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    • 6. 发明申请
    • Method of manufacturing microlens array
    • 微透镜阵列的制造方法
    • US20050181311A1
    • 2005-08-18
    • US11036105
    • 2005-01-18
    • Toshihiro Nakajima
    • Toshihiro Nakajima
    • G03F7/40G02B3/00G03F7/207
    • G02B3/0018G02B3/0012G02B3/005G02B3/0056
    • A positive resist layer formed on a translucent substrate is subjected to exposure and development to form circular resist patterns disposed near each other at a predetermined distance. The exposure pattern has an opening of a plurality of circular ring shape surrounding the plurality of resist patterns. The opening may have a width equal to the predetermined distance. Since the width of the opening is constant over the whole outer periphery of each resist pattern, uniform exposure can be realized at all positions along the periphery to form a perfect circle shape. After a convex lens shape is given to each resist pattern by heating and reflow process, the convex lens shape is transferred to the substrate by dry etching process using the resist patterns as a mask to form a microlens array with convex lenses.
    • 形成在透光性基板上的正性抗蚀剂层经受曝光和显影以形成以预定距离彼此靠近设置的圆形抗蚀剂图案。 曝光图案具有围绕多个抗蚀剂图案的多个圆环形状的开口。 开口可以具有等于预定距离的宽度。 由于开口的宽度在每个抗蚀剂图案的整个外周上是恒定的,所以可以在沿着周边的所有位置上实现均匀的曝光以形成正圆形状。 在通过加热和回流处理对每个抗蚀剂图案赋予凸透镜形状之后,通过使用抗蚀剂图案作为掩模的干蚀刻工艺将凸透镜形状转印到基板,以形成具有凸透镜的微透镜阵列。
    • 8. 发明授权
    • Substrate heat treatment apparatus
    • 基板热处理装置
    • US5611685A
    • 1997-03-18
    • US450758
    • 1995-05-25
    • Toshihiro NakajimaTakatoshi ChibaKiyofumi NishiiToru Sato
    • Toshihiro NakajimaTakatoshi ChibaKiyofumi NishiiToru Sato
    • C23C16/44C23C16/455C30B25/10C30B25/12C30B25/14H01L21/00H01L21/205H01L21/26H01L21/324F27B5/04
    • H01L21/67109C23C16/4401C23C16/4412C30B25/10C30B25/12C30B25/14
    • A substrate heat treatment apparatus includes a heat treatment furnace of a flat configuration, and having a cavity in which a substrate is accommodated. The heat treatment furnace includes a gas supply unit at one side end face, an opening for communication between the cavity and the outside world, and a gas discharge unit in the vicinity of the opening for discharging gas from the cavity at the other side end face. The heat treatment furnace further includes a cover for shutting the opening allowing opening/closing thereof. In the gas exhaust unit, an exhaust chamber is formed on the other side end face along the opening with a partition wall between the opening and the exhaust chamber. An exhaust portion is formed in communication with the outside world in the exhaust chamber. The partition wall is formed so that the edge of the partition wall is displaced away from the inside surface of the cover, whereby a slit-like vent passage extending in the direction of the width of the cavity is formed between the cover and the edge of the partition wall when the opening is shut. The gas flow is uniform in the vicinity of the vent passage when a substrate is loaded/unloaded into and/from the heat treatment furnace, and also during heat treatment. The outside air will not enter the furnace, and no stagnation of the process gas occurs in the furnace.
    • 基板热处理装置包括平坦构造的热处理炉,并且具有容纳基板的空腔。 所述热处理炉包括在一侧端面处的气体供给单元,所述空腔与所述外界之间连通的开口以及所述开口附近的气体排出单元,用于从所述另一侧端面处的所述空腔排出气体 。 热处理炉还包括用于关闭允许其打开/关闭的开口的盖。 在排气单元中,在开口与排气室之间具有分隔壁的沿着开口的另一侧端面形成有排气室。 在排气室中形成与外界连通的排气部。 分隔壁形成为使得隔壁的边缘远离盖的内表面移开,从而在盖和盖的边缘之间形成沿空腔宽度方向延伸的狭缝状通气通道 打开关闭时的隔墙。 当将基板装载/卸载到热处理炉中时,以及在热处理期间,气流在通气通道附近均匀。 外部空气不会进入炉内,炉内不会发生停滞。
    • 9. 发明授权
    • Light-emitting heat treatment apparatus
    • 发光热处理装置
    • US08238731B2
    • 2012-08-07
    • US12395940
    • 2009-03-02
    • Toshihiro Nakajima
    • Toshihiro Nakajima
    • A21B2/00
    • H01L21/67115F27B17/0025H01L21/67748H01L21/68707
    • Annular reflecting rings are removably mounted on the upper and lower sides of a chamber side portion of a chamber. An annular recessed portion is formed sandwiched between the lower end face of the upper reflecting ring and the upper end face of the lower reflecting ring to surround a holding part for holding a semiconductor wafer. The outer peripheral surface of the recessed portion communicates with a transport opening. The formation of the recessed portion prevents the light emitted from halogen lamps and flash lamps from being non-uniformly reflected around the holding part to enter a semiconductor wafer, thus improving the uniformity of the in-plane temperature distribution in the semiconductor wafer during heat treatment.
    • 环形反射环可移除地安装在室的室侧部分的上侧和下侧。 在上反射环的下端面和下反射环的上端面之间形成环状的凹部,以包围保持半导体晶片的保持部。 凹部的外周面与输送口连通。 凹陷部分的形成防止卤素灯和闪光灯发出的光在保持部分周围不均匀地反射进入半导体晶片,从而提高了热处理期间半导体晶片内的面内温度分布的均匀性 。