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1. 发明授权

US07464591B2 Semiconductor acceleration sensor 有权
标题翻译：半导体加速度传感器
公开(公告)号：US07464591B2
公开(公告)日：2008-12-16
申请号：US11579178
申请日：2006-01-20
申请人： Yoshihisa Fukuda , Kouji Sakai , Atsushi Ishigami , Eiichi Furukubo , Ryosuke Meshii , Takashi Yajima
发明人： Yoshihisa Fukuda , Kouji Sakai , Atsushi Ishigami , Eiichi Furukubo , Ryosuke Meshii , Takashi Yajima
IPC分类号： G01P15/02 , G01P15/00
CPC分类号： G01P15/08 , G01P2015/0871
摘要： A semiconductor acceleration sensor having beam parts formed in substantially L-shape to surround a weight part, wherein formed to surround a square part, as seen in plan view and constituting the weight part, are two elongated L-shaped beam parts, at locations close to proximal end portions of which are formed protruding portions protruding from a fixed part toward the weight part, and receiving recessed portions protruding from the weight part toward the fixed part to surround the protruding portions. The protruding portions have an outer shape substantially the same as an inner wall surface of the receiving recessed portions so that movements of the weight part in any directions in a horizontal direction perpendicular to an up and down direction are limited as a result of reception of the protruding portions by the receiving recessed portions. Thus, even when a side impact is applied to the acceleration sensor, the weight part is prevented from moving significantly, thereby preventing an excessive stress from being applied to the beam parts to break the beam parts.
摘要翻译：一种半导体加速度传感器，其具有形成为大致L形以包围重量部分的梁部分，其中形成为包围正方形部分，如在平面图中看到并构成重量部分的两个细长L形梁部分，在靠近的位置其基端部形成有从固定部朝向配重部突出的突出部，并且容纳从重物部朝向固定部突出以包围突出部的凹部。突出部具有与容纳凹部的内壁面大致相同的外形，使得重量部在与上下方向垂直的水平方向上的任何方向上的移动受到限制突出部分由接收凹部。因此，即使当对加速度传感器施加侧面冲击时，防止重量部分显着移动，从而防止过大的应力施加到梁部分以破坏梁部分。

2. 发明申请

US20080022770A1 Semiconductor Acceleration Sensor 有权
标题翻译：半导体加速度传感器
公开(公告)号：US20080022770A1
公开(公告)日：2008-01-31
申请号：US11579178
申请日：2006-01-20
申请人： Yoshihisa Fukuda , Kouji Sakai , Atsushi Ishigami , Eiichi Furukubo , Ryosuke Meshii , Takashi Yajima
发明人： Yoshihisa Fukuda , Kouji Sakai , Atsushi Ishigami , Eiichi Furukubo , Ryosuke Meshii , Takashi Yajima
IPC分类号： G01P15/02
CPC分类号： G01P15/08 , G01P2015/0871
摘要： A semiconductor acceleration sensor having beam parts formed in substantially L-shape to surround a weight part, wherein formed to surround a square part, as seen in plan view and constituting the weight part, are two elongated L-shaped beam parts, at locations close to proximal end portions of which are formed protruding portions protruding from a fixed part toward the weight part, and receiving recessed portions protruding from the weight part toward the fixed part to surround the protruding portions. The protruding portions have an outer shape substantially the same as an inner wall surface of the receiving recessed portions so that movements of the weight part in any directions in a horizontal direction perpendicular to an up and down direction are limited as a result of reception of the protruding portions by the receiving recessed portions. Thus, even when a side impact is applied to the acceleration sensor, the weight part is prevented from moving significantly, thereby preventing an excessive stress from being applied to the beam parts to break the beam parts.
摘要翻译：一种半导体加速度传感器，其具有形成为大致L形以包围重量部分的梁部分，其中形成为包围正方形部分，如在平面图中看到并构成重量部分的两个细长L形梁部分，在靠近的位置其基端部形成有从固定部朝向配重部突出的突出部，并且容纳从重物部朝向固定部突出以包围突出部的凹部。突出部具有与容纳凹部的内壁面大致相同的外形，使得重量部在与上下方向垂直的水平方向上的任何方向上的移动受到限制突出部分由接收凹部。因此，即使当对加速度传感器施加侧面冲击时，防止重量部分显着移动，从而防止过大的应力施加到梁部分以破坏梁部分。

3. 发明申请

US20130292890A1 HOLLOW COIL SPRING AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：中空螺旋弹簧及其制造方法
公开(公告)号：US20130292890A1
公开(公告)日：2013-11-07
申请号：US13989923
申请日：2011-11-24
申请人： Takashi Yajima , Kenichiro Morino
发明人： Takashi Yajima , Kenichiro Morino
IPC分类号： F16F1/04
CPC分类号： F16F1/042 , B21D11/06 , B21D22/14 , B21D41/045 , B21F35/00 , Y10T29/49609
摘要： In an end sealing step, an end is sealed by which the core material of the end of a spring member is gathered by machining. For example, a squeezing roller is moved in an axial direction as necessary, while the end of the spring member is pressed to the inside in a radial direction by the squeezing roller. As a result, the end of the spring member is sealed and therefore, it is not necessary to use another member such as a lid member. For example, the end sealing step can be immediately carried out after an inner surface processing step. In a coil forming step after the end sealing step, formation of clearance can be prevented at the end even if the end of the spring member is gripped and the spring member is wound around the rod.
摘要翻译：在端部密封步骤中，密封端部，通过该端部通过机械加工来聚集弹簧构件的端部的芯材。例如，挤压辊根据需要沿轴向移动，同时弹簧构件的端部通过挤压辊在径向方向上被按压到内部。结果，弹簧构件的端部被密封，因此不需要使用诸如盖构件的其他构件。例如，可以在内表面处理步骤之后立即进行端部密封步骤。在端密封步骤之后的线圈形成步骤中，即使弹簧构件的端部被夹持并且弹簧构件缠绕在杆上，也可以最终形成间隙。

4. 发明申请

US20110182035A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20110182035A1
公开(公告)日：2011-07-28
申请号：US12939847
申请日：2010-11-04
申请人： Takashi Yajima
发明人： Takashi Yajima
IPC分类号： H05K7/20
CPC分类号： H05K7/20963 , H01L23/40 , H01L23/433 , H01L23/60 , H01L2924/0002 , H01L2924/15311 , H01L2924/00
摘要： An electronic apparatus includes: a semiconductor device including an electrically conductive portion to be grounded, the semiconductor device being configured to be mounted on a circuit board; a heat sink configured to radiate heat generated by the semiconductor device; a fastener configured to fasten the heat sink to the circuit board; and a first spring member wound around the fastener to electrically connect the heat sink to the electrically conductive portion.
摘要翻译：电子设备包括：半导体器件，包括待接地的导电部分，所述半导体器件被配置为安装在电路板上; 散热器，被配置为辐射由所述半导体器件产生的热量; 紧固件，其被配置为将所述散热器紧固到所述电路板; 以及围绕所述紧固件缠绕的第一弹簧构件，以将所述散热器电连接到所述导电部分。

5. 发明授权

US07834446B2 Electronic device and method for coping with electrostatic discharge 有权
标题翻译：用于应对静电放电的电子设备和方法
公开(公告)号：US07834446B2
公开(公告)日：2010-11-16
申请号：US12415657
申请日：2009-03-31
申请人： Takashi Yajima , Masayuki Gamou
发明人： Takashi Yajima , Masayuki Gamou
IPC分类号： H01L23/40
CPC分类号： H01L23/60 , H01L2924/0002 , H01L2924/15311 , Y10T29/49826 , H01L2924/00
摘要： According to an aspect of the present invention, there is provided an electronic device including: a substrate board; a semiconductor device mounted on the substrate board; a heat sink configured to radiate heat from the semiconductor device; a first conductive portion provided on the substrate board; and a second conductive portion provided on the substrate board, the second conductive portion separated from the first conductive portion by a discharge gap, wherein: the heat sink is electrically connected to the first conductive portion; and the second conductive portion is grounded.
摘要翻译：根据本发明的一个方面，提供了一种电子设备，包括：基板; 安装在基板上的半导体器件; 散热器，被配置为从所述半导体器件辐射热量; 设置在所述基板上的第一导电部; 以及设置在所述基板上的第二导电部，所述第二导电部通过放电间隔与所述第一导电部分隔开，其中：所述散热器与所述第一导电部电连接; 并且第二导电部分接地。

6. 发明申请

US20080173834A1 Malfunction Prevention Manual Valve 审中-公开
标题翻译：故障预防手动阀
公开(公告)号：US20080173834A1
公开(公告)日：2008-07-24
申请号：US11885737
申请日：2005-04-13
申请人： Tatsuhito Aoyama , Takashi Yajima , Masayoshi Morimoto
发明人： Tatsuhito Aoyama , Takashi Yajima , Masayoshi Morimoto
IPC分类号： F16K35/00
CPC分类号： F16K7/16 , F16K35/027 , F16K35/04
摘要： An object of the present invention is to provide a malfunction prevention manual valve capable of preventing a malfunction while ensuring operability in opening and closing the valve. To achieve the object, a malfunction prevention manual valve 1 of the present invention includes a lock mechanism including a parallel pin 75 held against rotation relative to a housing 71, and a sub-handle 73 provided in a handle 72 in such a manner as to be engageable with the parallel pin 75. The parallel pin 75 or the sub-handle 73 is urged by a lock spring 77, bringing the sub-handle in engagement with the parallel pin 75 to restrain rotation of the handle 72. A malfunction prevention manual valve 2 of another aspect includes a lock mechanism including a spring pin 175 held against rotation relative to a housing 171, a cam groove 172a formed in a handle 172 to receive a spring pin 175, and a sub-handle 173 provided integral with the handle 172 and urged by a spring 177.
摘要翻译：本发明的目的是提供一种能够在确保阀的打开和关闭的可操作性的同时防止故障的故障预防手动阀。为了实现该目的，本发明的故障预防手动阀1包括锁定机构，该锁定机构包括相对于壳体71保持的不能旋转的平行销75和设置在手柄72中的副手柄73，可与平行销75接合。平行销75或副手柄73被锁定弹簧77推压，使副把手与平行销75接合，以限制把手72的转动。另一方面的故障防止手动阀2包括锁定机构，该锁定机构包括相对于壳体171保持的不受旋转的弹簧销175，形成在手柄172中以接收弹簧销175的凸轮槽172a和副手柄173 与手柄172一体地设置并由弹簧177推动。

7. 发明授权

US09145941B2 Hollow coil spring and method for manufacturing same 有权
标题翻译：中空螺旋弹簧及其制造方法
公开(公告)号：US09145941B2
公开(公告)日：2015-09-29
申请号：US13989923
申请日：2011-11-24
申请人： Takashi Yajima , Kenichiro Morino
发明人： Takashi Yajima , Kenichiro Morino
IPC分类号： F16F1/04 , B21D22/14 , B21D41/04 , B21F35/00 , B21D11/06
CPC分类号： F16F1/042 , B21D11/06 , B21D22/14 , B21D41/045 , B21F35/00 , Y10T29/49609
摘要： In an end sealing step, an end is sealed by which the core material of the end of a spring member is gathered by machining. For example, a squeezing roller is moved in an axial direction as necessary, while the end of the spring member is pressed to the inside in a radial direction by the squeezing roller. As a result, the end of the spring member is sealed and therefore, it is not necessary to use another member such as a lid member. For example, the end sealing step can be immediately carried out after an inner surface processing step. In a coil forming step after the end sealing step, formation of clearance can be prevented at the end even if the end of the spring member is gripped and the spring member is wound around the rod.
摘要翻译：在端部密封步骤中，密封端部，通过该端部通过机械加工来聚集弹簧构件的端部的芯材。例如，挤压辊根据需要沿轴向移动，同时弹簧构件的端部通过挤压辊在径向方向上被按压到内部。结果，弹簧构件的端部被密封，因此不需要使用诸如盖构件的其他构件。例如，可以在内表面处理步骤之后立即进行端部密封步骤。在端密封步骤之后的线圈形成步骤中，即使弹簧构件的端部被夹持并且弹簧构件缠绕在杆上，也可以最终形成间隙。

8. 发明授权

US08460483B2 Method for heat treatment of coiled spring 有权
标题翻译：螺旋弹簧热处理方法
公开(公告)号：US08460483B2
公开(公告)日：2013-06-11
申请号：US13052522
申请日：2011-03-21
申请人： Takashi Yajima , Hideki Okada , Katsuyuki Nishioka , Takeshi Furuse
发明人： Takashi Yajima , Hideki Okada , Katsuyuki Nishioka , Takeshi Furuse
IPC分类号： C21D9/02 , C21D8/02
CPC分类号： C21D9/02
摘要： A method for heat treatment of a coiled spring includes cold forming a coiled spring, annealing the coiled spring after the cold forming, thereby removing of residual stress generated in the cold forming, in which the annealing is performed by electric resistance heating.
摘要翻译：螺旋弹簧的热处理方法包括：冷成形螺旋弹簧，在冷成型后对螺旋弹簧进行退火，从而消除在冷加工中产生的残余应力，其中通过电阻加热进行退火。

9. 发明申请

US20130099435A1 Coil Spring 审中-公开
标题翻译：线圈弹簧
公开(公告)号：US20130099435A1
公开(公告)日：2013-04-25
申请号：US13807100
申请日：2011-06-23
申请人： Takayuki Matsuoto , Kazuhisa Michibata , Satoshi Ieiri , Takashi Yajima
发明人： Takayuki Matsuoto , Kazuhisa Michibata , Satoshi Ieiri , Takashi Yajima
IPC分类号： F16F1/06
CPC分类号： F16F1/06 , F16F1/047 , F16F1/123
摘要： A coil spring has an effective section that functions as a spring when a load in a coil axis direction has been applied, end turn sections that are formed on both ends of the effective section, and rising sections that are formed between the effective section and the end turn sections, wherein the rising sections are formed in such a way that, when θ1 represents the pitch angle of the rising sections and θ2 represents the pitch angle of the effective section, pitch angle θ1> pitch angle θ2 holds true in at least one of the rising sections.
摘要翻译：螺旋弹簧具有作为弹簧的有效部，当施加线圈轴方向上的负载时，形成在有效部的两端的端部转弯部以及形成在有效部和其中上升部分形成为当θ1表示上升部分的俯仰角，θ2表示有效部分的俯仰角时，俯仰角θ1>俯仰角θ2在至少一个的上升部分。

10. 发明申请

US20100008043A1 HEAT-TRANSPORTING DEVICE, ELECTRONIC APPARATUS, SEALING APPARATUS, SEALING METHOD, AND METHOD OF PRODUCING A HEAT-TRANSPORTING DEVICE 审中-公开
标题翻译：热交换装置，电子设备，密封装置，密封方法和制造热交换装置的方法
公开(公告)号：US20100008043A1
公开(公告)日：2010-01-14
申请号：US12496944
申请日：2009-07-02
申请人： Takashi Yajima , Hiroyuki Ryoson , Kazuo Goto
发明人： Takashi Yajima , Hiroyuki Ryoson , Kazuo Goto
IPC分类号： H05K7/20 , F28D15/02 , F28D15/00 , B23K26/00 , F16J15/02
CPC分类号： F16J15/0881 , F28D15/0233 , F28D15/0283 , F28D15/046 , G06F1/203 , G06F2200/201 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat-transporting device includes a casing, a working fluid, a first substrate, a second substrate, and a third substrate. The casing includes a first side and a second side opposed to the first side. The working fluid is sealed inside the casing and transports heat by a phase change. The first substrate includes an inlet through which the working fluid is injected and constitutes the first side of the casing. The second substrate is disposed opposite to the first substrate and constitutes the second side of the casing. The third substrate includes a contact portion that is brought into contact with the inlet so that the inlet is sealed when the inlet is pressed, the third substrate being interposed between the first substrate and the second substrate.
摘要翻译：热输送装置包括壳体，工作流体，第一基板，第二基板和第三基板。壳体包括与第一侧相对的第一侧和第二侧。工作流体被密封在壳体内并通过相变传递热量。第一基板包括入口，工作流体通过该入口构成壳体的第一侧。第二基板与第一基板相对设置并构成壳体的第二侧。第三基板包括与入口接触的接触部分，使得当入口被按压时入口被密封，第三基板插入在第一基板和第二基板之间。

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