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1. 发明申请

US20130347143A1 METHOD FOR PRODUCING LILIES CONTAINING DELPHINIDIN IN THE PETALS THEREOF 审中-公开
标题翻译：用于生产含有其中的蝶呤的荔枝的方法
公开(公告)号：US20130347143A1
公开(公告)日：2013-12-26
申请号：US13822131
申请日：2011-09-16
申请人： Yoshikazu Tanaka , Noriko Nakamura , Hitoshi Kobayashi , Hiroaki Okuhara , Masayoshi Kondo , Yosuke Koike , Yosuke Hoshi , Toshikazu Nomizu
发明人： Yoshikazu Tanaka , Noriko Nakamura , Hitoshi Kobayashi , Hiroaki Okuhara , Masayoshi Kondo , Yosuke Koike , Yosuke Hoshi , Toshikazu Nomizu
IPC分类号： C12N15/82
CPC分类号： C12N15/825 , A01H5/02 , A01H6/56
摘要： Provided is a method for producing lilies containing a blue pigment (delphinidin) in the petals thereof by introducing a foreign gene into lilies. The method pertaining to the present invention is a method for producing lilies containing delphinidin in the petals thereof, including the following steps: introducing, into a lily, a F3′5′H gene derived from a campanula and comprising a nucleotide sequence encoding a peptide having flavonoid 3′5′-hydroxylase (F3′5′H) activity, such as a nucleotide sequence represented by SEQ ID NO: 1 or SEQ ID NO: 11; while also introducing a F3′H gene fragment derived from a lily and comprising a nucleotide sequence encoding a peptide having flavonoid 3′-hydroxylase activity, such as a nucleotide sequence represented by SEQ ID NO: 3 or SEQ ID NO: 16; and inhibiting the expression of endogenous F3′H expression, which acts on cyanidin synthesis in lily petals, while the F3′5′H gene that has been introduced acts to cause the synthesis of delphinidin.
摘要翻译：本发明提供了通过将外来基因引入百合中来生产其中含有蓝色色素（花翠素）的百合的方法。本发明的方法是在其花瓣中制备含有花翠素的百合的方法，包括以下步骤：向百合中加入来自菜园的F3'5'H基因，并含有编码肽的核苷酸序列具有类黄酮3'5'-羟化酶（F3'5'H）活性，例如由SEQ ID NO：1或SEQ ID NO：11表示的核苷酸序列; 同时引入来自百合的F3'H基因片段，并且包含编码具有类黄酮3'-羟化酶活性的肽的核苷酸序列，例如由SEQ ID NO：3或SEQ ID NO：16表示的核苷酸序列; 并抑制内源性F3'H表达，其作用于百合花瓣中的花青素合成，而已引入的F3'5'H基因则起到促进花翠素的合成作用。

2. 发明申请

US20060042826A1 Circuit board, multi-layer wiring board method for making circuity board, and method for making multi-layer wiring board 失效
标题翻译：电路板，多层布线板制作电路板的方法以及制造多层布线板的方法
公开(公告)号：US20060042826A1
公开(公告)日：2006-03-02
申请号：US10534962
申请日：2003-11-19
申请人： Masayoshi Kondo
发明人： Masayoshi Kondo
IPC分类号： H05K1/03
CPC分类号： H05K3/4635 , H05K1/0393 , H05K3/3489 , H05K3/386 , H05K3/4602 , H05K3/4617 , H05K3/4691 , H05K2201/0195 , H05K2201/0394 , H05K2201/09536 , H05K2203/0733 , H05K2203/1189
摘要： The object of the present invention is to provide a multilayer flexible wiring board which is capable of effecting interlaminar connection with certainty, has high reliability and allows lamination of outer layer wiring boards. According to the present invention, there is provided a multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting from the wiring pattern to the side of the substrate opposite from the wiring pattern, wherein the substrates other than that of the outermost layer have the pads to be connected to the two-layer conductor posts on the side opposite from the conductor posts, and the wiring pattern has no surface coating; (2) a flexible wiring board having on at least one side thereof the pads for connection to the conductor posts and including a wiring pattern with surface coating applied on the flexible portion but no surface coating applied on the multilayer portion, and (3) an,adhesive layer having a flux function, wherein the conductor posts and pads are connected by a metal or an alloy, and the wiring patterns are electrically connected.
摘要翻译：本发明的目的是提供一种能够确定地实现层间连接，具有高可靠性并允许层叠外层布线板的多层挠性布线板。根据本发明，提供了一种多层柔性布线基板，其包括：（1）多个单面布线板，其各自具有在相应基板的一侧上的布线图案和从布线图案向侧面突出的两层导体柱所述基板与所述最外层的基板不同，所述基板与所述导体柱相反一侧的所述两层导体柱连接，所述布线图形没有表面被覆; （2）柔性布线板，其至少一侧具有用于连接到导体柱的焊盘，并且包括施加在柔性部分上的表面涂层的布线图案，但是没有施加在多层部分上的表面涂层，以及（3），具有助焊剂功能的粘合剂层，其中导体柱和焊盘通过金属或合金连接，并且布线图案电连接。

3. 发明授权

US5661909A Blade mounting device in cutting tool 失效
标题翻译：刀片安装装置在切削工具中
公开(公告)号：US5661909A
公开(公告)日：1997-09-02
申请号：US565722
申请日：1995-11-30
申请人： Masayoshi Kondo , Kunio Amano , Katsufumi Takeda , Hideki Okubo
发明人： Masayoshi Kondo , Kunio Amano , Katsufumi Takeda , Hideki Okubo
IPC分类号： B23D51/10 , B27B19/09
CPC分类号： B23D51/10 , Y10T279/17547
摘要： A blade mounting device is operable for mounting a blade on a movable member of a cutting member which is moved in a predetermined motion for a cutting operation. The blade mounting device includes a pair of claws mounted on the movable member and operable by an operator between a closed position for clamping the blade and an open position for releasing the blade. A first and a second thread mechanism are provided for converting the rotation of the actuation member into an axial movement of the actuation member relative to the movable member and for converting the rotation of the actuation member into an axial movement of the claws relative to the actuation member.
摘要翻译：叶片安装装置可操作以将叶片安装在切割构件的可移动构件上，该切割构件以预定的运动方式移动以进行切割操作。刀片安装装置包括一对安装在可移动部件上的爪，可由操作者在夹紧刀片的关闭位置和用于释放刀片的打开位置之间操作。提供第一和第二螺纹机构，用于将致动构件的旋转转换成致动构件相对于可移动构件的轴向运动，并且用于将致动构件的旋转转换成爪相对于致动器的轴向运动会员。

4. 发明申请

US20110120754A1 MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：多层接线板和半导体器件
公开(公告)号：US20110120754A1
公开(公告)日：2011-05-26
申请号：US12674803
申请日：2007-09-13
申请人： Masayoshi Kondo , Masaaki Kato , Toshiaki Chuma , Toshio Komiyatani , Takahisa Iida , Kenichi Kanemasa
发明人： Masayoshi Kondo , Masaaki Kato , Toshiaki Chuma , Toshio Komiyatani , Takahisa Iida , Kenichi Kanemasa
IPC分类号： H05K1/02
CPC分类号： H01L23/49833 , H01L23/14 , H01L23/3735 , H01L23/49822 , H01L24/48 , H01L2224/16225 , H01L2224/16227 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01012 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H05K3/4614 , H05K3/4617 , H05K3/4652 , H05K3/4691 , H05K2201/068 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayer wiring board includes: a rigid portion including a first base member having flexibility and surfaces, the first base member having a first insulating layer and a first conductor layer, and a second base member bonded on at least one of the surfaces of the first base member and having rigidity higher than that of the first base member, the second base member having a second insulating layer and a second conductor layer; and a flexible portion provided so as to be continuously extended from the rigid portion, the flexible portion constituted from the first base member, wherein in the case where a coefficient of thermal expansion of the second insulating layer is measured by a thermal mechanical analysis based on JIS C 6481 at a predetermined temperature, the coefficient of thermal expansion of the second insulating layer in a plane direction thereof is 13 ppm/° C. or lower and the coefficient of thermal expansion of the second insulating layer in a thickness direction thereof is 20 ppm/° C. or lower.
摘要翻译：多层布线板包括：刚性部分，其包括具有柔性和表面的第一基底构件，所述第一基底构件具有第一绝缘层和第一导体层，以及第二基底构件，其接合在所述第一和第二基底构件的至少一个表面上所述第二基底构件具有比所述第一基底构件的刚性更高的刚性，所述第二基底构件具有第二绝缘层和第二导体层; 以及柔性部，其设置成从所述刚性部分连续延伸，所述柔性部分由所述第一基底构件构成，其中在通过基于以下的热机械分析来测量所述第二绝缘层的热膨胀系数的情况下 JIS C 6481在规定的温度下，第二绝缘层的面方向的热膨胀系数为13ppm /℃以下，第二绝缘层的厚度方向的热膨胀系数为20 ppm /℃以下。

5. 发明申请

US20110031000A1 RESIN COMPOSITION, CARRIER MATERIAL WITH RESIN, MULTI-LAYERED PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：树脂组合物，带树脂的载体材料，多层印刷电路板和半导体器件
公开(公告)号：US20110031000A1
公开(公告)日：2011-02-10
申请号：US12922852
申请日：2009-03-24
申请人： Toshio Komiyatani , Masayoshi Kondo
发明人： Toshio Komiyatani , Masayoshi Kondo
IPC分类号： H05K1/03 , C08K5/09 , B32B27/38
CPC分类号： H05K1/0326 , C08G59/32 , C08G59/621 , H01L23/49833 , H01L23/4985 , H01L23/5385 , H01L23/5387 , H01L2924/0002 , H05K3/4617 , H05K3/4658 , H05K3/4691 , H05K2201/0133 , H05K2203/0733 , Y10T428/31511 , Y10T428/31529 , H01L2924/00
摘要： There is disclosed a resin composition used for forming a resin layer in a sheet-formed carrier material with a resin, comprising a polyfunctional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300, a compound (b) having one or more carboxyl groups with a melting point of equal to or more than 50 degrees C. and equal to or less than 230 degrees C., and a curing agent (c).
摘要翻译：公开了一种树脂组合物，用于在具有树脂的片状载体材料中形成树脂层，其包含具有三个或更多个环氧当量为100至300的缩水甘油醚基团的多官能环氧树脂（a），化合物（ b）具有一个或多个熔点等于或大于50℃且等于或小于230℃的羧基和固化剂（c）。

6. 发明授权

US07576288B2 Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards 失效
标题翻译：电路板，多层布线板，电路板的制造方法以及多层布线板的制造方法
公开(公告)号：US07576288B2
公开(公告)日：2009-08-18
申请号：US10534962
申请日：2003-11-19
申请人： Masayoshi Kondo , Masaaki Kato , Toshiaki Chuma , Satoru Nakao , Kentaro Fujiura
发明人： Masayoshi Kondo , Masaaki Kato , Toshiaki Chuma , Satoru Nakao , Kentaro Fujiura
IPC分类号： H05K1/00
CPC分类号： H05K3/4635 , H05K1/0393 , H05K3/3489 , H05K3/386 , H05K3/4602 , H05K3/4617 , H05K3/4691 , H05K2201/0195 , H05K2201/0394 , H05K2201/09536 , H05K2203/0733 , H05K2203/1189
摘要： A multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting from the wiring pattern to the side of the substrate opposite from the wiring pattern, wherein the substrates other than that of the outermost layer have the pads to be connected to the two-layer conductor posts on the side opposite from the conductor posts, and the wiring pattern has no surface coating; (2) a flexible wiring board having on at least one side thereof the pads for connection to the conductor posts and including a wiring pattern with surface coating applied on the flexible portion but no surface coating applied on the multilayer portion, and (3) an adhesive layer having a flux function, wherein the conductor posts and pads are connected by a metal or an alloy, and the wiring patterns are electrically connected.
摘要翻译：一种多层柔性布线基板，包括：（1）多个单面布线板，其各自具有在相应基板的一侧上的布线图案和从该布线图案向与该布线图案相对的一侧突出的两层导体柱，其中除了最外层之外的衬底具有与导体柱相反的一侧连接到两层导体柱的焊盘，并且布线图案没有表面涂层; （2）柔性布线板，其至少一侧具有用于连接到导体柱的焊盘，并且包括施加在柔性部分上的表面涂层的布线图案，但是没有施加在多层部分上的表面涂层，以及（3）具有助焊剂功能的粘合剂层，其中导体柱和焊盘通过金属或合金连接，并且布线图案电连接。

7. 发明申请

US20090126975A1 METHOD FOR FABRICATING MULTILAYER CIRCUIT BOARD, CIRCUIT PLATE, AND METHOD FOR FABRICATING THE CIRCUIT PLATE 失效
标题翻译：制造多层电路板，电路板的方法和制造电路板的方法
公开(公告)号：US20090126975A1
公开(公告)日：2009-05-21
申请号：US12092160
申请日：2006-10-30
申请人： Masayoshi Kondo
发明人： Masayoshi Kondo
IPC分类号： H05K1/00 , B32B37/26
CPC分类号： H05K3/4673 , H05K3/386 , H05K3/4617 , H05K3/4626 , H05K3/4647 , H05K2201/09881 , H05K2203/0264 , H05K2203/066 , H05K2203/1189
摘要： A method for fabricating a multilayer circuit board, including: preparing a film 1 with interlayer adhesive in which a first protective film 102 and a first interlayer adhesive 104 are stacked; preparing a first circuit board 2 having a first base 202 and a conductive post 204 protruding from the first base 202; stacking the surface of the first interlayer adhesive and the surface including the conductive post together; peeling off the first protective film 102; preparing a second circuit board 3 including a conductive pad 302 receiving the conductive post 204; and stacking and bonding the first circuit board 2 and the second circuit board 3 through the first interlayer adhesive 104 so that the conductive post 204 and the conductive pad 302 face each other, wherein in the peeling off, the first interlayer adhesive 104 at the top portion 206 of the conductive post is selectively removed while peeling off the first protective film 102.
摘要翻译：一种多层电路板的制造方法，其特征在于，包括：在第1保护膜102和第1层间粘接剂104的层叠粘接剂中制备膜1，准备具有从第一基座202突出的第一基座202和导电柱204的第一电路板2; 将第一层间粘合剂的表面和包括导电柱的表面堆叠在一起; 剥离第一保护膜102; 准备包括接收导电柱204的导电垫302的第二电路板3; 并且通过第一层间粘合剂104层叠并接合第一电路板2和第二电路板3，使得导电柱204和导电焊盘302彼此面对，其中在剥离时，顶部的第一层间粘合剂104 在剥离第一保护膜102的同时选择性地去除导电柱的部分206。

8. 发明授权

US09002573B2 Electronic control unit and information management system 有权
标题翻译：电子控制单元和信息管理系统
公开(公告)号：US09002573B2
公开(公告)日：2015-04-07
申请号：US13158779
申请日：2011-06-13
申请人： Yoshikuni Kawamura , Kokichi Shimizu , Kazunori Okada , Masayoshi Kondo
发明人： Yoshikuni Kawamura , Kokichi Shimizu , Kazunori Okada , Masayoshi Kondo
IPC分类号： G01M17/00 , G07C5/08
CPC分类号： G07C5/0808 , G07C5/085 , G07C2205/02
摘要： A VIN storage electronic control unit stores a vehicle identification number (VIN). A standby RAM that holds data constantly with an electric power supplied by a battery stores failure diagnosis related information and a rewriting history flag. When the VIN storage electronic control unit rewrites the VIN upon receiving a request signal for rewriting the VIN, the standby RAM updates the rewriting history flag so as to switch into a set status indicating the rewriting is made. When receiving a request signal for eliminating the failure diagnosis related information, the failure diagnosis related information stored in the standby RAM is reset and the rewriting history flag is switched into a reset status. In addition, while the rewriting history flag is in the set status, a malfunction indicator lamp is turned on.
摘要翻译： VIN存储电子控制单元存储车辆识别号（VIN）。通过由电池提供的电力持续保持数据的备用RAM存储故障诊断相关信息和重写历史标志。当VIN存储电子控制单元在接收到用于重写VIN的请求信号时重写VIN，备用RAM更新重写历史标志，以便切换到表示进行重写的设置状态。当接收到用于消除故障诊断相关信息的请求信号时，存储在备用RAM中的故障诊断相关信息被复位，并且重写历史标志被切换到复位状态。此外，当重写历史标志处于设定状态时，故障指示灯亮。

9. 发明申请

US20130015582A1 CIRCUIT BOARD, SEMICONDUCTOR DEVICE, PROCESS FOR MANUFACTURING CIRCUIT BOARD AND PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效
标题翻译：电路板，半导体器件，制造电路板的工艺和制造半导体器件的工艺
公开(公告)号：US20130015582A1
公开(公告)日：2013-01-17
申请号：US13637296
申请日：2011-02-24
申请人： Masayoshi Kondo , Natsuki Makino , Daisuke Fujiwara , Yuka Ito
发明人： Masayoshi Kondo , Natsuki Makino , Daisuke Fujiwara , Yuka Ito
IPC分类号： H01L23/48 , H01L21/78
CPC分类号： H01L23/49816 , H01L23/49811 , H01L23/49827 , H01L2924/0002 , H05K3/285 , H05K2201/068 , H05K2201/09136 , H01L2924/00
摘要： A circuit board (1) exhibits an average coefficient of thermal expansion (A) of the first insulating layer (21) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point of equal to or higher than 3 ppm/degrees C. and equal to or lower than 30 ppm/degrees C. Further, an average coefficient of thermal expansion (B) of the second insulating layer (23) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point is equivalent to an average coefficient of thermal expansion (C) of the third insulating layer (25) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point. (B) and (C) are larger than (A), and a difference between (A) and (B) and a difference between (A) and (C) are equal to or higher than 5 ppm/degrees C. and equal to or lower than 35 ppm/degrees C.
摘要翻译：电路板（1）在25℃至其玻璃化转变点的温度范围内，沿着基板表面的方向显示第一绝缘层（21）的平均热膨胀系数（A）在3ppm /℃以上且30ppm /℃以下的温度范围内。另外，第二绝缘层（23）的沿着基板表面的方向的平均热膨胀系数（B）在 25℃至其玻璃化转变点相当于在25℃至其玻璃化转变点的温度范围内沿着衬底表面的方向上的第三绝缘层（25）的平均热膨胀系数（C）。（B）和（C）大于（A），（A）和（B）之间的差异以及（A）和（C）之间的差异等于或高于5ppm /℃。至35ppm /℃以下

10. 再颁专利

USRE38122E1 Miter saw 有权
标题翻译：斜角锯
公开(公告)号：USRE38122E1
公开(公告)日：2003-05-27
申请号：US09692095
申请日：2000-10-20
申请人： Masayoshi Kondo , Kouji Matsubara
发明人： Masayoshi Kondo , Kouji Matsubara
IPC分类号： B23D4514
CPC分类号： B27B5/29 , B23D45/044 , Y10T83/7697 , Y10T83/7705 , Y10T83/7747 , Y10T83/7788 , Y10T83/8773
摘要： A miter saw includes a miter saw for placing a work thereon, a miter saw unit having a saw blade mounted thereon, and a support mechanism for supporting the miter saw unit for rightward and leftward pivotal movement relative to the base. The support mechanism includes a first member on one side of the base and the miter saw unit and a second member on the other side of the base and the miter saw unit. The first member and the second member are pivotable relative to each other about a pivotal axis. A stopper mechanism is disposed between the first member and the second member for holding the miter saw unit in a vertical position. The stopper mechanism includes a first pressing member mounted on the first member, a first biasing member for biasing the first pressing member, and an abutting surface provided on the second member for abutment of the first pressing member. The abutting surface has a first recess formed therein. The pressing member is brought to automatically engage the first recess by the biasing force of the first biasing member when the miter saw unit is pivoted from a laterally pivoted position to the vertical position.
摘要翻译：斜切锯包括用于在其上放置工件的斜切锯，具有安装在其上的锯片的斜切锯单元和用于支撑斜切锯单元以相对于基座向左和向左枢转运动的支撑机构。支撑机构包括在基座的一侧上的第一构件和斜切锯单元，以及在基座和斜切锯单元的另一侧上的第二构件。第一构件和第二构件可围绕枢转轴线相对于彼此枢转。在第一构件和第二构件之间设置止动机构，用于将斜切锯单元保持在垂直位置。止挡机构包括安装在第一构件上的第一按压构件，用于偏置第一按压构件的第一施力构件和设置在第二构件上用于抵接第一按压构件的抵接面。邻接表面具有形成在其中的第一凹部。当斜切锯单元从横向枢转位置枢转到垂直位置时，按压构件通过第一偏置构件的偏置力自动地接合第一凹部。

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