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1. 发明授权

US5483459A Wire measuring and cutting apparatus and wire changing method using the same 失效
标题翻译：线测量切割装置及使用其的换丝方法
公开(公告)号：US5483459A
公开(公告)日：1996-01-09
申请号：US327840
申请日：1994-10-27
申请人： Yoshikazu Tamura
发明人： Yoshikazu Tamura
IPC分类号： B21F11/00 , B21F23/00 , H01B13/00 , H01B13/012 , H01R43/052 , H01R43/28 , H01R43/00
CPC分类号： H01R43/28 , H01R43/052 , Y10T29/53243 , Y10T83/18
摘要： The wire changing method of the present invention reduces wasteful wires generated whenever wires are changed. When the number of cutting of the wires 28A being produced in a processing device 11 becomes as follows:T=Q-{INT(R/L)+1}wherein Q is the number of wires to be produced, R is the passline length, L is the length of one wire to be produced and INT is the conversion code to integer, the operations of the processing device 11 is temporarily stopped. And the wire 28A is cut at the distance X from the entrance B of the passline, said distance X being represented by the equation:X=L-{R-INT(R/L).times.L},so as to splice it to the wire of type 28B to be employed next. Thus, the wires remaining in the passline can be utilized effectively and the necessary amount is added as the length of wire to be added, thereby reducing wasteful wires generated at the time of the wire change.
摘要翻译：本发明的线切换方法减少线路变化时产生的浪费线。当在处理装置11中产生的线28A的切割次数变为如下时：T = Q- {INT（R / L）+1}其中，Q是要产生的导线数，R是通线长度 L是要生成的一根线的长度，INT是整数的转换代码，处理装置11的动作暂时停止。并且线28A在距离通线的入口B的距离X处切割，所述距离X由以下等式表示：X = L- {R-INT（R / L）×L}，以便将其拼接到接下来要使用的28B型线。因此，可以有效地利用残留在通行线上的电线，并且添加必要量作为要添加的导线的长度，从而减少在电线改变时产生的浪费线。

2. 发明授权

US4703190A Power supply system for a quadrupole mass spectrometer 失效
标题翻译：四极质谱仪的电源系统
公开(公告)号：US4703190A
公开(公告)日：1987-10-27
申请号：US877923
申请日：1986-06-24
申请人： Yoshikazu Tamura , Katsuo Kitajima
发明人： Yoshikazu Tamura , Katsuo Kitajima
IPC分类号： G01N27/62 , H01J49/22 , H01J49/42 , H02J1/00
CPC分类号： H01J49/4215 , H01J49/022 , Y10T307/675 , Y10T307/735
摘要： A power supply system for a quadrupole mass spectrometer includes an RF (radio frequency) power source for generating RF voltages and a voltage divider functioning as a DC (direct current) voltage generating circuit. This voltage divider divides the RF voltages and then rectifies them so as to derive DC voltages while maintaining a proportional relationship to the RF voltages. Thereafter, the DC voltages are superimposed on the RF voltages. The resultant voltages are applied to the electrodes of the quadrupole mass spectrometer.
摘要翻译：用于四极质谱仪的电源系统包括用于产生RF电压的RF（射频）电源和用作DC（直流）电压产生电路的分压器。该分压器分压RF电压，然后对其进行整流，以便导出DC电压，同时保持与RF电压的成比例关系。此后，直流电压叠加在RF电压上。将所得的电压施加到四极质谱仪的电极。

3. 发明申请

US20110012245A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20110012245A1
公开(公告)日：2011-01-20
申请号：US12892165
申请日：2010-09-28
申请人： Yutaka YAMADA , Takeshi Kishida , Yoshikazu Tamura , Yasuo Sogawa , Masanori Hirofuji
发明人： Yutaka YAMADA , Takeshi Kishida , Yoshikazu Tamura , Yasuo Sogawa , Masanori Hirofuji
IPC分类号： H01L23/528
CPC分类号： H01L24/06 , H01L23/50 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06153 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48599 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/49431 , H01L2224/85399 , H01L2924/00014 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/3011 , H01L2224/78 , H01L2924/00
摘要： There is provided a semiconductor device adopting, as a layout of pads connected to an external package on an LSI, a zigzag pad layout in which the pads are arranged shifted alternately, which can avoid occurrences of short-circuiting of wires, an increase in chip size due to avoidance of short-circuiting, propagation of power supply or GND noise due to reduction in IO cell interval, and signal transmission delay difference due to displacement of pad positions. In a semiconductor device wherein plural pads on a semiconductor element which are connected to function terminals on an external package are arranged in two lines along the periphery of the semiconductor element, an arrangement order of the plural pads on the semiconductor element is different from an arrangement order of the function terminals on the external package.
摘要翻译：提供了一种半导体器件，其采用连接到LSI上的外部封装的焊盘的布局，其中焊盘布置移位的之字形焊盘布局，这可以避免导线短路的发生，芯片的增加由于避免短路，由于IO单元间隔的减少而导致的电源传播或GND噪声，以及由于焊盘位置的位移引起的信号传输延迟差异。在半导体装置中，与外部封装上的功能端子连接的半导体元件上的多个焊盘沿着半导体元件的周边配置成两列，半导体元件上的多个焊盘的配置顺序与布置外部封装上功能端子的顺序。

4. 发明授权

US5826472A Method and apparatus for processing a wire 失效
标题翻译：线材加工方法及装置
公开(公告)号：US5826472A
公开(公告)日：1998-10-27
申请号：US713238
申请日：1996-09-12
申请人： Yoshikazu Tamura , Yoshinori Yamashita
发明人： Yoshikazu Tamura , Yoshinori Yamashita
IPC分类号： B21F11/00 , B21F23/00 , H01B13/012 , H01R43/28 , B23Q15/20
CPC分类号： H01R43/28 , Y10S83/907 , Y10S83/95 , Y10T83/141 , Y10T83/145 , Y10T83/178 , Y10T83/53 , Y10T83/54
摘要： A wire processing apparatus is provided with a prefeeder 120, a feeding unit 12 and an accumulator 110 therebetween. A detector is provided to determine if there is a cause for stopping the prefeeder 120. In response to such a detected cause, a controller stops the prefeeder 120 while simultaneously permitting the feeding unit 12 to draw a wire from the accumulator to permit continued operation of the wire processing apparatus.
摘要翻译：线加工装置在其间设置有预取器120，进给单元12和累加器110。提供检测器以确定是否存在用于停止预送器120的原因。响应于这种检测原因，控制器停止预送器120，同时允许馈送单元12从蓄电池中抽出电线以允许继续操作线加工装置。

5. 发明授权

US5623753A Apparatus for producing electric wires with terminals 失效
标题翻译：带端子的电线生产设备
公开(公告)号：US5623753A
公开(公告)日：1997-04-29
申请号：US518401
申请日：1995-08-15
申请人： Yoshikazu Tamura
发明人： Yoshikazu Tamura
IPC分类号： B21F15/00 , H01B13/00 , H01B13/012 , H01R43/01 , H01R43/05 , H01R43/052 , H01R43/00
CPC分类号： H01R43/052 , H01R43/05 , Y10T29/5193 , Y10T29/53213 , Y10T29/53243
摘要： An apparatus for producing a plurality of types of electric wires with a terminal or terminals. Production condition data required to produce a plurality of types of electric wires with a terminal or terminals are previously stored in a memory. Responsive to that a certain type of electric wire with a terminal or terminals has been produced on the basis of one piece of production condition data, production condition data corresponding to an electric wire with a terminal or terminals to be subsequently produced are read out. The data read out and production condition data corresponding to the electric wire with a terminal or terminals which has been produced are compared with each other, to extract the portions of data which differ in contents. The extracted portions of data are displayed on a display. A worker can grasp the contents required for rearrangement such as changes in setting conditions and components to be replaced by watching the contents of display on the display.
摘要翻译：一种用于生产具有端子或多个端子的多种类型的电线的设备。生产具有终端或终端的多种类型的电线所需的生产条件数据预先存储在存储器中。响应于基于一条生产条件数据生产具有端子或端子的特定类型的电线，读出与具有端子的电线对应的生产条件数据或随后产生的端子。对与数据读出的数据相对应的生产条件数据进行比较，提取内容不同的数据部分。所提取的数据部分显示在显示器上。工作人员可以通过观看显示器上的显示内容来掌握重新排列所需的内容，如更换设置条件和要更换的部件。

6. 发明授权

US08525307B2 Semiconductor device, lead frame assembly, and method for fabricating the same 失效
标题翻译：半导体装置，引线框组件及其制造方法
公开(公告)号：US08525307B2
公开(公告)日：2013-09-03
申请号：US13192167
申请日：2011-07-27
申请人： Kenichi Ito , Shigehisa Oonakahara , Yoshikazu Tamura , Kiyoshi Fujihara
发明人： Kenichi Ito , Shigehisa Oonakahara , Yoshikazu Tamura , Kiyoshi Fujihara
IPC分类号： H01L23/495
CPC分类号： H01L23/49861 , H01L23/047 , H01L23/24 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L33/486 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00014 , H01L2924/20752 , H01L2924/00
摘要： A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.
摘要翻译：半导体器件包括引线框架，安装在引线框架上的半导体元件和形成在引线框架上的框架构件，围绕半导体元件，并且覆盖引线框架的侧表面并暴露引线框架的下表面引线框架框状构件在其侧面具有至少一个凹部。凹部具有位于与引线框架的上表面相同的高度的顶部和位于引线框架的下表面之上的底部。

7. 发明授权

US07829983B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07829983B2
公开(公告)日：2010-11-09
申请号：US11997700
申请日：2006-07-28
申请人： Yutaka Yamada , Takeshi Kishida , Yoshikazu Tamura , Yasuo Sogawa , Masanori Hirofuji
发明人： Yutaka Yamada , Takeshi Kishida , Yoshikazu Tamura , Yasuo Sogawa , Masanori Hirofuji
IPC分类号： H01L23/495
CPC分类号： H01L24/06 , H01L23/50 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06153 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48599 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/49431 , H01L2224/85399 , H01L2924/00014 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/3011 , H01L2224/78 , H01L2924/00
摘要： There is provided a semiconductor device adopting, as a layout of pads connected to an external package on an LSI, a zigzag pad layout in which the pads are arranged shifted alternately, which can avoid occurrences of short-circuiting of wires, an increase in chip size due to avoidance of short-circuiting, propagation of power supply or GND noise due to reduction in IO cell interval, and signal transmission delay difference due to displacement of pad positions. In a semiconductor device wherein plural pads on a semiconductor element which are connected to function terminals on an external package are arranged in two lines along the periphery of the semiconductor element, an arrangement order of the plural pads on the semiconductor element is different from an arrangement order of the function terminals on the external package.
摘要翻译：提供了一种半导体器件，其采用连接到LSI上的外部封装的焊盘的布局，其中焊盘布置移位的之字形焊盘布局，这可以避免导线短路的发生，芯片的增加由于避免短路，由于IO单元间隔的减少而导致的电源传播或GND噪声，以及由于焊盘位置的位移引起的信号传输延迟差异。在半导体装置中，与外部封装上的功能端子连接的半导体元件上的多个焊盘沿着半导体元件的周边配置成两列，半导体元件上的多个焊盘的配置顺序与布置外部封装上功能端子的顺序。

8. 发明授权

US4853747A Copying apparatus exposure device 失效
标题翻译：复印设备曝光装置
公开(公告)号：US4853747A
公开(公告)日：1989-08-01
申请号：US181125
申请日：1988-04-13
申请人： Masashi Horiguchi , Minoru Yakubo , Yoshikazu Tamura , Mamoru Ogasawara
发明人： Masashi Horiguchi , Minoru Yakubo , Yoshikazu Tamura , Mamoru Ogasawara
IPC分类号： G03B27/32 , G03B27/50
CPC分类号： G03B27/50 , G03B27/32
摘要： An exposure device effects a slit exposure to a photosensitive sheet material moving over an exposure station, and includes two pairs of conveyor rollers disposed on opposite sides of the exposure station. The two pairs of conveyor rollers first convey a photosensitive sheet material forward, passing over the exposure station until one of the two pairs of conveyor rollers holds the trailing end of the photosensitive sheet flat therebetween. Prior to making an exposure, the two pairs of conveyor rollers are rotated in a reverse direction to move the photosensitive sheet back. After the trailing end of the photosensitive sheet is grabbed by the other of the two pairs of conveyor rollers, a shutter is actuated to effect an exposure to the photosensitive sheet with a slit line exposure light while the photosensitive sheet is being moved back, trailing end first.
摘要翻译：曝光装置对在曝光站上移动的感光片材进行狭缝曝光，并且包括设置在曝光站的相对侧上的两对输送辊。两对传送辊首先将感光片材向前传送，通过曝光站，直到两对输送辊之一将感光片的后端平放在其间。在曝光之前，两对输送辊沿相反方向转动以将感光片移回。在感光片的后端由两对传送辊中的另一个抓住之后，致动快门以在感光片被移回的同时以切割线曝光的光曝光到感光片，尾端第一。

9. 发明授权

US4063813A Method for exposing a light sensitive member 失效
标题翻译：曝光光敏元件的方法
公开(公告)号：US4063813A
公开(公告)日：1977-12-20
申请号：US656877
申请日：1976-02-10
申请人： Yoshikazu Tamura
发明人： Yoshikazu Tamura
IPC分类号： G03B27/50 , G03B27/54 , G03B27/72 , G03G15/04 , G03G15/043 , G03G21/00 , G03B27/32
CPC分类号： G03B27/72
摘要： Method of exposing a light sensitive member with a discharge lamp energized by an alternating electrical current where the exposure time for each point on the light sensitive member is an integral multiple of the period of the periodic output variations of the discharge lamp. In the preferred embodiment, the exposure is effected through a slit where relative movement occurs between the slit and the light sensitive member and where l = v .multidot. n To, l being the width of the slit, v being the relative velocity between the slit and light sensitive member, To being the period of the periodic output variations of the discharge lamp and n being any positive integer.
摘要翻译：用一种交流电流激发的放电灯使感光元件曝光的方法，其中光敏元件上每个点的曝光时间是放电灯的周期性输出变化周期的整数倍。在优选实施例中，曝光通过缝隙在狭缝和感光构件之间发生的狭缝进行，其中l = vxn To，l是狭缝的宽度，v是狭缝和光敏感之间的相对速度成为放电灯的周期性输出变化的周期，n为任意的正整数。

10. 发明申请

US20120025361A1 SEMICONDUCTOR DEVICE, LEAD FRAME ASSEMBLY, AND METHOD FOR FABRICATING THE SAME 失效
标题翻译：半导体器件，引线框架组件及其制造方法
公开(公告)号：US20120025361A1
公开(公告)日：2012-02-02
申请号：US13192167
申请日：2011-07-27
申请人： Kenichi ITO , Shigehisa Oonakahara , Yoshikazu Tamura , Kiyoshi Fujihara
发明人： Kenichi ITO , Shigehisa Oonakahara , Yoshikazu Tamura , Kiyoshi Fujihara
IPC分类号： H01L23/495 , H01L21/66
CPC分类号： H01L23/49861 , H01L23/047 , H01L23/24 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L33/486 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00014 , H01L2924/20752 , H01L2924/00
摘要： A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.
摘要翻译：半导体器件包括引线框架，安装在引线框架上的半导体元件和形成在引线框架上的框架构件，围绕半导体元件，并且覆盖引线框架的侧表面并暴露引线框架的下表面引线框架框状构件在其侧面具有至少一个凹部。凹部具有位于与引线框架的上表面相同的高度的顶部和位于引线框架的下表面之上的底部。

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