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1. 发明授权

US06310755B1 Electrostatic chuck having gas cavity and method 有权
标题翻译：具有气腔和方法的静电吸盘
公开(公告)号：US06310755B1
公开(公告)日：2001-10-30
申请号：US09307215
申请日：1999-05-07
申请人： Arnold Kholodenko , Shamouil Shamouilian , You Wang , Wing L. Cheng , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Ananda H. Kumar
发明人： Arnold Kholodenko , Shamouil Shamouilian , You Wang , Wing L. Cheng , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Ananda H. Kumar
IPC分类号： H01G2300
CPC分类号： C04B35/565 , C04B35/185 , C04B35/806 , C04B37/006 , C04B37/026 , C04B41/009 , C04B41/5155 , C04B41/88 , C04B2235/402 , C04B2235/5248 , C04B2235/616 , C04B2235/96 , C04B2235/9607 , C04B2237/121 , C04B2237/343 , C04B2237/365 , C04B2237/366 , C04B2237/405 , C04B2237/60 , C22C29/00 , C22C2204/00 , H01L21/67109 , H01L21/6831 , H01L21/6833 , C04B38/00 , C04B41/4523
摘要： An electrostatic chuck 55 has an electrostatic member 100 including a dielectric 115 having a surface 120 adapted to receive the substrate 30. The dielectric 115 covers an electrode 105 that is chargeable to electrostatically hold the substrate 30. A support 190 below the electrostatic member 100 has a cavity 300 adapted to hold a gas to serve as a thermal insulator to regulate the flow of heat from the electrostatic chuck 55 to a surface 120 of the chamber 25. The cavity 300 has a cross-sectional profile that is shaped to provide a predetermined temperature profile across the substrate 30.
摘要翻译：静电吸盘55具有静电构件100，静电构件100包括具有适于接纳衬底30的表面120的电介质115.电介质115覆盖电极105，电极105可充电以静电保持衬底30.静电构件100下方的支撑件190具有空腔300适于保持气体以用作热绝缘体，以调节从静电卡盘55到腔室25的表面120的热量流动。空腔300具有截面轮廓，其形状设置成提供预定的跨越衬底30的温度分布。

2. 发明授权

US06490146B2 Electrostatic chuck bonded to base with a bond layer and method 失效
公开(公告)号：US06490146B2
公开(公告)日：2002-12-03
申请号：US09929806
申请日：2001-08-13
申请人： You Wang , Shamouil Shamouilian , Arnold Kholodenko , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
发明人： You Wang , Shamouil Shamouilian , Arnold Kholodenko , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
IPC分类号： H01G2300
CPC分类号： C04B37/026 , C04B37/006 , C04B37/021 , C04B2237/121 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/341 , C04B2237/343 , C04B2237/348 , C04B2237/36 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/401 , C04B2237/402 , C04B2237/403 , C04B2237/406 , C04B2237/407 , C04B2237/61 , C04B2237/62 , C04B2237/64 , C04B2237/74 , H01L21/6831 , H01L21/6833
摘要： An electrostatic chuck for holding a substrate has an electrostatic member having a dielectric covering an electrode that is chargeable to electrostatically hold the substrate. The bond layer has a metal layer that is infiltrated or brazed between the electrostatic member and the base. The base may be a composite of a ceramic and metal, the composite having a coefficient of thermal expansion within about ±30% of a coefficient of thermal expansion of the electrostatic member. The base may also have a heater.

3. 发明授权

US06462928B1 Electrostatic chuck having improved electrical connector and method 有权
标题翻译：具有改进的电连接器和方法的静电卡盘
公开(公告)号：US06462928B1
公开(公告)日：2002-10-08
申请号：US09306944
申请日：1999-05-07
申请人： Shamouil Shamouilian , You Wang , Surinder S. Bedi , Arnold Kholodenko , Alexander M. Veytser , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
发明人： Shamouil Shamouilian , You Wang , Surinder S. Bedi , Arnold Kholodenko , Alexander M. Veytser , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
IPC分类号： H02N1300
CPC分类号： H02N13/00 , H01L21/6833
摘要： An electrostatic chuck 55 comprises an electrical connector 140 which is connected to the electrode 105 to conduct an electrical charge to the electrode 105. The electrical connector 140 comprises a refractory metal having a melting temperature of at least about 1500° C., such as for example, tungsten, titanium, nickel, tantalum, molybdenum, or alloys thereof. Preferably, the electrical connector 140 is bonded to the electrode 105 by a metal having a softening temperature of less than about 600° C., such as aluminum, indium, or low melting point alloys.
摘要翻译：静电卡盘55包括电连接器140，电连接器140连接到电极105以将电荷引导到电极105.电连接器140包括具有至少约1500℃的熔化温度的难熔金属，例如用于例如钨，钛，镍，钽，钼或其合金。优选地，电连接器140通过软化温度小于约600℃的金属（例如铝，铟或低熔点合金）结合到电极105。

4. 发明授权

US06538872B1 Electrostatic chuck having heater and method 失效
标题翻译：具有加热器和方法的静电吸盘
公开(公告)号：US06538872B1
公开(公告)日：2003-03-25
申请号：US09307214
申请日：2001-11-05
申请人： You Wang , Shamouil Shamouilian , Arnold Kholodenko , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
发明人： You Wang , Shamouil Shamouilian , Arnold Kholodenko , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
IPC分类号： H01G2300
CPC分类号： H01L21/6833 , H01L21/67103
摘要： An electrostatic chuck 55 for holding a substrate 30 comprises an electrostatic member 100 made from a dielectric 115 covering an electrode 105 that is chargeable to electrostatically hold the substrate 30. A base 175 that includes a heater 235 is joined to the electrostatic member 100. The base may be made from a composite material, such as a porous ceramic infiltrated with the metal, and may be joined to the electrostatic member by a bond layer.
摘要翻译：用于保持基板30的静电卡盘55包括由覆盖电极105的电介质115制成的静电构件100，电极105可充电以静电保持基板30.包括加热器235的基座175与静电构件100接合。基底可以由复合材料制成，例如渗透有金属的多孔陶瓷，并且可以通过接合层与静电部件接合。

5. 发明授权

US06503368B1 Substrate support having bonded sections and method 失效
标题翻译：具有接合部分和方法的基板支撑
公开(公告)号：US06503368B1
公开(公告)日：2003-01-07
申请号：US09607533
申请日：2000-06-29
申请人： Arnold Kholodenko , Vijay Parkhe , Shamouil Shamouilian , You Wang , Wing L. Cheng , Alexander M. Veytser
发明人： Arnold Kholodenko , Vijay Parkhe , Shamouil Shamouilian , You Wang , Wing L. Cheng , Alexander M. Veytser
IPC分类号： C23C1600
CPC分类号： H01L21/67103 , C23C16/4581 , C23C16/4586 , H01J2237/2001
摘要： A substrate support 55 comprises first, second and third sections 88, 90, 92 connected to one another by first and second bonds 106, 108, one of the sections comprises a surface 75 adapted to receive a substrate 25. The first bond 106 comprises a first bonding material and the second bond 108 comprises a second bonding material. In one version, the first bonding material is capable of bonding surfaces when heated to a first temperature and the second bonding material is capable of bonding surfaces when heated to a second temperature.
摘要翻译：衬底支撑件55包括通过第一和第二键106,108彼此连接的第一，第二和第三部分88,90,92，其中一个部分包括适于接收衬底25的表面75.第一结合106包括第一接合材料和第二接合108包括第二接合材料。在一个版本中，第一接合材料能够在被加热到第一温度时粘合表面，并且第二接合材料能够在被加热到第二温度时粘合表面。

6. 发明授权

US06583980B1 Substrate support tolerant to thermal expansion stresses 失效
标题翻译：基材支持耐热膨胀应力
公开(公告)号：US06583980B1
公开(公告)日：2003-06-24
申请号：US09641536
申请日：2000-08-18
申请人： You Wang , Arnold Kholodenko , Shamouil Shamouilian , Alexander M. Veytser , Wing L. Cheng
发明人： You Wang , Arnold Kholodenko , Shamouil Shamouilian , Alexander M. Veytser , Wing L. Cheng
IPC分类号： H01G300
CPC分类号： H01L21/6831
摘要： A chamber 30 for processing a substrate 25 comprises a support 55 including an electrode 70 at least partially covered by a dielectric 60 that is permeable to electromagnetic energy. The electrode 70 may be chargeable to electrostatically hold the substrate 25, to couple energy to a gas in the chamber 30, or both. A base 90 below the support 55 comprises a slot 95 that may be adapted to serve as a thermal expansion slot to reduce thermal stresses.
摘要翻译：用于处理基板25的室30包括支撑件55，其包括至少部分地被电介质60覆盖的电极70，电介质60可透过电磁能。电极70可以被充电以静电保持衬底25，以将能量耦合到腔室30中的气体，或两者。支撑件55下方的底座90包括可适于用作热膨胀槽以减少热应力的槽95。

7. 发明授权

US06736668B1 High temperature electrical connector 失效
标题翻译：高温电连接器
公开(公告)号：US06736668B1
公开(公告)日：2004-05-18
申请号：US09663864
申请日：2000-09-15
申请人： Arnold V. Kholodenko , Senh Thach , Wing L. Cheng , Alvin Lau , Dennis S. Grimard
发明人： Arnold V. Kholodenko , Senh Thach , Wing L. Cheng , Alvin Lau , Dennis S. Grimard
IPC分类号： H01R1300
CPC分类号： H01R13/533 , H01R2201/24
摘要： An electrical coupler comprises an inner connector having upper and lower ends, an insulative outer connector element circumscribing the inner connector, and a thermally conductive flange disposed over the upper end of the inner connector and the outer connector for conducting heat from the electrical conductor. The electrical conductor may be utilized in a substrate support for semiconductor wafer processing. The substrate support comprises a chuck body having an electrode embedded therein, and an upper male connector coupled to the electrode and protruding from said chuck body. A cooling plate having the electrical coupler is positioned proximate to the chuck body. The upper male connector is inserted in the electrical coupler, and a power source coupled to the lower portion of the electrical coupler chucks and biases a wafer to an upper surface of said chuck. The thermally conductive flange conducts and transfers heat generated from the upper male connector and electrical coupler to the cooling plate.
摘要翻译：电耦合器包括具有上端和下端的内连接器，限定内连接器的绝缘外连接器元件和设置在内连接器的上端上的导热凸缘和用于传导来自电导体的热的外连接器。电导体可以用于半导体晶片处理的衬底支撑件中。衬底支撑件包括具有嵌入其中的电极的卡盘体，以及耦合到电极并从所述卡盘体突出的上部阳连接器。具有电耦合器的冷却板位于卡盘主体附近。上部阳连接器插入电耦合器中，并且耦合到电耦合器的下部的电源卡住并将晶片偏置到所述卡盘的上表面。导热凸缘传导和传递从上阳连接器和电耦合器产生的热量到冷却板。

8. 发明授权

US06676760B2 Process chamber having multiple gas distributors and method 失效
标题翻译：具有多个气体分配器和方法的处理室
公开(公告)号：US06676760B2
公开(公告)日：2004-01-13
申请号：US09930938
申请日：2001-08-16
申请人： Arnold V. Kholodenko , Dan Katz , Wing L. Cheng
发明人： Arnold V. Kholodenko , Dan Katz , Wing L. Cheng
IPC分类号： C23C1600
CPC分类号： C23C16/45519 , C23C16/455
摘要： A substrate processing chamber has a substrate support to support a substrate, and an exhaust conduit about the substrate support. A first process gas distributor directs a first process gas, such as a non-reactive gas, about the substrate perimeter and toward the exhaust conduit at a first flow rate to form a curtain of non-reactive gas about the substrate. A second process gas distributor directs a second process gas, such as reactive CVD or etchant gas, toward a central portion of the substrate at a second flow rate which is lower than the first flow rate. A gas energizer energizes the first and second process gases in the chamber. A controller operates the substrate support, gas flow meters, gas energizer, and throttle valve, to process the substrate in the energized gas.
摘要翻译：基板处理室具有用于支撑基板的基板支撑件和围绕基板支撑件的排气导管。第一工艺气体分配器以第一流量引导诸如非反应性气体的第一工艺气体，例如基板周边和朝向排气管道，以在衬底周围形成非反应性气体帘幕。第二工艺气体分配器以比第一流量低的第二流量向衬底的中心部分引导第二工艺气体，例如反应性CVD或蚀刻剂气体。气体激发器激励腔室中的第一和第二处理气体。控制器操作衬底支撑件，气体流量计，气体激励器和节流阀，以处理通电气体中的衬底。

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