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1. 发明申请

US20110155504A1 SILENCING EQUIPMENT FOR ELECTRIC DEVICES 有权
标题翻译：电气设备沉没设备
公开(公告)号：US20110155504A1
公开(公告)日：2011-06-30
申请号：US13044133
申请日：2011-03-09
申请人： YOSUKE TANABE , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
发明人： YOSUKE TANABE , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
IPC分类号： E04F17/04
CPC分类号： G10K11/172 , H05K7/20718
摘要： Silencing equipment provided with one or more flow channels through which cooling air flows has a flow channel forming member that forms the flow channel, and an acoustic absorbent member that is fixed to the flow channel forming member. A resonance type silencer is formed on a wall surface of the flow channel by providing a cavity for the resonance type silencer in the acoustic absorbent member and an aperture for the resonance type silencer in a portion of the flow channel forming member. The resonance type silencer sets a frequency of noise necessary to be reduced based on a peak frequency of noise generated by a fan. The silencing equipment further has a slide member which slides by a slide mechanism to adjust the area of the top of the aperture. The silencing equipment for electronic devices capable of cooling heat generating sections thereof with air has a small and simple structure and can improve a silencing effect by blowing air.
摘要翻译：设置有冷却空气流过的一个或多个流动通道的沉降设备具有形成流路的流路形成部件，以及固定在流路形成部件上的吸声部件。通过在吸声部件中设置共振型消音器的空腔，在流路形成部件的一部分设置共振型消音器的开口，在流路的壁面上形成共振型消音器。谐振型消声器基于由风扇产生的噪声的峰值频率来设定需要减小的噪声频率。消音装置还具有滑动构件，滑动构件通过滑动机构滑动以调节孔的顶部的面积。能够用空气冷却发热部的电子设备的消音装置结构简单，结构简单，能够通过吹送空气来提高消音效果。

2. 发明授权

US08485310B2 Silencing equipment for electric devices 有权
标题翻译：电气设备消音设备
公开(公告)号：US08485310B2
公开(公告)日：2013-07-16
申请号：US13044133
申请日：2011-03-09
申请人： Yosuke Tanabe , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
发明人： Yosuke Tanabe , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
IPC分类号： F01N1/04 , F24F13/24 , F01N1/00 , F24F13/00
CPC分类号： G10K11/172 , H05K7/20718
摘要： Silencing equipment provided with one or more flow channels through which cooling air flows has a flow channel forming member that forms the flow channel, and an acoustic absorbent member that is fixed to the flow channel forming member. A resonance type silencer is formed on a wall surface of the flow channel by providing a cavity for the resonance type silencer in the acoustic absorbent member and an aperture for the resonance type silencer in a portion of the flow channel forming member. The resonance type silencer sets a frequency of noise necessary to be reduced based on a peak frequency of noise generated by a fan. The silencing equipment further has a slide member which slides by a slide mechanism to adjust the area of the top of the aperture. The silencing equipment for electronic devices capable of cooling heat generating sections thereof with air has a small and simple structure and can improve a silencing effect by blowing air.
摘要翻译：设置有冷却空气流过的一个或多个流动通道的沉降设备具有形成流路的流路形成部件，以及固定在流路形成部件上的吸声部件。通过在吸声部件中设置共振型消音器的空腔，在流路形成部件的一部分设置共振型消音器的开口，在流路的壁面上形成共振型消音器。谐振型消声器基于由风扇产生的噪声的峰值频率来设定需要减小的噪声频率。消音装置还具有滑动构件，滑动构件通过滑动机构滑动以调节孔的顶部的面积。能够用空气冷却发热部的电子设备的消音装置结构简单，结构简单，能够通过吹送空气来提高消音效果。

3. 发明申请

US20100078258A1 SILENCING EQUIPMENT FOR ELECTRIC DEVICES 审中-公开
标题翻译：电气设备沉没设备
公开(公告)号：US20100078258A1
公开(公告)日：2010-04-01
申请号：US12536598
申请日：2009-08-06
申请人： Yosuke TANABE , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
发明人： Yosuke TANABE , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
IPC分类号： G10K11/172 , E04F17/04
CPC分类号： G10K11/172 , H05K7/20718
摘要： Silencing equipment provided with one or more flow channels through which cooling air flows has a flow channel forming member that forms the flow channel, and an acoustic absorbent member that is fixed to the flow channel forming member. A resonance type silencer is formed on a wall surface of the flow channel by providing a cavity for the resonance type silencer in the acoustic absorbent member and an aperture for the resonance type silencer in a portion of the flow channel forming member. The resonance type silencer sets a frequency of noise necessary to be reduced based on a peak frequency of noise generated by a fan. The silencing equipment further has a slide member which slides by a slide mechanism to adjust the area of the top of the aperture. The silencing equipment for electronic devices capable of cooling heat generating sections thereof with air has a small and simple structure and can improve a silencing effect by blowing air.
摘要翻译：设置有冷却空气流过的一个或多个流动通道的沉降设备具有形成流路的流路形成部件，以及固定在流路形成部件上的吸声部件。通过在吸声部件中设置共振型消音器的空腔，在流路形成部件的一部分设置共振型消音器的开口，在流路的壁面上形成共振型消音器。谐振型消声器基于由风扇产生的噪声的峰值频率来设定需要减小的噪声频率。消音装置还具有滑动构件，滑动构件通过滑动机构滑动以调节孔的顶部的面积。能够用空气冷却发热部的电子设备的消音装置结构简单，结构简单，能够通过吹送空气来提高消音效果。

4. 发明申请

US20100187037A1 Sound Absorbing Structure of Electronic Equipment 有权
标题翻译：电子设备吸声结构
公开(公告)号：US20100187037A1
公开(公告)日：2010-07-29
申请号：US12752781
申请日：2010-04-01
申请人： Akira Goto , Akio Idei , Shigeyasu Tsubaki
发明人： Akira Goto , Akio Idei , Shigeyasu Tsubaki
IPC分类号： F01N13/00 , H02K5/24
CPC分类号： F24F13/24 , G06F1/182
摘要： In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.
摘要翻译：为了提供能够在保持电子设备的冷却能力的同时降低电子设备的噪音的吸声结构，提供了一种吸声结构，其中通过布置多个具有预定的在来自鼓风机的冷却流体的流动通道中以预定间隔形状，并且布置多个声学材料，使得垂直入射在来自鼓风机的穿透开口的穿透平面上的声音不会直接离开电子设备。

5. 发明授权

US08074765B2 Sound absorbing structure of electronic equipment 有权
标题翻译：电子设备吸音结构
公开(公告)号：US08074765B2
公开(公告)日：2011-12-13
申请号：US12752781
申请日：2010-04-01
申请人： Akira Goto , Akio Idei , Shigeyasu Tsubaki
发明人： Akira Goto , Akio Idei , Shigeyasu Tsubaki
IPC分类号： E04B1/82 , E04F17/04 , F01N13/00 , G10K11/00 , G10K11/04 , H02K5/24 , H05K7/20
CPC分类号： F24F13/24 , G06F1/182
摘要： In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.
摘要翻译：为了提供能够在保持电子设备的冷却能力的同时降低电子设备的噪音的吸声结构，提供了一种吸声结构，其中通过布置多个具有预定的在来自鼓风机的冷却流体的流动通道中以预定间隔形状，并且布置多个声学材料，使得垂直入射在来自鼓风机的穿透开口的穿透平面上的声音不会直接离开电子设备。

6. 发明授权

US07936560B2 Cooling device and electronic equipment including cooling device 有权
标题翻译：冷却装置和电子设备包括冷却装置
公开(公告)号：US07936560B2
公开(公告)日：2011-05-03
申请号：US12544166
申请日：2009-08-19
申请人： Hiroyuki Toyoda , Akio Idei , Shigeyasu Tsubaki , Tadakatsu Nakajima , Yoshihiro Kondo , Tomoo Hayashi
发明人： Hiroyuki Toyoda , Akio Idei , Shigeyasu Tsubaki , Tadakatsu Nakajima , Yoshihiro Kondo , Tomoo Hayashi
IPC分类号： H05K7/20
CPC分类号： F28D15/043 , F28D15/046 , H01L2924/0002 , H05K7/20809 , H01L2924/00
摘要： A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.
摘要翻译：提供了包括具有高性能CPU的冷却结构的刀片服务器。为了提高滞留在翅片之间的冷凝工作流体的排水性能，使用蒸气冷凝管，在上述管内表面上沿与管轴方向大致平行的方向形成有槽，上述散热片的一排在上述槽的侧面露出，当上述槽位于上述的蒸汽冷凝管的管轴方向的中心线时，上述槽沿垂直方向配置在下侧将上述凹槽安装在上述蒸汽冷凝管中，并且将具有小于上述翅片排的翅片空间的线空间的芯填充在上述凹槽内。

7. 发明授权

US07839640B2 Electronic device and a thermal connector used therein 有权
标题翻译：电子设备和其中使用的热连接器
公开(公告)号：US07839640B2
公开(公告)日：2010-11-23
申请号：US12544137
申请日：2009-08-19
申请人： Tomoo Hayashi , Tadakatsu Nakajima , Yoshihiro Kondo , Hiroyuki Toyoda , Akio Idei , Shigeyasu Tsubaki
发明人： Tomoo Hayashi , Tadakatsu Nakajima , Yoshihiro Kondo , Hiroyuki Toyoda , Akio Idei , Shigeyasu Tsubaki
IPC分类号： H05K7/20
CPC分类号： G06F1/185 , G06F1/20 , H05K7/20772
摘要： An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.
摘要翻译：电子设备包括：壳体; 叶片，其每一个都可从壳体拆卸，并且至少安装有CPU和存储器; 第一冷却装置，每个冷却装置取出在叶片外部的叶片中产生的热量，所述第一冷却装置中的每一个具有固定到叶片的细长柱形式的散热部分; 第二冷却装置固定到壳体以排出从壳体外部的第一冷却装置输送的热量，每个所述第二冷却装置具有能够容纳第一冷却装置的散热部分的吸热部分; 当散热部分插入到吸热部分中时，形成在散热部和吸热部之间的间隙流体连通的中间容器; 存储在每个介质储存器中的导热介质; 用于对导热介质加压以将导热介质供应到间隙的加压装置，以及形成在散热部分和吸热部分之间的可拆卸连接部分。

8. 发明申请

US20120138285A1 ELECTRONIC APPARATUS RACK AND DATA CENTER 审中-公开
标题翻译：电子设备机架和数据中心
公开(公告)号：US20120138285A1
公开(公告)日：2012-06-07
申请号：US13307476
申请日：2011-11-30
申请人： Shigeyasu Tsubaki , Akio Idei
发明人： Shigeyasu Tsubaki , Akio Idei
IPC分类号： F28D15/04 , G05D23/00
CPC分类号： H05K7/20781
摘要： An electronic apparatus rack which can prevent the degradation of cooling performance due to local heat concentration on the exhaust side of the server. The electronic apparatus rack having electronic apparatuses mounted thereon, consists of a radiator incorporated in the rear door of the electronic apparatus rack; plural fans installed on the exhaust side of the radiator; and plural heat pipes installed on the intake side of the radiator.
摘要翻译：一种电子设备架，其能够防止由于服务器的排气侧的局部热集中而引起的冷却性能的劣化。安装有电子设备的电子设备机架由装在电子设备机架的后门中的散热器组成; 多个风扇安装在散热器的排气侧; 以及安装在散热器的吸入侧的多个热管。

9. 发明申请

US20100073866A1 COOLING DEVICE AND ELECTRONIC EQUIPMENT INCLUDING COOLING DEVICE 有权
标题翻译：冷却装置和包括冷却装置的电子设备
公开(公告)号：US20100073866A1
公开(公告)日：2010-03-25
申请号：US12544166
申请日：2009-08-19
申请人： Hiroyuki TOYODA , Akio Idei , Shigeyasu Tsubaki , Tadakatsu Nakajima , Yoshihiro Kondo , Tomoo Hayashi
发明人： Hiroyuki TOYODA , Akio Idei , Shigeyasu Tsubaki , Tadakatsu Nakajima , Yoshihiro Kondo , Tomoo Hayashi
IPC分类号： H05K7/20 , F28F13/00
CPC分类号： F28D15/043 , F28D15/046 , H01L2924/0002 , H05K7/20809 , H01L2924/00
摘要： A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.
摘要翻译：提供了包括具有高性能CPU的冷却结构的刀片服务器。为了提高滞留在翅片之间的冷凝工作流体的排水性能，使用蒸气冷凝管，在上述管内表面上沿与管轴方向大致平行的方向形成有槽，上述散热片的一排在上述槽的侧面露出，当上述槽位于上述的蒸汽冷凝管的管轴方向的中心线时，上述槽沿垂直方向配置在下侧将上述凹槽安装在上述蒸汽冷凝管中，并且将具有小于上述翅片排的翅片空间的线空间的芯填充在上述凹槽内。

10. 发明申请

US20100073863A1 ELECTRONIC APPARATUS 有权
标题翻译：电子设备
公开(公告)号：US20100073863A1
公开(公告)日：2010-03-25
申请号：US12544153
申请日：2009-08-19
申请人： Hitoshi MATSUSHIMA , Tadakatsu Nakajima , Takayuki Atarashi , Yoshihiro Kondo , Hiroyuki Toyoda , Tomoo Hayashi , Akio Idei , Shigeyasu Tsubaki , Takumi Sugiura , Yasuhiro Kashirajima
发明人： Hitoshi MATSUSHIMA , Tadakatsu Nakajima , Takayuki Atarashi , Yoshihiro Kondo , Hiroyuki Toyoda , Tomoo Hayashi , Akio Idei , Shigeyasu Tsubaki , Takumi Sugiura , Yasuhiro Kashirajima
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , H05K7/20245
摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.
摘要翻译：诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管，其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。

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