专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5976260A Semiconductor producing apparatus, and wafer vacuum chucking device, gas cleaning method and nitride film forming method in semiconductor producing apparatus 失效
标题翻译：半导体制造装置，晶片真空夹紧装置，半导体制造装置中的气体净化方法和氮化物膜形成方法
公开(公告)号：US5976260A
公开(公告)日：1999-11-02
申请号：US612445
申请日：1996-03-07
申请人： Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
发明人： Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
IPC分类号： B23Q3/08 , B25B11/00 , C23C16/34 , C23C16/44 , C23C16/455 , C23C16/458 , C23C16/48 , H01L21/683 , C23C16/00
CPC分类号： C23C16/34 , B25B11/005 , C23C16/4405 , C23C16/455 , C23C16/4583 , C23C16/481 , H01L21/6838 , Y10T279/11
摘要： It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer (1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.
摘要翻译：本发明的目的是获得即使在其上附着有灰尘也能真空吸附晶片的真空吸盘。真空吸盘（101）的主体在其上吸引和固定晶片（1）的表面上具有多个块状凹槽（125），其中各真空抽空路径（105）用于真空抽吸每个块状凹槽（125））被设置用于每个块槽（125）。当晶片（1）在低压下被吸入和固定时，即使一个块状槽（125）中的一个真空度由于吸附表面的一部分上的灰尘等的附着而降低，晶片（1））肯定被吸住了。

2. 发明授权

US5534073A Semiconductor producing apparatus comprising wafer vacuum chucking device 失效
标题翻译：半导体制造装置，包括晶片真空吸附装置
公开(公告)号：US5534073A
公开(公告)日：1996-07-09
申请号：US116968
申请日：1993-09-07
申请人： Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
发明人： Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
IPC分类号： B23Q3/08 , B25B11/00 , C23C16/34 , C23C16/44 , C23C16/455 , C23C16/458 , C23C16/48 , H01L21/683 , C23C16/00 , B23B5/22 , B23B31/30
CPC分类号： C23C16/34 , B25B11/005 , C23C16/4405 , C23C16/455 , C23C16/4583 , C23C16/481 , H01L21/6838 , Y10T279/11
摘要： It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer(1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.
摘要翻译：本发明的目的是获得即使在其上附着有灰尘也能真空吸附晶片的真空吸盘。真空吸盘（101）的主体在其上吸引和固定晶片（1）的表面上具有多个块状凹槽（125），其中各真空抽空路径（105）用于真空抽吸每个块状凹槽（125））被设置用于每个块槽（125）。当晶片（1）在低压下被吸入和固定时，即使一个块状槽（125）中的一个真空度由于吸附表面的一部分上的灰尘等的附着而降低，晶片（1））肯定被吸住了。

3. 发明授权

US4885837A Apparatus for forming leads of semiconductor devices 失效
标题翻译：用于形成半导体器件引线的装置
公开(公告)号：US4885837A
公开(公告)日：1989-12-12
申请号：US284724
申请日：1988-12-15
申请人： Taizo Eshima , Kunihiro Yasutake , Katuhiko Yamasaki
发明人： Taizo Eshima , Kunihiro Yasutake , Katuhiko Yamasaki
IPC分类号： H01L21/00 , H05K13/00
CPC分类号： H01L21/67144 , H05K13/0092 , Y10T29/49121 , Y10T29/5136
摘要： An apparatus for forming leads of semiconductor devices includes a tie-bar cutting device for cutting tie-bars connecting adjacent leads in a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing, a resin-burr removing device for removing resin burrs from the lead frame whose tie-bars have been cut, and a bending device for bending the leads of the lead frame whose resin burrs have been removed. After tie-bars are cut from a lead frame on which semiconductor chips are mounted, resin burrs are removed from the lead frame and the leads of the lead frame are bent.
摘要翻译：一种用于形成半导体器件的引线的装置包括：一个连接杆切割装置，用于切割连接半导体芯片安装在其中的引线框架中的相邻引线的连接杆，并且由于树脂密封而具有不希望的树脂毛刺; 用于从已经切断了拉杆的引线框架中除去树脂毛刺的毛刺去除装置，以及用于弯曲引线框架的引线的弯曲装置，其中树脂毛刺已经被去除。在从安装有半导体芯片的引线框架切下连接条之后，从引线框架去除树脂毛刺，引线框架的引线弯曲。

4. 发明授权

US5093281A method for manufacturing semiconductor devices 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US5093281A
公开(公告)日：1992-03-03
申请号：US333963
申请日：1989-04-06
申请人： Taizo Eshima
发明人： Taizo Eshima
IPC分类号： H01L23/08 , H01L21/50 , H01L23/16
CPC分类号： H01L23/16 , H01L21/50 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/16195 , Y10T29/49121
摘要： In a method for manufacturing semiconductor devices, to a case main body are bonded leads each having an inner end on the inner side of a side edge of the case main body and an outer end on the outer side of the side edge. A semiconductor chip is electrically connected to the inner ends of the leads on the case main body. Subsequently, a lid is adhesively bonded to the case main body. Accordingly, it is possible to reduce the total time period required to manufacture each semiconductor device and to enhance the reliability and yield of semiconductor devices.
摘要翻译：在制造半导体器件的方法中，对于壳体主体，具有在壳主体的侧边缘的内侧的内端和侧边的外侧的外端的接合引线。半导体芯片电连接到壳体主体上的引线的内端。随后，将盖子粘合到壳体主体上。因此，可以减少制造每个半导体器件所需的总时间并提高半导体器件的可靠性和产量。

5. 发明授权

US4923386A Apparatus for forming leads of a semiconductor device 失效
标题翻译：用于形成半导体器件的引线的装置
公开(公告)号：US4923386A
公开(公告)日：1990-05-08
申请号：US279800
申请日：1988-12-05
申请人： Taizo Eshima , Yasuyoshi Kai
发明人： Taizo Eshima , Yasuyoshi Kai
IPC分类号： H01L23/50 , B30B1/26 , B30B1/28 , B30B15/00 , B30B15/06 , H05K13/00
CPC分类号： B30B15/068 , B30B1/26 , B30B1/28 , B30B15/0035 , H05K13/0092 , Y10T83/4647 , Y10T83/8696 , Y10T83/87 , Y10T83/884 , Y10T83/8848
摘要： A lead forming apparatus suitable for use in forming the leads of a semiconductor device is disclosed. The apparatus has a housing for supporting a stationary lower mold half, a support plate arranged to freely move with respect to the housing for supporting a movable mold half in opposition to the lower mold half, a moving device for moving the support plate to cause the movable mold half toward and away from the lower mold half, and an adjusting device for adjusting the position of the support plate with respect to the moving device. The moving device has a crankshaft, a driving device for rotating the crankshaft about its axis, and a coupler transmitting the rotation of the crankshaft to the support plate as a linear motion. The apparatus having the above-described arrangement can be operated with a reduced noise level and a reduced impact and, furthermore, achieves good operability.
摘要翻译：公开了一种适用于形成半导体器件的引线的引线形成装置。该装置具有用于支撑固定的下半模的壳体，相对于壳体自由移动的支撑板，用于支撑与下半模相对的可动半模;移动装置，用于使支撑板移动，可移动模具半部和远离下半模，以及用于调节支撑板相对于移动装置的位置的调节装置。移动装置具有曲轴，用于使曲轴围绕其轴线旋转的驱动装置和将曲轴的旋转作为直线运动传递到支撑板的联轴器。具有上述布置的装置可以以降低的噪声水平和减小的冲击力来操作，并且还实现良好的可操作性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式