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    • 7. 发明授权
    • Nonvolatile memory element
    • 非易失性存储元件
    • US08481990B2
    • 2013-07-09
    • US13375027
    • 2011-03-07
    • Yoshio KawashimaTakumi MikawaYukio Hayakawa
    • Yoshio KawashimaTakumi MikawaYukio Hayakawa
    • H01L47/00
    • H01L45/146H01L27/2436H01L45/08H01L45/1233H01L45/1625H01L45/1641H01L45/1675
    • A variable resistance nonvolatile memory element capable of suppressing a variation in resistance values is provided. A nonvolatile memory element according to the present invention includes: a silicon substrate (11); a lower electrode layer (102) formed on the silicon substrate (11); a variable resistance layer formed on the lower electrode layer (102); an upper electrode layer (104) formed on the variable resistance layer; a second interlayer insulating layer (19) formed to directly cover at least side surfaces of the lower electrode layer (102) and the variable resistance layer; a stress buffering region layer (105) for buffering a stress on the upper electrode layer (104), the stress buffering region layer being formed to directly cover at least an upper surface and side surfaces of the upper electrode layer (104) and comprising a material having a stress smaller than a stress of an insulating layer used as the second interlayer insulating layer (19); a second contact (16) extending to the upper electrode layer (104); and a wiring pattern (18) connected to the second contact (16).
    • 提供了能够抑制电阻值变化的可变电阻非易失性存储元件。 根据本发明的非易失性存储元件包括:硅衬底(11); 形成在所述硅衬底(11)上的下电极层(102); 形成在所述下电极层(102)上的可变电阻层; 形成在所述可变电阻层上的上电极层(104) 形成为直接覆盖下电极层(102)和可变电阻层的至少侧面的第二层间绝缘层(19) 用于缓冲上电极层(104)上的应力的应力缓冲区层(105),所述应力缓冲区层形成为直接覆盖上电极层(104)的上表面和侧表面,并包括 具有小于用作第二层间绝缘层(19)的绝缘层的应力的应力的材料; 延伸到上电极层(104)的第二触点(16); 以及连接到第二触点(16)的布线图案(18)。
    • 8. 发明申请
    • NONVOLATILE MEMORY ELEMENT AND FABRICATION METHOD FOR NONVOLATILE MEMORY ELEMENT
    • 非易失性存储元件的非易失性存储元件和制造方法
    • US20120068148A1
    • 2012-03-22
    • US13375027
    • 2011-03-07
    • Yoshio KawashimaTakumi MikawaYukio Hayakawa
    • Yoshio KawashimaTakumi MikawaYukio Hayakawa
    • H01L47/00H01L21/02
    • H01L45/146H01L27/2436H01L45/08H01L45/1233H01L45/1625H01L45/1641H01L45/1675
    • A variable resistance nonvolatile memory element capable of suppressing a variation in resistance values is provided. A nonvolatile memory element according to the present invention includes: a silicon substrate (11); a lower electrode layer (102) formed on the silicon substrate (11); a variable resistance layer formed on the lower electrode layer (102); an upper electrode layer (104) formed on the variable resistance layer; a second interlayer insulating layer (19) formed to directly cover at least side surfaces of the lower electrode layer (102) and the variable resistance layer; a stress buffering region layer (105) for buffering a stress on the upper electrode layer (104), the stress buffering region layer being formed to directly cover at least an upper surface and side surfaces of the upper electrode layer (104) and comprising a material having a stress smaller than a stress of an insulating layer used as the second interlayer insulating layer (19); a second contact (16) extending to the upper electrode layer (104); and a wiring pattern (18) connected to the second contact (16).
    • 提供了能够抑制电阻值变化的可变电阻非易失性存储元件。 根据本发明的非易失性存储元件包括:硅衬底(11); 形成在所述硅基板(11)上的下电极层(102)。 形成在所述下电极层(102)上的可变电阻层; 形成在所述可变电阻层上的上电极层(104) 形成为直接覆盖下电极层(102)和可变电阻层的至少侧面的第二层间绝缘层(19) 用于缓冲上电极层(104)上的应力的应力缓冲区层(105),所述应力缓冲区层形成为直接覆盖上电极层(104)的上表面和侧表面,并包括 具有小于用作第二层间绝缘层(19)的绝缘层的应力的应力的材料; 延伸到上电极层(104)的第二触点(16); 以及连接到第二触点(16)的布线图案(18)。