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1. 发明授权

US5446315A Resin-sealed semiconductor device containing porous fluorocarbon resin 失效
标题翻译：含有多孔碳氟树脂的树脂密封半导体器件
公开(公告)号：US5446315A
公开(公告)日：1995-08-29
申请号：US182520
申请日：1994-01-11
申请人： Yoshito Hazaki , Minoru Hatakeyama , Sunao Fukutake , Akira Urakami
发明人： Yoshito Hazaki , Minoru Hatakeyama , Sunao Fukutake , Akira Urakami
IPC分类号： H01L23/29 , H01L23/495 , H01L23/36 , H01L23/02 , H01L23/12 , H01L39/02
CPC分类号： H01L23/293 , H01L23/295 , H01L23/49586 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/0102 , H01L2924/01079 , H01L2924/181
摘要： A resin-sealed semiconductor device, including a chip mounting die pad, porous fluorocarbon material located just beneath the die pad, beneath a die-pad supporting layer, gold lead wires, or in a sealing resin surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluorocarbon rather than crack the sealant under internal pressure.
摘要翻译：一种树脂密封的半导体器件，包括芯片安装芯片焊盘，位于管芯焊盘正下方的多孔碳氟化合物材料，模具衬垫支撑层下面的金引线或围绕其它部件的密封树脂，其中任何水蒸汽由焊接产生的热量将被保持在多孔碳氟化合物内，而不是在内部压力下破裂密封剂。

2. 发明授权

US5281853A Resin-sealed semiconductor device containing porous fluorocarbon resin 失效
标题翻译：含有多孔碳氟树脂的树脂密封半导体器件
公开(公告)号：US5281853A
公开(公告)日：1994-01-25
申请号：US841685
申请日：1992-02-26
申请人： Yoshito Hazaki , Minoru Hatakeyama , Sunao Fukutake , Akira Urakami
发明人： Yoshito Hazaki , Minoru Hatakeyama , Sunao Fukutake , Akira Urakami
IPC分类号： H01L23/29 , H01L23/495 , H01L23/36 , H01L23/02 , H01L23/12 , H01L39/02
CPC分类号： H01L23/293 , H01L23/295 , H01L23/49586 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/0102 , H01L2924/01079 , H01L2924/181 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A resin-sealed semiconductor device, including a chip mounting die pad, porous fluorocarbon material located just beneath the die pad, beneath a die-pad supporting layer, gold lead wires, or in a sealing resin surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluorocarbon rather than crack the sealant under internal pressure.
摘要翻译：一种树脂密封的半导体器件，包括芯片安装芯片焊盘，位于管芯焊盘正下方的多孔碳氟化合物材料，模具衬垫支撑层下面的金引线或围绕其它部件的密封树脂，其中任何水蒸汽由焊接产生的热量将被保持在多孔碳氟化合物内，而不是在内部压力下破裂密封剂。

3. 发明授权

US4916017A Sheet material 失效
公开(公告)号：US4916017A
公开(公告)日：1990-04-10
申请号：US238748
申请日：1988-08-31
申请人： Haruo Nomi , Minoru Hatakeyama
发明人： Haruo Nomi , Minoru Hatakeyama
IPC分类号： B32B5/18 , B29C70/02 , B29C70/26 , B32B7/12 , B32B15/08 , B32B27/04 , B32B27/08 , C08J9/42 , H05K1/03
CPC分类号： C08J9/42 , B29C70/026 , B29C70/26 , B32B15/08 , H05K1/0353 , B29K2027/18 , B29K2105/04 , B29L2031/3425 , C08J2327/18 , C08J2421/00 , C08J2427/00 , C08J2461/00 , C08J2463/00 , C08J2479/00 , Y10T428/31511 , Y10T428/31515 , Y10T428/31544 , Y10T428/31721
摘要： A composite sheet material is provided comprising a porous, expanded polytetrafluoroethylene base sheet impregnated with a first resin that has a lower heat-shrinkability than the base sheet, the impregnated base sheet having a covering layer which has a thickness of at least three (3) micrometers and which comprises a second resin whose hardening rate is lower than that of the impregnating resin. The present invention is useful in printed circuit boards wherein prepregs according to the invention are laminated with a metal sheet, a resin sheet, or another printed circuit board.

4. 发明授权

US4770922A Printed circuit board base material 失效
标题翻译：印刷电路板基材
公开(公告)号：US4770922A
公开(公告)日：1988-09-13
申请号：US37418
申请日：1987-04-13
申请人： Minoru Hatakeyama , Kosuke Moriya , Ichiro Komada
发明人： Minoru Hatakeyama , Kosuke Moriya , Ichiro Komada
IPC分类号： B32B5/16 , C08L101/00 , H05K1/03 , B32B7/10 , B32B23/08
CPC分类号： H05K1/0353 , B32B5/16 , C08L101/00 , H05K2201/0212 , Y10S428/901 , Y10T428/24934 , Y10T428/254 , Y10T428/31544 , Y10T428/31616 , Y10T428/31623 , Y10T428/31721 , Y10T428/31786 , Y10T428/31902 , Y10T442/3878
摘要： A base material for use in making printed circuit boards is provided wherein minute fragments of expanded, porous polytetrafluoroethylene are uniformly mixed into another resin, and the mixture is compressed to form a composite board. In use, the board has an electrically conductive circuit affixed to at least one surface. The other resin may be epoxy, polyester or other similar resin. Laminates of such base board material affixed to a glass cloth or paper sheet may be prepared. The preferred fragment size range is 0.1 to 5 mm average diameter, and the preferred volume ratio of fragments to resin is 0.5 to 2.0.
摘要翻译：提供用于制造印刷电路板的基材，其中膨胀的多孔聚四氟乙烯的微小碎片均匀地混合到另一种树脂中，并将该混合物压缩以形成复合板。在使用中，电路板具有固定在至少一个表面上的导电电路。另一种树脂可以是环氧树脂，聚酯或其它类似的树脂。可以制备固定在玻璃布或纸张上的这种基板材料的层叠体。优选的片段尺寸范围为平均直径为0.1〜5mm，碎片与树脂的体积比优选为0.5〜2.0。

5. 发明授权

US08648267B2 Weight measurement device with load transmission member whose position is changeable 有权
标题翻译：具有载荷传递部件的重量测量装置，其位置可变
公开(公告)号：US08648267B2
公开(公告)日：2014-02-11
申请号：US13005362
申请日：2011-01-12
申请人： Akihisa Honda , Minoru Hatakeyama
发明人： Akihisa Honda , Minoru Hatakeyama
IPC分类号： G01G21/12 , G01G21/02 , G01G21/07 , G01L1/26
CPC分类号： G01G21/23 , G01G21/244
摘要： A weight measurement device has a housing that includes a base, a platform located above the base and on which a subject is placed or stands, and a chamber defined by the base and the platform. At least one load cell is contained in the chamber and is supported by the base. A load transmission member is located between the platform and the load cell. A bracket is fixed to the base. An elastic deformation part is located around the load transmission member and connected to the bracket and to the load transmission member. The elastic deformation part has an elasticity that is greater than that of the load transmission member, and allows the load transmission member to change in position with respect to the bracket when force is transmitted from the platform via the load transmission member to the load cell.
摘要翻译：重量测量装置具有壳体，该壳体包括基座，位于基座上方并且被摄体放置或支架的平台以及由基座和平台限定的腔室。至少一个称重传感器容纳在腔室中并由基座支撑。负载传递部件位于平台和称重传感器之间。支架固定在底座上。弹性变形部位于负载传递部件的周围，并与支架和负载传递部件连接。弹性变形部的弹性大于载荷传递部件的弹性，并且当力从平台经由载荷传递部件传递到测力传感器时，允许载荷传递部件相对于支架改变位置。

6. 发明申请

US20110213268A1 LIVING BODY INDEX MEASUREMENT APPARATUS 审中-公开
标题翻译：生活体指数测量装置
公开(公告)号：US20110213268A1
公开(公告)日：2011-09-01
申请号：US13022682
申请日：2011-02-08
申请人： Hiroki Kosaka , Minoru Hatakeyama , Atsushi Saito
发明人： Hiroki Kosaka , Minoru Hatakeyama , Atsushi Saito
IPC分类号： A61B5/053 , G01G19/414
CPC分类号： A61B5/0537 , A61B5/4869 , A61B5/4872 , G01G19/50 , G01G21/28 , G01G23/3728
摘要： A pillar (18) is connected to a base plate unit (12) of a living body index measurement apparatus (11) in a detachable manner. A display unit (22) is mounted on the pillar (18) in a detachable manner. There is built in the base plate unit (12) a calculation processing circuit. The calculation processing circuit calculates a living body index based on a measurement value obtained from a living body.
摘要翻译：支柱（18）以可拆卸的方式连接到生物体指标测量装置（11）的基板单元（12）。显示单元（22）以可拆卸的方式安装在支柱（18）上。内置有基板单元（12）的计算处理电路。计算处理电路基于从生物体获得的测量值来计算生物体指数。

7. 发明授权

US4772509A Printed circuit board base material 失效
标题翻译：印刷电路板基材
公开(公告)号：US4772509A
公开(公告)日：1988-09-20
申请号：US37713
申请日：1987-04-13
申请人： Ichiro Komada , Minoru Hatakeyama
发明人： Ichiro Komada , Minoru Hatakeyama
IPC分类号： B29C70/16 , B32B5/28 , C08J5/04 , C08J5/24 , H05K1/03 , B32B17/10 , B32B27/10
CPC分类号： C08J5/24 , B29C70/16 , B32B5/28 , C08J5/04 , H05K1/0353 , B29K2079/00 , B29K2227/18 , B29L2031/3425 , C08J2379/08 , Y10S428/901 , Y10T428/31544 , Y10T428/31721 , Y10T442/3878
摘要： A printed circuit board base prepreg material is provided of a porous, expanded polytetrafluoroethylene (PTFE) membrane or fabric impregnated with a polyimide resin varnish. Upon curing, a printed circuit board base material of porous, expanded PTFE impregnated with polyimide resin is provided. The base material of the invention may be laminated to a glass fabric to improve strength and dimensional stability.
摘要翻译：印刷电路板基底预浸料材料由浸渍有聚酰亚胺树脂清漆的多孔膨胀聚四氟乙烯（PTFE）膜或织物提供。固化后，设置浸渍有聚酰亚胺树脂的多孔，膨胀PTFE印刷电路板基材。本发明的基材可以层压到玻璃织物上以改善强度和尺寸稳定性。

8. 发明申请

US20110209927A1 WEIGHT MEASUREMENT DEVICE 有权
标题翻译：重量测量装置
公开(公告)号：US20110209927A1
公开(公告)日：2011-09-01
申请号：US13005362
申请日：2011-01-12
申请人： Akihisa HONDA , Minoru Hatakeyama
发明人： Akihisa HONDA , Minoru Hatakeyama
IPC分类号： G01G3/12
CPC分类号： G01G21/23 , G01G21/244
摘要： A weight measurement device has a housing that includes a base, a platform located above the base and on which a subject is placed or stands, and a chamber defined by the base and the platform. At least one load cell is contained in the chamber and is supported by the base. A load transmission member is located between the platform and the load cell. A bracket is fixed to the base. An elastic deformation part is located around the load transmission member and connected to the bracket and to the load transmission member. The elastic deformation part has an elasticity that is greater than that of the load transmission member, and allows the load transmission member to change in position with respect to the bracket when force is transmitted from the platform via the load transmission member to the load cell.
摘要翻译：重量测量装置具有壳体，该壳体包括基座，位于基座上方并且被摄体放置或支架的平台以及由基座和平台限定的腔室。至少一个称重传感器容纳在腔室中并由基座支撑。负载传递部件位于平台和称重传感器之间。支架固定在底座上。弹性变形部位于负载传递部件的周围，并与支架和负载传递部件连接。弹性变形部的弹性大于载荷传递部件的弹性，并且当力从平台经由载荷传递部件传递到测力传感器时，允许载荷传递部件相对于支架改变位置。

9. 发明授权

US4784901A Flexible printed circuit board base material 失效
标题翻译：柔性印刷电路板基材
公开(公告)号：US4784901A
公开(公告)日：1988-11-15
申请号：US37412
申请日：1987-04-13
申请人： Minoru Hatakeyama , Kosuke Moriya , Ichiro Komada
发明人： Minoru Hatakeyama , Kosuke Moriya , Ichiro Komada
IPC分类号： B32B5/18 , C08J5/04 , C08J5/24 , H05K1/03 , B32B17/10
CPC分类号： C08J5/04 , B32B5/18 , C08J5/24 , H05K1/0353 , H05K1/036 , C08J2379/08 , H05K1/0366 , H05K2201/0116 , H05K2201/015 , Y10S428/901 , Y10T428/31544 , Y10T428/31721 , Y10T442/3878
摘要： A flexible base material for use in printed circuit boards is provided wherein a sheet of porous, expanded polytetrafluoroethylene is impregnated with a bismaleimide-triazine resin, and the resin is cured therein. The sheet may be laminated to a glass cloth and composites may be produced having a multiplicity of layers of such sheets and glass cloths.
摘要翻译：提供一种用于印刷电路板的柔性基材，其中用双马来酰亚胺 - 三嗪树脂浸渍多孔，膨胀聚四氟乙烯片，并且树脂在其中固化。片材可以层压到玻璃布上，并且可以制造具有多层这样的片材和玻璃布的复合材料。

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