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1. 发明授权

US06936490B2 Semiconductor wafer and its manufacturing method 失效
标题翻译：半导体晶片及其制造方法
公开(公告)号：US06936490B2
公开(公告)日：2005-08-30
申请号：US10432597
申请日：2002-09-05
申请人： Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi , Kazutaka Terashima , Jun Komiyama
发明人： Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi , Kazutaka Terashima , Jun Komiyama
IPC分类号： C30B25/02 , H01L21/04 , H01L21/00
CPC分类号： C30B25/02 , C30B29/36 , C30B29/406 , H01L21/0445
摘要： A method of epitaxially growing a SiC film on a Si substrate, including: (a) supplying a raw material gas containing a gas having P (phosphorus) element and a gas having B (boron) element on a Si substrate, and thereby synthesizing an amorphous BP thin film having a thickness of 5 nm or more and 100 nm or less on the Si substrate; (b) further supplying a raw material gas containing a gas having P element and a gas having B element on the Si substrate, and thereby synthesizing a cubic boron phosphide single crystal film having a thickness of 5 nm or more and 1000 nm or less on the Si substrate; and (c) supplying a gas having carbon element and a gas having silicon element on the Si substrate thereon the BP single crystal film is formed, and thereby synthesizing a beta-SiC single crystal film or an amorphous SiC film having a thickness of 1 nm or more and several hundreds nanometers or less on the cubic boron phosphide single crystal film on the Si substrate.
摘要翻译：一种在Si衬底上外延生长SiC膜的方法，包括：（a）在Si衬底上提供含有P（磷）元素的气体和具有B（硼）元素的气体的原料气体，从而合成在Si衬底上具有5nm以上且100nm以下的厚度的无定形BP薄膜; （b）在Si衬底上进一步供给包含具有P元素的气体和具有B元素的气体的原料气体，由此合成厚度为5nm以上且1000nm以下的立方晶磷化硼单晶膜， Si衬底; 和（c）在Si衬底上提供具有碳元素的气体和具有硅元素的气体，形成BP单晶膜，从而合成厚度为1nm的β-SiC单晶膜或非晶SiC膜或更多和几百纳米或更少的Si基板上的立方硼化磷单晶膜。

2. 发明申请

US20080224268A1 NITRIDE SEMICONDUCTOR SINGLE CRYSTAL SUBSTRATE 审中-公开
标题翻译：氮化物半导体单晶衬底
公开(公告)号：US20080224268A1
公开(公告)日：2008-09-18
申请号：US12040020
申请日：2008-02-29
申请人： Yoshihisa Abe , Jun Komiyama , Shunichi Suzuki , Akira Yoshida , Hideo Nakanishi
发明人： Yoshihisa Abe , Jun Komiyama , Shunichi Suzuki , Akira Yoshida , Hideo Nakanishi
IPC分类号： H01L29/20
CPC分类号： H01L29/2003 , C30B25/02 , C30B25/183 , C30B29/403 , C30B29/406 , H01L21/02381 , H01L21/02433 , H01L21/02447 , H01L21/02458 , H01L21/02461 , H01L21/02502 , H01L21/02505 , H01L21/0254 , H01L21/0262 , H01L29/045 , H01L29/267 , H01L33/007 , H01S2304/04
摘要： To provide a nitride semiconductor single crystal substrate comprising a Si substrate and a nitride semiconductor film which has semi-polar (10-1m) plane (m: natural number) and a thickness of 1 μm or more, the nitride semiconductor single crystal substrate being suitably used for a light-emitting device, the nitride semiconductor single crystal substrate being suitably used for a light-emitting device, this invention provides a nitride semiconductor single crystal substrate comprising a Si substrate having an off-cut angle of 1 to 35° in the direction from the direction, a buffer layer 2a (2b) made of at least one of SiC or BP formed on the Si substrate, a AlN buffer layer formed on the buffer layers, and a nitride semiconductor single crystal film formed on the AlN buffer layer, the nitride semiconductor single crystal film comprising any one of GaN (10-1m), AlN (10-1m), InN (10-1m) or a GaN (10-1m)/and AlN (10-1m) superlattice film.
摘要翻译：为了提供一种氮化物半导体单晶衬底，其包括Si衬底和具有半极性（10-1m）面（m：自然数）和1μm以上的厚度的氮化物半导体膜，氮化物半导体单晶衬底为适合用于发光器件的氮化物半导体单晶衬底适合用于发光器件，本发明提供了一种氮化物半导体单晶衬底，其包括具有1至35°的截止角的Si衬底从<100>方向的<110>方向，由在Si衬底上形成的SiC或BP中的至少一种制成的缓冲层2a（2b），形成在缓冲层上的AlN缓冲层，以及氮化物半导体形成在AlN缓冲层上的单晶膜，包含GaN（10-1m），AlN（10-1m），InN（10-1m）或GaN（10-1m）中的任一种的氮化物半导体单晶膜和/ AlN（10-1m）超晶格膜。

3. 发明申请

US20070210304A1 Nitride semiconductor single crystal film 审中-公开
标题翻译：氮化物半导体单晶膜
公开(公告)号：US20070210304A1
公开(公告)日：2007-09-13
申请号：US11714259
申请日：2007-03-06
申请人： Jun Komiyama , Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi
发明人： Jun Komiyama , Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi
IPC分类号： H01L29/08
CPC分类号： H01L29/267 , C30B25/02 , C30B29/403 , H01L21/02381 , H01L21/02433 , H01L21/02458 , H01L21/02507 , H01L21/0254 , H01L29/1608 , H01L29/2003
摘要： The present invention provides a nitride semiconductor single crystal including gallium nitride (GaN) or aluminum nitride (AlN) which are formed as a film to have good crystallinity without forming a 3C—SiC layer on a Si substrate, and which can be used suitably for a light emitting diode, a laser light emitting element, an electronic element that can be operated at a high speed and a high temperature, etc., as well as a high frequency device.A GaN (0001) or AlN (0001) single crystal film, or a super-lattice structure of GaN (0001) and AlN (0001) is formed on a Si (110) substrate via a 2H—AlN buffer layer.
摘要翻译：本发明提供了一种氮化物半导体单晶，其包括氮化镓（GaN）或氮化铝（AlN），其形成为具有良好结晶性而不在Si衬底上形成3C-SiC层的膜，并且可以适用于发光二极管，激光发光元件，可以高速，高温等操作的电子元件以及高频器件。通过2H-AlN缓冲层在Si（110）衬底上形成GaN（0001）或AlN（0001）单晶膜或GaN（0001）和AlN（0001）的超晶格结构。

4. 发明申请

US20070069216A1 Substrate for compound semiconductor device and compound semiconductor device using the same 审中-公开
标题翻译：用于化合物半导体器件的衬底和使用其的化合物半导体器件
公开(公告)号：US20070069216A1
公开(公告)日：2007-03-29
申请号：US11434115
申请日：2006-05-16
申请人： Jun Komiyama , Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi
发明人： Jun Komiyama , Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi
IPC分类号： H01L31/0312
CPC分类号： H01L29/7787 , H01L29/2003
摘要： A substrate for compound semiconductor device and a compound semiconductor device using the substrate are provided which allow a breakdown voltage to be high, cause little energy loss, and are suitably used for a high-electron mobility transistor etc. An n-type 3C—SiC single crystal buffer layer 3 having a carrier concentration of 1016-1021/cm3, a hexagonal GaxAl1-xN single crystal buffer layer (0≦x
摘要翻译：提供了一种化合物半导体器件的基板和使用该基板的化合物半导体器件，其允许击穿电压高，导致很少的能量损失，并且适合用于高电子迁移率晶体管等。n型3C-SiC 载流子浓度为10-16 / 21/3/3的单晶缓冲层3，六方晶系 > 1×1×N单晶缓冲层（0 <= x <1）4，n型六方晶系Al 1-y < 载流子浓度为10〜10/10/10/10以上的SUB> N单晶层（0.2 <= y <= 1）5 ，和n型六方晶系Al 1-z N单晶载体供给层（0≤z≤0.8,0.2≤yz≤1））6具有载流子浓度为10 11 -10 16 / cm 3的物质依次层叠在n型Si单晶衬底2上具有晶面取向{111}和载体浓度为10 16 -10 21 / cm 3。在上述基板2的背面形成有背面电极7，在上述载体供给层6的表面上形成有表面电极8。

5. 发明申请

US20090065812A1 COMPOUND SEMICONDUCTOR SUBSTRATE 审中-公开
标题翻译：化合物半导体基板
公开(公告)号：US20090065812A1
公开(公告)日：2009-03-12
申请号：US12204328
申请日：2008-09-04
申请人： Yoshihisa ABE , Jun Komiyama , Shunichi Suzuki , Hiroshi Oishi , Akira Yoshida , Hideo Nakanishi
发明人： Yoshihisa ABE , Jun Komiyama , Shunichi Suzuki , Hiroshi Oishi , Akira Yoshida , Hideo Nakanishi
IPC分类号： H01L29/205
CPC分类号： H01L33/007 , C30B25/02 , C30B25/18 , C30B29/403 , H01L21/02381 , H01L21/02447 , H01L21/02458 , H01L21/02488 , H01L21/02491 , H01L21/02505 , H01L21/0254
摘要： Provides is a compound semiconductor substrate about which the thickness of its nitride semiconductor single crystal layer can be made large while the generation of cracks, crystal defects or the like is restrained in the nitride semiconductor single crystal layer. The substrate has a first intermediate layer 110 formed on a Si single crystal substrate 100 having a crystal plane orientation of {111}. In the layer 110, a first metal compound layer 110a made of any one of TiC, TiN, VC and VN, and a second metal compound layer 110b made of any one of compounds which are different from the compound of the first metal compound layer out of TiC, TiN, VC and VN are laminated in this order alternately each other over the Si single crystal.
摘要翻译：提供了一种化合物半导体衬底，可以使氮化物半导体单晶层的厚度大得多，同时在氮化物半导体单晶层中抑制裂纹，晶体缺陷等的产生。基板具有形成在晶体取向为{111}的Si单晶基板100上的第一中间层110。在层110中，由TiC，TiN，VC和VN中的任一种制成的第一金属化合物层110a和由与第一金属化合物层的化合物不同的任何一种化合物制成的第二金属化合物层110b 的TiC，TiN，VC和VN以这种顺序层叠在Si单晶上。

6. 发明申请

US20060138448A1 Compound semiconductor and compound semiconductor device using the same 有权
标题翻译：化合物半导体和使用其的化合物半导体器件
公开(公告)号：US20060138448A1
公开(公告)日：2006-06-29
申请号：US11298490
申请日：2005-12-12
申请人： Jun Komiyama , Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi
发明人： Jun Komiyama , Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi
IPC分类号： H01L33/00
CPC分类号： H01L29/452 , H01L21/02381 , H01L21/02433 , H01L21/02447 , H01L21/02458 , H01L21/02461 , H01L21/02502 , H01L21/02516 , H01L21/0254 , H01L21/0262 , H01L29/045 , H01L29/1608 , H01L29/2003 , H01L29/267 , H01L33/007
摘要： A back electrode 6 is formed in the back of a Si single crystal substrate 2 of a compound semiconductor in which an n-type 3C-SiC single crystal buffer layer 3 having a thickness of 0.05-2 μm, a carrier concentration of 1016-1021/cm3, a hexagonal InwGaxAl1-w-xN single crystal buffer layer 4 (0≦w
摘要翻译：背面电极6形成在化合物半导体的Si单晶衬底2的背面，其中厚度为0.05-2μm的n型3C-SiC单晶缓冲层3，载流子浓度为10 ^{16×10 21 / cm 3，六方晶系Al x 厚度为0.01-0.5μm的1-wx N单晶缓冲层4（0 <= w <1,0 <= x <1，w + x <1）和n型六方晶系在Al 3 O 3中，单晶层5（0 <= y <1,0 3 <！ - SIPO - >，并且在六方晶系AlGaN / N单晶层5，以提供化合物导致很少的能量损失并且允许高效率和高的击穿电压的半导体器件。}

7. 发明申请

US20060011941A1 Substrate for growing electro-optical single crystal thin film and method of manufacturing the same 失效
标题翻译：用于生长电光单晶薄膜的基板及其制造方法
公开(公告)号：US20060011941A1
公开(公告)日：2006-01-19
申请号：US11174610
申请日：2005-07-06
申请人： Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi , Jun Komiyama
发明人： Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi , Jun Komiyama
IPC分类号： H01L31/109
CPC分类号： G02F1/03
摘要： A substrate 1 for growing an electro-optical single crystal thin film in which two or more layers of buffer layers 3, 4, and 5 for buffering lattice mismatch between Si and BTO are formed on an Si (001) substrate 2 is provided as a substrate for growing an electro-optical single crystal thin film which can obtain an electro-optical single crystal thin film of BTO single crystal thin film 6 etc. with a large size and a very high quality.
摘要翻译：在Si（001）基板2上形成用于生长用于缓冲Si和BTO之间的晶格失配的两层或多层缓冲层3,4和5的电光单晶薄膜的衬底1，作为用于生长可以获得具有大尺寸和非常高质量的BTO单晶薄膜6等的电光单晶薄膜的电光单晶薄膜的基板。

8. 发明授权

US07368757B2 Compound semiconductor and compound semiconductor device using the same 有权
标题翻译：化合物半导体和使用其的化合物半导体器件
公开(公告)号：US07368757B2
公开(公告)日：2008-05-06
申请号：US11298490
申请日：2005-12-12
申请人： Jun Komiyama , Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi
发明人： Jun Komiyama , Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi
IPC分类号： H01L31/0312
CPC分类号： H01L29/452 , H01L21/02381 , H01L21/02433 , H01L21/02447 , H01L21/02458 , H01L21/02461 , H01L21/02502 , H01L21/02516 , H01L21/0254 , H01L21/0262 , H01L29/045 , H01L29/1608 , H01L29/2003 , H01L29/267 , H01L33/007
摘要： A back electrode 6 is formed in the back of a Si single crystal substrate 2 of a compound semiconductor in which an n-type 3C-SiC single crystal buffer layer 3 having a thickness of 0.05-2 μm, a carrier concentration of 1016-1021/cm3, a hexagonal InwGaxAl1-w-xN single crystal buffer layer 4 (0≦w
摘要翻译：背面电极6形成在化合物半导体的Si单晶衬底2的背面，其中厚度为0.05-2μm的n型3C-SiC单晶缓冲层3，载流子浓度为10 ^{16×10 21 / cm 3，六方晶系Al x 厚度为0.01-0.5μm的1-wx N单晶缓冲层4（0 <= w <1,0 <= x <1，w + x <1）和n型六方晶系在Al 3 O 3中，单晶层5（0 <= y <1,0 3 <！ - SIPO - >面，并且在六方晶系的表面上形成表面电极7，单晶层5，以提供化合物s 导致少量能量损失并且允许高效率和高击穿电压的半导体器件。}

9. 发明授权

US07262485B2 Substrate for growing electro-optical single crystal thin film and method of manufacturing the same 失效
标题翻译：用于生长电光单晶薄膜的基板及其制造方法
公开(公告)号：US07262485B2
公开(公告)日：2007-08-28
申请号：US11174610
申请日：2005-07-06
申请人： Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi , Jun Komiyama
发明人： Yoshihisa Abe , Shunichi Suzuki , Hideo Nakanishi , Jun Komiyama
IPC分类号： H01L29/30 , H01L29/04 , H01L31/036
CPC分类号： G02F1/03
摘要： A substrate 1 for growing an electro-optical single crystal thin film in which two or more layers of buffer layers 3, 4, and 5 for buffering lattice mismatch between Si and BTO are formed on an Si (001) substrate 2 is provided as a substrate for growing an electro-optical single crystal thin film which can obtain an electro-optical single crystal thin film of BTO single crystal thin film 6 etc. with a large size and a very high quality.
摘要翻译：在Si（001）基板2上形成用于生长用于缓冲Si和BTO之间的晶格失配的两层或多层缓冲层3,4和5的电光单晶薄膜的衬底1，作为用于生长可以获得具有大尺寸和非常高质量的BTO单晶薄膜6等的电光单晶薄膜的电光单晶薄膜的基板。

10. 发明申请

US20050263754A1 Substrates for growth of chemical compound semiconductors, chemical compound semiconductors using the substrates and processes for producing thereof 审中-公开
标题翻译：用于生长化学半导体的基板，使用该基板的化合物半导体及其制造方法
公开(公告)号：US20050263754A1
公开(公告)日：2005-12-01
申请号：US10953867
申请日：2004-09-30
申请人： Jun Komiyama , Yoshihisa Abe , Shuniti Suzuki , Hideo Nakanishi , Toru Kita
发明人： Jun Komiyama , Yoshihisa Abe , Shuniti Suzuki , Hideo Nakanishi , Toru Kita
IPC分类号： H01L21/22 , C30B25/02 , C30B29/06 , C30B29/10 , C30B29/40 , H01L21/20 , H01L23/58 , H01L29/08
CPC分类号： C30B25/02 , C30B29/06 , C30B29/10 , C30B29/40 , H01L21/02381 , H01L21/02447 , H01L21/0245 , H01L21/02502 , H01L21/02505 , H01L21/02513 , H01L21/02529 , H01L21/02543 , H01L21/0262 , H01L21/02667
摘要： In a substrate for growth of a chemical compound semiconductor, at least on one surface of a Si single crystal substrate 2 with a thickness of 300 μm, a porous Si single crystal 4 is formed. Pores of the porous Si single crystal 4 is opened outward. The surface of the porous Si single crystal 4 is covered by a 3C—SiC single crystal layer 3 with a thickness of 1 nm. The thickness of the porous Si single crystal 4 is, for example, 10 μm.
摘要翻译：在用于生长化学化合物半导体的衬底中，至少在厚度为300μm的Si单晶衬底2的一个表面上形成多孔Si单晶4。多孔Si单晶4的孔向外侧开口。多孔Si单晶4的表面被厚度为1nm的3C-SiC单晶层3覆盖。多孔Si单晶4的厚度例如为10μm。

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