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1. 发明授权

US5017277A Laser sputtering apparatus 失效
标题翻译：激光溅射装置
公开(公告)号：US5017277A
公开(公告)日：1991-05-21
申请号：US376087
申请日：1989-07-06
申请人： Yoshikazu Yoshida , Kunio Tanaka , Yukio Nishikawa , Yusuke Takada
发明人： Yoshikazu Yoshida , Kunio Tanaka , Yukio Nishikawa , Yusuke Takada
IPC分类号： C23C14/28
CPC分类号： C23C14/28
摘要： A laser sputtering apparatus has a vacuum chamber, a target holder installed in the vacuum chamber, arranged to oppose the target in the vacuum chamber, a substrate mounted on the substrate support, and a laser beam source which emits laser beams onto the target through a window provided in the vacuum chamber wall, providing a laser sputtering apparatus that supplies dielectric thin films with a high permittivity and a high withstanding voltage.
摘要翻译：激光溅射装置具有真空室，设置在真空室中的目标保持器，与真空室中的目标物相对，安装在基板支撑体上的基板和激光束源，该激光束源通过提供真空室壁中的窗口，提供了提供具有高介电常数和高耐压的电介质薄膜的激光溅射装置。

2. 发明授权

US5415901A Laser ablation device and thin film forming method 失效
标题翻译：激光烧蚀装置及薄膜成型方法
公开(公告)号：US5415901A
公开(公告)日：1995-05-16
申请号：US69520
申请日：1993-06-01
申请人： Kunio Tanaka , Youichi Ohnishi , Yoshikazu Yoshida , Yukio Nishikawa
发明人： Kunio Tanaka , Youichi Ohnishi , Yoshikazu Yoshida , Yukio Nishikawa
IPC分类号： C23C14/08 , C23C14/00 , C23C14/28 , C30B23/02 , H01F10/20 , H01F41/20
CPC分类号： H01F41/205 , C23C14/0021 , C23C14/28 , C30B23/002 , H01F10/20
摘要： A laser ablation device for forming a thin film includes a vacuum chamber having a gas introduction port through which an oxidating gas is introduced into the chamber, and a light-transmittable section, a target holder disposed in the vacuum chamber for holding a target made of a film forming material of an oxide, an object holder confronting the target holder for holding an object on which the thin film is to be formed, a short wavelength laser which emits a first short wavelength laser light passing to the target in the vacuum chamber through the light-transmittable section from outside of the vacuum chamber, and a short wavelength laser light irradiating device for irradiating the object with a second short wavelength laser light passing into the vacuum chamber through the light-transmittable section from outside of the vacuum chamber. The second short wavelength laser light has an intensity lower than that of the first short wavelength laser light irradiating the target. Alternatively, a short wavelength laser light passing device causes the second short wavelength laser light to pass through the light-transmittable section from outside of the vacuum chamber and then to pass in the vicinity of a surface of the object in the vacuum chamber as approximately parallel to the surface of the object.
摘要翻译：用于形成薄膜的激光烧蚀装置包括具有气体导入口的真空室，通过该气体导入口将氧化气体引入到室中，以及透光部，设置在真空室中的用于保持由形成氧化物的成膜材料，面对用于保持要形成薄膜的物体的目标保持器的物体保持器，发射通过真空室中的目标物的第一短波长激光的短波长激光器，通过来自真空室的外部的透光部分和用于通过透光部分从真空室外部向第一短波长激光照射物体的短波长激光照射装置。第二短波长激光的强度比照射目标的第一短波长激光的强度低。或者，短波长激光通过装置使第二短波长激光从真空室的外部通过透光部，然后在真空室内的物体的表面附近大致平行到物体的表面。

3. 发明授权

US5227608A Laser ablation apparatus 失效
标题翻译：激光消融装置
公开(公告)号：US5227608A
公开(公告)日：1993-07-13
申请号：US922768
申请日：1992-07-31
申请人： Yoshikazu Yoshida , Yukio Nishikawa , Kunio Tanaka
发明人： Yoshikazu Yoshida , Yukio Nishikawa , Kunio Tanaka
IPC分类号： B23K26/12 , B23K26/16 , B23K26/36
CPC分类号： B23K26/123 , B23K26/1224 , B23K26/16 , B23K26/362
摘要： A laser ablation apparatus includes a laser beam source for ablation for emitting a first laser beam, a lens for focusing the first laser beam, a vacuum chamber having a window on its wall through which the first laser beam is injected into the vacuum chamber, a target holder arranged in the vacuum chamber to hold a target onto which the first laser beam is irradiated, a substrate holder arranged opposing to the target holder in the vacuum chamber to hold a substrate, and a laser beam source for particle decomposition for emitting a second laser beam in the vacuum chamber to decompose particles turned out from the target by the first laser beam in the vacuum chamber. The apparatus can further include a pair of mirrors, arranged on both sides of the target holder, for multiply reflecting the second laser beam over the target holder.
摘要翻译：激光烧蚀装置包括用于发射第一激光束的用于烧蚀的激光束源，用于聚焦第一激光束的透镜，在其壁上具有窗口的真空室，第一激光束通过该窗口注入到真空室中，设置在所述真空室中的目标夹持器，用于保持照射所述第一激光束的目标;在所述真空室中与所述目标保持器相对配置以保持基板的基板保持器，以及用于发射第二激光束的用于粒子分解的激光束源激光束在真空室中，以通过真空室中的第一激光束分解从目标物转出的颗粒。该装置还可以包括一对反射镜，其布置在目标支架的两侧，用于将第二激光束反射超过目标支架。

4. 发明授权

US5159169A Laser sputtering apparatus 失效
标题翻译：激光溅射装置
公开(公告)号：US5159169A
公开(公告)日：1992-10-27
申请号：US627931
申请日：1990-12-14
申请人： Yukio Nishikawa , Yoshikazu Yoshida , Kunio Tanaka
发明人： Yukio Nishikawa , Yoshikazu Yoshida , Kunio Tanaka
IPC分类号： C23C14/34 , B23K26/06 , C23C14/28
CPC分类号： B23K26/0643 , B23K26/064 , B23K26/0648 , B23K26/1224 , C23C14/28
摘要： A laser sputtering apparatus comprising: a laser oscillator for emitting a pulsed laser beam; an optical unit for uniforming intensity of the laser beam; a vacuum tank which contains a target; and an optical system for irradiating the laser beam onto the target through the optical unit.
摘要翻译：一种激光溅射装置，包括：用于发射脉冲激光束的激光振荡器; 用于激光束强度均匀化的光学单元; 包含目标的真空罐; 以及用于通过光学单元将激光束照射到靶上的光学系统。

5. 发明授权

US5468930A Laser sputtering apparatus 失效
标题翻译：激光溅射装置
公开(公告)号：US5468930A
公开(公告)日：1995-11-21
申请号：US29410
申请日：1993-03-10
申请人： Yukio Nishikawa , Kunio Tanaka , Yoshikazu Yoshida
发明人： Yukio Nishikawa , Kunio Tanaka , Yoshikazu Yoshida
IPC分类号： C23C14/34 , C23C14/28 , C23C14/50 , B23K26/02 , B23K26/00
CPC分类号： C23C14/505 , C23C14/28
摘要： A laser sputtering apparatus includes a laser oscillator for emitting laser beams, a target-supporting member supporting a flat target thereon and being rotatable in a vacuum chamber while the target is inclined relative to the target-supporting member, a driving device for rotating the target-supporting member, a substrate-supporting member for supporting the substrate parallel with the target-supporting member, and an optical device for irradiating the target with the beams emitted by the laser oscillator.
摘要翻译：激光溅射装置包括用于发射激光束的激光振荡器，支撑平板靶的靶支撑部件，并且在靶相对于靶支撑部件倾斜的同时可在真空室中旋转;驱动装置，用于使靶支撑构件，用于支撑与靶支撑构件平行的基板的基板支撑构件，以及用于用激光振荡器发射的光束照射目标的光学装置。

6. 发明授权

US5037521A Sputtering apparatus 失效
标题翻译：溅射装置
公开(公告)号：US5037521A
公开(公告)日：1991-08-06
申请号：US504548
申请日：1990-04-04
申请人： Yukio Nishikawa , Kunio Tanaka , Yoshikazu Yoshida
发明人： Yukio Nishikawa , Kunio Tanaka , Yoshikazu Yoshida
IPC分类号： C23C14/34 , C23C14/28 , C23C14/54
CPC分类号： C23C14/28
摘要： A sputtering apparatus for producing a thin film with use of a laser beam is disclosed. The sputtering apparatus comprises a vacuum chamber, a target and a substrate disposed inside the vacuum chamber, a laser beam-projecting unit, a beam-shape adjusting unit, an optical scanning unit, and a light-converging unit. The optical scanning unit comprises a mirror which rotates to allow the laser beam to scan the target, and the angular speed thereof is regulated so as to move the spot of the laser beam at a fixed speed on the target. The beam-shape adjusting unit or the light-converging unit moves along its optical axis in synchronization with the movement of the mirror of the optical scanning unit, thereby keeping the spot of the laser beam at a predetermined size.
摘要翻译：公开了一种使用激光束制造薄膜的溅射装置。溅射装置包括真空室，靶和设置在真空室内部的基板，激光束投射单元，光束形状调节单元，光学扫描单元和聚光单元。光学扫描单元包括反射镜，其旋转以允许激光束扫描目标，并且其角速度被调节以便将激光束的光点以固定速度移动到目标上。光束形状调整单元或聚光单元与光学扫描单元的反射镜的移动同步地沿其光轴移动，从而将激光束的光点保持在预定的尺寸。

7. 发明授权

US5065697A Laser sputtering apparatus 失效
标题翻译：激光溅射装置
公开(公告)号：US5065697A
公开(公告)日：1991-11-19
申请号：US559270
申请日：1990-07-27
申请人： Yoshikazu Yoshida , Kunio Tanaka , Yukio Nishikawa
发明人： Yoshikazu Yoshida , Kunio Tanaka , Yukio Nishikawa
IPC分类号： C23C14/34 , C23C14/24 , C23C14/28
CPC分类号： C23C14/28 , C23C14/246
摘要： A laser sputtering apparatus includes a vacuum chamber, a laser for radiating a laser beam, a vacuum sealing window arranged at the chamber for introducing the beam into the chamber, a film transporting device for transporting a film while the film is passing near the window and a substrate holder arranged opposite to the window with the film therebetween for holding a substrate. The film has high laser transmission and a surface over which material for a thin film to be formed on the substrate is deposited. The device transports the film while the surface of the film is opposed to the substrate. The laser beam sputters the material on the thin film onto the substrate.
摘要翻译：激光溅射装置包括真空室，用于照射激光束的激光器，布置在腔室处的用于将光束引入腔室的真空密封窗口，当薄膜经过靠近窗口时传送薄膜的薄膜传送装置，以及衬底保持器，其与窗口相对设置，其间具有用于保持衬底的膜。该膜具有高激光透射率，并且沉积在基底上形成用于形成薄膜的材料的表面。当膜的表面与基板相对时，该装置传输薄膜。激光束将薄膜上的材料喷射到基板上。

8. 发明授权

US5006218A Sputtering apparatus 失效
标题翻译：溅射装置
公开(公告)号：US5006218A
公开(公告)日：1991-04-09
申请号：US556002
申请日：1990-07-16
申请人： Yoshikazu Yoshida , Kunio Tanaka
发明人： Yoshikazu Yoshida , Kunio Tanaka
IPC分类号： C23C14/34 , C23C14/35 , H01J37/34 , H01L21/203 , H05H1/46
CPC分类号： C23C14/351 , H01J37/3402
摘要： A sputtering apparatus includes: a discharge chamber having four curved side surfaces protruding toward a center of the chamber to form a discharge space surrounded by the side surfaces therein; a gas inlet and a gas outlet each formed at the chamber; cylindrical cathodes; plural permanent magnets arranged outside each of the side surfaces of the chamber; a sputtering electrode arranged at the space surrounded by the curved side surfaces; and a bed for holding a substrate, which is arranged in the chamber and opposed to the sputtering electrode. Each of the cathodes is arranged between the adjacent curved side surfaces of the chamber. A negative electric potential is applied to each of the cathodes. The adjacent permanent magnets have different magnetic poles to each other. The surface of substrate held by the bed is parallel to the opposed surface of the sputtering electrode, and the surfaces of the substrate and the electrode are arranged crossing the curved side surfaces.
摘要翻译：溅射装置包括：排出室，其具有朝向所述室的中心突出的四个弯曲侧表面，以形成由其侧表面包围的放电空间; 每个在所述室处形成的气体入口和气体出口; 圆柱形阴极; 布置在室的每个侧表面之外的多个永磁体; 设置在由弯曲侧面包围的空间的溅射电极; 以及用于保持基板的床，其布置在室中并与溅射电极相对。每个阴极布置在腔室的相邻弯曲侧表面之间。对每个阴极施加负电位。相邻的永磁体具有彼此不同的磁极。由床保持的基板的表面平行于溅射电极的相对表面，并且基板和电极的表面布置成与弯曲的侧表面相交。

9. 发明授权

US06384555B1 DC motor driving apparatus 失效
标题翻译：直流电动机驱动装置
公开(公告)号：US06384555B1
公开(公告)日：2002-05-07
申请号：US09559526
申请日：2000-04-28
申请人： Kunio Tanaka
发明人： Kunio Tanaka
IPC分类号： H02P100
CPC分类号： H02P7/04
摘要： One terminal 3a of the DC motor 3 is connected to the power supply terminal 301, and the other terminal 3b of the DC motor 3 is connected to the ground terminal 302 through the FET 1. The FET 2 is connected between the terminal 3a and terminal 3b of the DC motor 3. A reversal input terminal of the comparator 6 is connected to the terminal 3a of the DC motor 3, and a non-reversal input terminal of the comparator 6 is connected to the terminal 3b of the DC motor 3. The output terminal of the comparator 6 is connected to the gate of the FET 2 through the switch SW1. The CPU 200 supplies a control signal FV which is changed at a predetermined period T according to the speed signal supplied from the receiver 100, to the gate of the FET 2 through the driver 7. When the counter electromotive force is generated in the DC motor 3, the comparator 6 supplies a high level control signal RD to the gate of the FET 2 through the switch SW1.
摘要翻译：直流电动机3的一个端子3a连接到电源端子301，直流电动机3的另一个端子3b通过FET1连接到接地端子302.FET2连接在端子3a和端子比较器6的反相输入端子连接到直流电动机3的端子3a，比较器6的非反相输入端子连接到直流电动机3的端子3b。比较器6的输出端通过开关SW1连接到FET2的栅极。 CPU 200根据从接收器100提供的速度信号，在预定周期T改变控制信号FV，通过驱动器7向FET2的门提供。当在直流电动机中产生反电动势时如图3所示，比较器6通过开关SW1向FET2的栅极提供高电平控制信号RD。

10. 发明授权

US06207123B1 Process for producing sodium salts 失效
公开(公告)号：US06207123B1
公开(公告)日：2001-03-27
申请号：US09256212
申请日：1999-02-24
申请人： Kunio Tanaka , Shintaro Kikuchi
发明人： Kunio Tanaka , Shintaro Kikuchi
IPC分类号： C01D700
CPC分类号： C01D7/35 , C01D7/12 , C01D7/14
摘要： A process for producing sodium salts, which comprises adding solid sodium carbonate to a first aqueous solution containing sodium carbonate and sodium hydrogencarbonate, to prepare a second aqueous solution, precipitating, separating and recovering from the second aqueous solution sodium sesquicarbonate crystals containing at least 50 mol % of the sodium hydrogencarbonate component contained in the second aqueous solution, and further recovering sodium carbonate from a mother liquor remaining after separating the sodium sesquicarbonate crystals from the second aqueous solution.

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