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1. 发明申请

US20070119617A1 Method for manufacturing component built-in module, and component built-in module 失效
标题翻译：组件内置模块的制造方法和组件内置模块
公开(公告)号：US20070119617A1
公开(公告)日：2007-05-31
申请号：US10573717
申请日：2004-09-27
申请人： Yoshitake Hayashi , Masayoshi Koyama , Satoru Yuhaku , Kazuo Otani , Susumu Matsuoka , Seiichi Nakatani
发明人： Yoshitake Hayashi , Masayoshi Koyama , Satoru Yuhaku , Kazuo Otani , Susumu Matsuoka , Seiichi Nakatani
IPC分类号： H05K1/16
CPC分类号： H01L23/5389 , H01L21/4857 , H01L23/49833 , H01L23/5385 , H01L25/0657 , H01L2225/06517 , H01L2225/06541 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582 , H01L2924/0002 , H05K1/186 , H05K1/187 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K3/462 , H05K2201/10378 , H05K2203/0191 , Y10T29/49165 , H01L2924/00
摘要： A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.
摘要翻译：本发明的组件内置模块包括：第一布线图案; 安装在所述第一布线图案上的电子部件; 第二布线图案; 电气绝缘片，其中内置有电气部件，电绝缘片设置在第一布线图案和第二布线图案之间; 以及形成在穿过所述电绝缘片的通孔中的通孔导体，所述通孔导体电连接所述第一布线图案和所述第二布线图案。通孔导体的侧面在通孔导体的轴线方向上形成连续的线。因此，可以提供具有优异的电连接可靠性的组件内置模块。

2. 发明授权

US07488895B2 Method for manufacturing component built-in module, and component built-in module 失效
标题翻译：组件内置模块的制造方法和组件内置模块
公开(公告)号：US07488895B2
公开(公告)日：2009-02-10
申请号：US10573717
申请日：2004-09-27
申请人： Yoshitake Hayashi , Masayoshi Koyama , Satoru Yuhaku , Kazuo Otani , Susumu Matsuoka , Yasushi Taniguchi , Seiichi Nakatani
发明人： Yoshitake Hayashi , Masayoshi Koyama , Satoru Yuhaku , Kazuo Otani , Susumu Matsuoka , Yasushi Taniguchi , Seiichi Nakatani
IPC分类号： H05K1/03
CPC分类号： H01L23/5389 , H01L21/4857 , H01L23/49833 , H01L23/5385 , H01L25/0657 , H01L2225/06517 , H01L2225/06541 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582 , H01L2924/0002 , H05K1/186 , H05K1/187 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K3/462 , H05K2201/10378 , H05K2203/0191 , Y10T29/49165 , H01L2924/00
摘要： A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.
摘要翻译：本发明的组件内置模块包括：第一布线图案; 安装在所述第一布线图案上的电子部件; 第二布线图案; 电气绝缘片，其中内置有电气部件，电绝缘片设置在第一布线图案和第二布线图案之间; 以及形成在穿过所述电绝缘片的通孔中的通孔导体，所述通孔导体电连接所述第一布线图案和所述第二布线图案。通孔导体的侧面在通孔导体的轴线方向上形成连续的线。因此，可以提供具有优异的电连接可靠性的组件内置模块。

3. 发明申请

US20090229120A1 BUMP FORMING METHOD AND BUMP FORMING APPARATUS 有权
标题翻译： BUMP形成方法和BUMP形成装置
公开(公告)号：US20090229120A1
公开(公告)日：2009-09-17
申请号：US12280907
申请日：2007-02-22
申请人： Yasushi Taniguchi , Seiichi Nakatani , Seiji Karashima , Takashi Kitae , Susumu Matsuoka , Masayoshi Koyama
发明人： Yasushi Taniguchi , Seiichi Nakatani , Seiji Karashima , Takashi Kitae , Susumu Matsuoka , Masayoshi Koyama
IPC分类号： H05K3/00 , B23P19/00
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L24/81 , H01L2224/11003 , H01L2224/11005 , H01L2224/11522 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2224/83886 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H05K2203/0278 , H05K2203/043 , H05K2203/0776 , H05K2203/087 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/532 , Y10T29/53204 , H01L2924/00
摘要： In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.
摘要翻译：在布线基板31的电极32上形成凸块19的方法中，将含有导电粒子16和气泡生成剂的流体14供给到布线基板31上的包含电极32的第一区域17上。然后， 40具有与第一区域17具有相同面积并形成在具有比第一区域17的面积大的面积的基板40的主表面18上的突出表面13，使得突出表面13面向然后，流体14被加热，从包含在流体14中的气泡发生剂产生气泡30。

4. 发明授权

US07905011B2 Bump forming method and bump forming apparatus 有权
标题翻译：凸块成形方法和凸块形成装置
公开(公告)号：US07905011B2
公开(公告)日：2011-03-15
申请号：US12280907
申请日：2007-02-22
申请人： Yasushi Taniguchi , Seiichi Nakatani , Seiji Karashima , Takashi Kitae , Susumu Matsuoka , Masayoshi Koyama
发明人： Yasushi Taniguchi , Seiichi Nakatani , Seiji Karashima , Takashi Kitae , Susumu Matsuoka , Masayoshi Koyama
IPC分类号： H01R9/00 , B23P19/00
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L24/81 , H01L2224/11003 , H01L2224/11005 , H01L2224/11522 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2224/83886 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H05K2203/0278 , H05K2203/043 , H05K2203/0776 , H05K2203/087 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/532 , Y10T29/53204 , H01L2924/00
摘要： In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.
摘要翻译：在布线基板31的电极32上形成凸块19的方法中，将含有导电粒子16和气泡生成剂的流体14供给到布线基板31上的包含电极32的第一区域17上。然后， 40具有与第一区域17具有相同面积并形成在具有比第一区域17的面积大的面积的基板40的主表面18上的突出表面13，使得突出表面13面向然后，流体14被加热，从包含在流体14中的气泡发生剂产生气泡30。

5. 发明申请

US20090266592A1 CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD 有权
标题翻译：电路板和电路板接线方法
公开(公告)号：US20090266592A1
公开(公告)日：2009-10-29
申请号：US12427991
申请日：2009-04-22
申请人： Masayoshi Koyama , Norihito Tsukahara , Susumu Matsuoka
发明人： Masayoshi Koyama , Norihito Tsukahara , Susumu Matsuoka
IPC分类号： H05K1/02 , H05K3/36
CPC分类号： H05K3/361 , H01L2224/11003 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/01019 , H05K3/323 , H05K3/363 , H05K2201/09381 , H05K2201/09427 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , H05K2203/167 , Y10T29/49126
摘要： A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.
摘要翻译：其中电线的端面（36a）位于从第一板（31a）的接合区域中的端部退出的位置的电路板，电线的端面（36b）位于从接头的端部撤出的位置第二板（31b）的区域，填充第一板（31a）的导线的端面（36a）与第二板（31b）的导线的端面（36b）之间的间隙（W）与导体（16A）和第一板（31a）和第二板（31b）通过树脂接合。

6. 发明授权

US08115109B2 Circuit board and method for jointing circuit board 有权
标题翻译：电路板及接线方法
公开(公告)号：US08115109B2
公开(公告)日：2012-02-14
申请号：US12427991
申请日：2009-04-22
申请人： Masayoshi Koyama , Norihito Tsukahara , Susumu Matsuoka
发明人： Masayoshi Koyama , Norihito Tsukahara , Susumu Matsuoka
IPC分类号： H05K1/11
CPC分类号： H05K3/361 , H01L2224/11003 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/01019 , H05K3/323 , H05K3/363 , H05K2201/09381 , H05K2201/09427 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , H05K2203/167 , Y10T29/49126
摘要： A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.
摘要翻译：其中电线的端面（36a）位于从第一板（31a）的接合区域中的端部退出的位置的电路板，电线的端面（36b）位于从接头的端部撤出的位置第二板（31b）的区域，填充第一板（31a）的导线的端面（36a）与第二板（31b）的导线的端面（36b）之间的间隙（W）与导体（16A）和第一板（31a）和第二板（31b）通过树脂接合。

7. 发明申请

US20060018988A1 Die for forming honeycomb structure, and method of manufacturing the same 失效
标题翻译：用于形成蜂窝结构的模具及其制造方法
公开(公告)号：US20060018988A1
公开(公告)日：2006-01-26
申请号：US11174657
申请日：2005-07-06
申请人： Hiroshi Kuwahara , Susumu Matsuoka , Takao Saito
发明人： Hiroshi Kuwahara , Susumu Matsuoka , Takao Saito
IPC分类号： A01J21/02 , B23P9/00 , B23P25/00
CPC分类号： B23P15/243 , B28B3/269 , B28B7/346 , C23C16/26 , C23C16/32 , Y10T29/49861 , Y10T29/49885
摘要： There is disclosed a die 1 for forming a honeycomb structure comprises: a plate-like die substrate 2 having at least two surfaces 8, 9, in which back holes 3 for introducing a green material are formed in one surface 8, and slits 4 communicating with back holes 3 are formed in the other surface 9; an underlayer 5 disposed on the substrate 2 so as to coat at least a part of a portion constituting the back hole 3 and the slit 4; an intermediate layer 6 disposed so as to coat at least a part of the underlayer 5 and constituted of tungsten carbide particles whose average particle diameter is 5 μm or less and containing W3C as a main component; and a surface layer 7 disposed so as to coat at least a part of the intermediate layer 6 and constituted of diamond and/or diamond-like carbon.
摘要翻译：公开了一种用于形成蜂窝结构的模具1，其包括：板状模具基板2，其具有至少两个表面8,9，其中在一个表面8中形成用于引入生坯的后孔3，以及沟槽4 后孔3形成在另一个表面9中; 设置在基板2上以便涂覆构成后孔3和狭缝4的部分的至少一部分的底层5; 中间层6，其设置为涂覆底层5的至少一部分，由平均粒径为5μm以下并含有W 3 C的碳化钨颗粒构成为主要成分; 以及设置成涂覆中间层6的至少一部分并由金刚石和/或类金刚石碳构成的表面层7。

8. 发明授权

US07670644B2 Die for molding honeycomb structure and manufacturing method thereof 有权
公开(公告)号：US07670644B2
公开(公告)日：2010-03-02
申请号：US10481751
申请日：2002-11-05
申请人： Susumu Matsuoka , Seiichi Inoue , Haremi Ito , Keiji Matsumoto
发明人： Susumu Matsuoka , Seiichi Inoue , Haremi Ito , Keiji Matsumoto
IPC分类号： C23C16/00
CPC分类号： C23C18/1644 , B01J35/04 , B28B3/26 , B28B3/269 , B29C47/0028 , B29C47/0852 , B29C47/12 , B29L2031/60 , C23C16/045 , C23C16/32 , C23C18/165
摘要： A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 μm, wherein the surface layer is made up of tungsten carbide particles which are 5 μm or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.

9. 发明授权

US07645394B2 Antifreeze composition comprising benzimidazole and triazine 失效
标题翻译：包含苯并咪唑和三嗪的防冻剂组合物
公开(公告)号：US07645394B2
公开(公告)日：2010-01-12
申请号：US11002892
申请日：2004-12-03
申请人： Susumu Matsuoka , Isao Shinoda , Yasuhiro Kishimoto
发明人： Susumu Matsuoka , Isao Shinoda , Yasuhiro Kishimoto
IPC分类号： C09K5/00
CPC分类号： C09K5/20 , C23F11/10 , C23F11/126 , C23F11/149
摘要： The antifreeze of the present invention is including propylene glycol, first material, and second material. The first material is normal aliphatic dicarboxylic acid in which number of carbon atoms is from 10 to 12, salt of the normal aliphatic dicarboxylic acid, or mixture thereof. The second material is benzimidazole compound which has a benzimidazole skeleton, salt of the benzimidazole compound, triazine compound which has a triazine skeleton and has a mercapto group, salt of the triazine compound, or mixture thereof. Such antifreeze has less environment load than antifreeze including ethylene glycol. Furthermore, such antifreeze does not cause metal to corrode more than the antifreeze including ethylene glycol.
摘要翻译：本发明的防冻液包括丙二醇，第一材料和第二材料。第一种材料是正常的脂族二羧酸，其中碳原子数为10至12，正常脂族二羧酸的盐或其混合物。第二种材料是具有苯并咪唑骨架的苯并咪唑化合物，苯并咪唑化合物的盐，具有三嗪骨架并具有巯基的三嗪化合物，三嗪化合物的盐或其混合物。这种防冻剂比包括乙二醇在内的防冻剂具有更少的环境负荷。此外，这种防冻剂不会使包括乙二醇在内的防冻剂发生金属腐蚀。

10. 发明申请

US20100119640A1 Die for molding honeycomb structure and manufacturing method thereof 有权
标题翻译：用于成型蜂窝结构的模具及其制造方法
公开(公告)号：US20100119640A1
公开(公告)日：2010-05-13
申请号：US12656057
申请日：2010-01-14
申请人： Susumu Matsuoka , Seiichi Inoue , Haremi Ito , Keiji Matsumoto
发明人： Susumu Matsuoka , Seiichi Inoue , Haremi Ito , Keiji Matsumoto
IPC分类号： B29C47/30
CPC分类号： C23C18/1644 , B01J35/04 , B28B3/26 , B28B3/269 , B29C47/0028 , B29C47/0852 , B29C47/12 , B29L2031/60 , C23C16/045 , C23C16/32 , C23C18/165
摘要： A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 μm, wherein the surface layer is made up of tungsten carbide particles which are 5 μm or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.
摘要翻译：一种用于挤出成型蜂窝结构的模具，包括：模具基座，设置有陶瓷熔池引入孔和与陶瓷熔池引入孔连通的狭缝; 以及大致限定狭缝的最终宽度的基底层以及形成在模座上的缝隙的最终宽度的表面层，使得狭缝的最终宽度为15〜200 μm，其中表面层由平均粒径为5μm以下且含有W3C为主要成分的碳化钨颗粒构成。根据本发明，提供了一种用于挤压成形蜂窝结构的模具，其能够抑制挤出成型时引起的挤压成形速度的波动，挤压成形时的挤压成形速度的波动非常小，在生产率和耐久性方面都是优越的。

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