first mirror layer has a thickness of W·λ/(4·n1·m), and the second mirror layer has a thickness of W·λ/(4·n2·m) in which the W represents a weight constant in a range of about 1.05 to about 1.25.
摘要翻译：公开了一种发光器件，发光器件封装和照明系统。发光器件包括在其上具有折射率低于化合物半导体层的折射率的透光基板上的第一导电半导体层，有源层和第二导电半导体层的发光结构，以及反射镜具有其中具有第一折射率的第一镜层和具有不同于第一折射率的第二折射率的第二镜层的结构的结构层彼此交替堆叠。第一镜层的厚度为W·λ/（4·n1·m），第二镜层的厚度为W·λ/（4·n2·m），其中W表示重量常数范围为约1.05至约1.25。

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