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    • 7. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US08604536B2
    • 2013-12-10
    • US12406841
    • 2009-03-18
    • Katsuyuki SekineYoshio Ozawa
    • Katsuyuki SekineYoshio Ozawa
    • H01L29/792
    • H01L29/792H01L21/28282H01L29/513H01L29/66833
    • A semiconductor device includes a memory cell transistor including a first lower insulating film provided on a semiconductor substrate, a first intermediate insulating film provided on the first lower insulating film, a first upper insulating film provided on the first intermediate insulating film, and a first gate electrode provided on the first upper insulating film, and a select transistor including a second lower insulating film provided on the semiconductor substrate, a second intermediate insulating film provided on the second lower insulating film, a second upper insulating film provided on the second intermediate insulating film, and a second gate electrode provided on the second upper insulating film, wherein trap density of the second intermediate insulating film is lower than that of the first intermediate insulating film.
    • 半导体器件包括存储单元晶体管,其包括设置在半导体衬底上的第一下绝缘膜,设置在第一下绝缘膜上的第一中间绝缘膜,设置在第一中间绝缘膜上的第一上绝缘膜和第一栅极 设置在第一上绝缘膜上的电极和设置在半导体衬底上的第二下绝缘膜的选择晶体管,设置在第二下绝缘膜上的第二中间绝缘膜,设置在第二中间绝缘膜上的第二上绝缘膜 以及设置在第二上绝缘膜上的第二栅电极,其中第二中间绝缘膜的阱密度低于第一中间绝缘膜的陷阱密度。
    • 10. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US08304352B2
    • 2012-11-06
    • US13051031
    • 2011-03-18
    • Masayuki TanakaKazuhiro MatsuoYoshio Ozawa
    • Masayuki TanakaKazuhiro MatsuoYoshio Ozawa
    • H01L21/31H01L21/469
    • H01L21/28282H01L27/11568H01L27/11582
    • According to an embodiment, there is provided a method of manufacturing a semiconductor device, including forming a nitride film by nitriding a surface of an underlying region having a semiconductor region containing silicon as a main component and an insulating region containing silicon and oxygen as a main component and adjacent to the semiconductor region, carrying out oxidation with respect to the nitride film to convert a portion of the nitride film which is formed on the insulating region into an oxide film and to leave a portion of the nitride film which is formed on the semiconductor region as at least part of a charge storage insulating film, forming a block insulating film on the charge storage insulating film, and forming a gate electrode film on the block insulating film.
    • 根据一个实施例,提供一种制造半导体器件的方法,包括通过氮化作为主要成分的含有硅的半导体区域的下面的区域的表面和以硅和氧为主要的绝缘区域来形成氮化物膜 并且与半导体区域相邻,相对于氮化物膜进行氧化,将形成在绝缘区域上的氮化物膜的一部分转换为氧化膜,并且使形成在该半导体层上的氮化膜的一部分 半导体区域作为电荷存储绝缘膜的至少一部分,在电荷存储绝缘膜上形成块绝缘膜,并在块绝缘膜上形成栅极电极膜。