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1. 发明授权

US08047693B2 Cooling device for light emitting device package of vibration generating machine and head lamp for vibration generating machine 有权
标题翻译：振动发生机发光装置封装冷却装置及振动发生机头灯
公开(公告)号：US08047693B2
公开(公告)日：2011-11-01
申请号：US12507356
申请日：2009-07-22
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin , Shan Gao , Jong Woon Kim
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin , Shan Gao , Jong Woon Kim
IPC分类号： F21V7/00
CPC分类号： F21V29/63 , B61D29/00 , F21S41/141 , F21S41/143 , F21S45/43 , F21V29/02 , F21W2102/00 , F21W2107/10 , F21Y2115/10 , F28F13/00 , H01L2924/0002 , H01L2924/00
摘要： A cooling device for a light emitting device package of a vibration generating machine, includes: a heat releasing plate provided at one side of the light emitting device package; a vibrator disposed to face the heat releasing plate and vibrating to generate an air flow according to vibration of the vibration generating machine; and a vibration transfer unit configured to connect the vibrator and the heat releasing plate to allow the air flow generated from the vibrator to be transferred to the heat releasing plate so as to be cooled.
摘要翻译：一种用于振动发生机的发光器件封装的冷却装置，包括：设置在发光器件封装的一侧的散热板; 振动器，其设置为面对所述散热板并振动以根据所述振动发生机的振动产生气流; 以及振动传递单元，其构造成将所述振动器和所述散热板连接以允许从所述振动器产生的气流被传递到所述散热板以被冷却。

2. 发明申请

US20100124071A1 COOLING DEVICE FOR LIGHT EMITTING DEVICE PACKAGE OF VIBRATION GENERATING MACHINE AND HEAD LAMP FOR VIBRATION GENERATING MACHINE 有权
标题翻译：用于振动发生机的振动发生机和头灯的发光装置的冷却装置
公开(公告)号：US20100124071A1
公开(公告)日：2010-05-20
申请号：US12507356
申请日：2009-07-22
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin , Shan Gao , Jong Woon Kim
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin , Shan Gao , Jong Woon Kim
IPC分类号： F21V29/00 , F28F13/12
CPC分类号： F21V29/63 , B61D29/00 , F21S41/141 , F21S41/143 , F21S45/43 , F21V29/02 , F21W2102/00 , F21W2107/10 , F21Y2115/10 , F28F13/00 , H01L2924/0002 , H01L2924/00
摘要： A cooling device for a light emitting device package of a vibration generating machine, includes: a heat releasing plate provided at one side of the light emitting device package; a vibrator disposed to face the heat releasing plate and vibrating to generate an air flow according to vibration of the vibration generating machine; and a vibration transfer unit configured to connect the vibrator and the heat releasing plate to allow the air flow generated from the vibrator to be transferred to the heat releasing plate so as to be cooled.
摘要翻译：一种用于振动发生机的发光器件封装的冷却装置，包括：设置在发光器件封装的一侧的散热板; 振动器，其设置为面对所述散热板并振动以根据所述振动发生机的振动产生气流; 以及振动传递单元，其构造成将所述振动器和所述散热板连接以允许从所述振动器产生的气流被传递到所述散热板以被冷却。

3. 发明授权

US08973438B2 Inertial sensor and method of manufacturing the same 有权
标题翻译：惯性传感器及其制造方法
公开(公告)号：US08973438B2
公开(公告)日：2015-03-10
申请号：US13275397
申请日：2011-10-18
申请人： Jong Woon Kim , Sung Jun Lee , Won Kyu Jeung , Min Kyu Choi , Heung Woo Park
发明人： Jong Woon Kim , Sung Jun Lee , Won Kyu Jeung , Min Kyu Choi , Heung Woo Park
IPC分类号： G01P1/02 , G01P15/12 , G01P15/09 , G01C19/5769 , G01C19/5755 , G01P15/08
CPC分类号： G01C25/00 , B32B37/0076 , B32B37/02 , B32B37/12 , B32B37/18 , B32B38/10 , B32B2457/00 , C23F1/02 , G01C19/5755 , G01C19/5769 , G01P15/08 , G01P15/0802 , G01P15/135 , G01P2015/084 , Y10T156/1064
摘要： Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130.
摘要翻译：这里公开了惯性传感器及其制造方法。根据本发明的优选实施例的惯性传感器100被构造成包括板状膜110，设置在膜110的中心部分113下方的质量体120，设置在膜110的边缘115下方的柱130 110，以支撑膜110，底盖150的边缘153设置有第一腔155，粘合剂140被引入到其中，其中粘合剂140将边缘153粘合到柱的底表面，由此底盖150的边缘153设置有第一腔155以将粘合剂140引入第一腔155中，从而防止粘合剂140渗透到柱130中。

4. 发明授权

US08789418B2 Inertial sensor and angular velocity detection method using the same 有权
标题翻译：惯性传感器和角速度检测方法使用相同
公开(公告)号：US08789418B2
公开(公告)日：2014-07-29
申请号：US13591335
申请日：2012-08-22
申请人： Jong Woon Kim , Liwei Lin , Minyao Mao , Won Kyu Jeung
发明人： Jong Woon Kim , Liwei Lin , Minyao Mao , Won Kyu Jeung
IPC分类号： G01C19/56
CPC分类号： G01C19/574
摘要： Disclosed herein is an inertial sensor. The inertial sensor includes: a plurality of driving masses; support bodies connecting a connection bridge so as to support the driving masses; a connection bridge connecting the plurality of driving masses and connecting the plurality of driving masses with the support bodies; and an electrode pattern part including driving electrodes simultaneously driving the driving masses and sensing electrode detecting axial Coriolis force of each of the driving masses.
摘要翻译：这里公开了惯性传感器。惯性传感器包括：多个驱动质量块; 支撑体连接连接桥，以支撑驱动块; 连接所述多个驱动块并将所述多个驱动块与所述支撑体连接的连接桥; 以及电极图案部，其包括驱动电极，同时驱动驱动质量，感测电极检测每个驱动质量块的轴向科里奥利力。

5. 发明授权

US08789417B2 Inertial sensor and angular velocity detection method using the same 有权
标题翻译：惯性传感器和角速度检测方法使用相同
公开(公告)号：US08789417B2
公开(公告)日：2014-07-29
申请号：US13303334
申请日：2011-11-23
申请人： Jong Woon Kim , Heung Woo Park , Won Kyu Jeung
发明人： Jong Woon Kim , Heung Woo Park , Won Kyu Jeung
IPC分类号： G01C19/56
CPC分类号： G01P15/08 , G01C19/5747 , G01P15/18
摘要： Disclosed herein is an inertial sensor including: a driving part displaceably supported by a support; a driving electrode vibrating the driving part; and a detecting electrode detecting a force acting on the driving part in a predetermined direction, wherein the driving part includes: a center driving mass positioned at the center of the inertial sensor; side driving masses connected to and interlocking with the center driving mass and positioned at four sides based on the center driving mass; and connection bridges connecting the center driving mass, the side driving masses, and the support to each other.
摘要翻译：本文公开了一种惯性传感器，包括：可移动地由支撑件支撑的驱动部分; 驱动电极使所述驱动部振动; 以及检测电极，其在预定方向上检测作用在所述驱动部件上的力，其中所述驱动部件包括：位于所述惯性传感器的中心的中心驱动质量块; 连接到中心驱动质量块并且与中心驱动质量块互锁的侧驱动质量块，并且基于中心驱动质量被定位在四侧; 以及将中心驱动质量块，侧驱动块和支撑件彼此连接的连接桥。

6. 发明申请

US20130122189A1 METHOD OF MANUFACTURING INERTIAL SENSOR 有权
标题翻译：制造传感器的方法
公开(公告)号：US20130122189A1
公开(公告)日：2013-05-16
申请号：US13541279
申请日：2012-07-03
申请人： Jong Woon Kim , Jung Won Lee
发明人： Jong Woon Kim , Jung Won Lee
IPC分类号： B05D5/00
CPC分类号： G01C19/5769 , G01P15/0802
摘要： Disclosed herein is a method of manufacturing an inertial sensor. The method includes: (A) preparing a base substrate; (B) forming a depressed first concave part in one surface of the base substrate; (C) forming a mass body in the first concave part by filling a metal or a combination of a metal and a polymer (or a polymer matrix composite) therein; and (D) forming a depressed second concave part in one surface of the base substrate at an outer side of the mass body and forming a flexible part on an upper portion of the second concave part in the base substrate. The mass body formed of the metal or the combination of the metal and the polymer (or the polymer matrix composite) has high density, thereby making it possible to improve sensitivity of the inertial sensor.
摘要翻译：本文公开了一种制造惯性传感器的方法。该方法包括：（A）制备基底; （B）在基底基板的一个表面上形成凹陷的第一凹部; （C）通过在其中填充金属或金属和聚合物（或聚合物基质复合材料）的组合来在第一凹部中形成质量体; 和（D）在所述质量体的外侧形成在所述基底基板的一个表面中的凹陷的第二凹部，并且在所述基底基板的所述第二凹部的上部形成柔性部。由金属形成的质量体或金属和聚合物（或聚合物基质复合体）的组合具有高密度，从而可以提高惯性传感器的灵敏度。

7. 发明授权

US08213531B2 Apparatus for transmitting signal in semiconductor integrated circuit 失效
标题翻译：在半导体集成电路中传输信号的装置
公开(公告)号：US08213531B2
公开(公告)日：2012-07-03
申请号：US11966250
申请日：2007-12-28
申请人： Hyung Soo Kim , Kun Woo Park , Yong Ju Kim , Jong Woon Kim , Hee Woong Song , Ic Su Oh , Tae Jin Hwang
发明人： Hyung Soo Kim , Kun Woo Park , Yong Ju Kim , Jong Woon Kim , Hee Woong Song , Ic Su Oh , Tae Jin Hwang
IPC分类号： H04L25/34
CPC分类号： H04L25/4917
摘要： An apparatus for transmitting a signal in a semiconductor integrated circuit includes a multilevel transmission control block that outputs a plurality of bits of an input signal in serial or parallel according to whether a multilevel transmission operation is performed or not, and a signal processing block that selectively performs the multilevel transmission operation according to a form of the input signal, which are output in serial or parallel from the multilevel transmission control block.
摘要翻译：一种用于在半导体集成电路中发送信号的装置包括：多电平传输控制块，其根据是否执行多级传输操作来串行或并行输出输入信号的多个位;以及信号处理块，其选择性地根据从多级传输控制块串行或并行输出的输入信号的形式执行多级传输操作。

8. 发明授权

US07473035B2 Bearing assembly and method for manufacturing the same 有权
标题翻译：轴承组装及其制造方法
公开(公告)号：US07473035B2
公开(公告)日：2009-01-06
申请号：US11679038
申请日：2007-02-26
申请人： Dai Gil Lee , Dong Chang Park , Seong Min Lee , Byung Chul Kim , Hak Sung Kim , Sung Su Kim , Jong Woon Kim
发明人： Dai Gil Lee , Dong Chang Park , Seong Min Lee , Byung Chul Kim , Hak Sung Kim , Sung Su Kim , Jong Woon Kim
IPC分类号： F16C25/04
CPC分类号： F16C9/04 , F16C11/0633 , F16C33/201 , F16J1/22 , Y10T403/32631
摘要： A bearing assembly includes a spherical journal and a hemispherical bearing that is made of a fiber reinforced composite and has a bearing surface for establishing a spherical pair with the spherical journal. The fiber reinforced composite can be constructed by arranging a uni-directional prepreg, woven fiber prepregs and staple-fiber prepregs in a variety of configurations, and thermoplastic resin particles or self-lubrication particles are uniformly provided on the bearing surface. It is possible to alleviate stress concentration generated on the bearing surface by forming a plurality of air channels capable of imparting directivity on an outer surface of the hemispherical bearing.
摘要翻译：轴承组件包括球形轴颈和由纤维增强复合材料制成并具有用于与球形轴颈建立球形对的支承表面的半球形轴承。纤维增强复合材料可以通过以各种构造布置单向预浸料坯料，编织纤维预浸料坯料和短纤维预浸料坯而构成，并且热塑性树脂颗粒或自润滑颗粒均匀地设置在轴承表面上。通过形成能够赋予半球形轴承的外表面方向性的多个空气通道，可以减轻在轴承表面上产生的应力集中。

9. 发明申请

US20080088360A1 Power supply apparatus of semiconductor integrated circuit 失效
标题翻译：半导体集成电路供电装置
公开(公告)号：US20080088360A1
公开(公告)日：2008-04-17
申请号：US11822269
申请日：2007-07-03
申请人： Hyung Soo Kim , Kun Woo Park , Yong Ju Kim , Ic Su Oh , Hee Woong Song , Jong Woon Kim , Tae Jin Hwang
发明人： Hyung Soo Kim , Kun Woo Park , Yong Ju Kim , Ic Su Oh , Hee Woong Song , Jong Woon Kim , Tae Jin Hwang
IPC分类号： G05F5/00
CPC分类号： G06F1/28
摘要： A power supply apparatus of a semiconductor integrated circuit includes a power control device that detects a level of power supplied from the outside and outputs a control signal as information on the detected level, and a power supply device that controls an internal resistance component in response to an input of the control signal, controls the level of the power supplied from the outside, and supplies the power having the controlled level to circuit blocks.
摘要翻译：半导体集成电路的电源装置包括功率控制装置，其检测从外部供给的电力的电平，并输出作为关于检测电平的信息的控制信号;以及电源装置，其响应于控制信号的输入控制从外部提供的电力的电平，并将具有受控电平的电力提供给电路块。

10. 发明申请

US20130036818A1 INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME 有权
公开(公告)号：US20130036818A1
公开(公告)日：2013-02-14
申请号：US13275397
申请日：2011-10-18
申请人： Jong Woon Kim , Sung Jun Lee , Won Kyu Jeung , Min Kyu Choi , Heung Woo Park
发明人： Jong Woon Kim , Sung Jun Lee , Won Kyu Jeung , Min Kyu Choi , Heung Woo Park
IPC分类号： G01C19/00 , C23F1/00 , B29C65/48
CPC分类号： G01C25/00 , B32B37/0076 , B32B37/02 , B32B37/12 , B32B37/18 , B32B38/10 , B32B2457/00 , C23F1/02 , G01C19/5755 , G01C19/5769 , G01P15/08 , G01P15/0802 , G01P15/135 , G01P2015/084 , Y10T156/1064
摘要： Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130.

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