专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5784778A Component mounting apparatus and component mounting method 失效
标题翻译：组件安装装置和部件安装方法
公开(公告)号：US5784778A
公开(公告)日：1998-07-28
申请号：US587462
申请日：1996-01-17
申请人： Yoshihiro Yoshida , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
发明人： Yoshihiro Yoshida , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
IPC分类号： B23P21/00 , B25J15/04 , H05K13/04 , H05K3/30 , B23P19/00
CPC分类号： H05K13/0408 , Y10T29/4913 , Y10T29/49133 , Y10T29/53178 , Y10T29/53191
摘要： A rotary body rotatable about a vertical axis thereof is set at a mounting head. A cam having a cam surface at a lower end thereof is arranged along the periphery of a lower part of the rotary body. Each of outer cylinders is rotatably set in the periphery of the rotary body, wherein each of nozzle shafts with each suction nozzle fitted at lower ends thereof penetrates each outer cylinder in a freely movable manner in an up and down direction. An engaging part for a rotary device is provided at an upper end of each outer cylinder, and an engaging device for the cam is placed at a lower part of each nozzle shaft projecting from a lower end of each outer cylinder.
摘要翻译：可绕其垂直轴线旋转的旋转体设置在安装头上。在其下端具有凸轮表面的凸轮沿着旋转体的下部的周边布置。每个外筒可旋转地设置在旋转体的周边中，其中每个吸嘴在其下端装配的每个喷嘴轴以可自由移动的方式在上下方向上贯穿每个外筒。在每个外筒的上端设置有用于旋转装置的接合部，并且用于凸轮的接合装置设置在从每个外筒的下端突出的每个喷嘴轴的下部。

2. 发明授权

US5867897A Method of mounting electronic components 失效
标题翻译：安装电子元器件的方法
公开(公告)号：US5867897A
公开(公告)日：1999-02-09
申请号：US601324
申请日：1996-02-16
申请人： Yoshihiro Mimura , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
发明人： Yoshihiro Mimura , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
IPC分类号： H05K13/04
CPC分类号： H05K13/0408 , Y10T29/4913 , Y10T29/49144 , Y10T29/53178 , Y10T29/53191
摘要： An electronic component mounting method for sucking up an electronic component and placing it onto a board with a suction nozzle, includes a step of switching over air pressure switching timings for the suction nozzle when the component is sucked with the suction nozzle and when the sucked component is mounted on the board according to a velocity of up and down movement of the suction nozzle and independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. An electronic component mounting apparatus includes a suction nozzle for sucking an electronic component and placing it onto a board, a device for moving up and down the suction nozzle for suction and mounting of the electronic component, an air pressure switching unit for switching air pressure to the suction nozzle at an electronic component suction position and an electronic component mounting position, and a switching drive unit for performing switching control of the air pressure switching unit independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board.
摘要翻译：一种用于吸附电子部件并将其放置在具有吸嘴的板上的电子部件安装方法包括当用吸嘴吸取部件时切换吸嘴的空气压力切换定时的步骤，以及当吸入部件根据吸嘴的上下运动速度安装在板上，并且独立地用于当吸附有吸嘴的部件和吸附部件安装在板上时的每一个。一种电子部件安装装置，包括：吸引电子部件并将其放置在基板上的吸嘴，将吸引和吸附电子部件的吸嘴上下移动的装置，将气压切换为电子部件吸引位置处的吸嘴和电子部件安装位置，以及开关驱动单元，其用于当部件被吸嘴吸引时，分别独立地执行空气压力切换单元的切换控制，并且当吸入部件为安装在板上。

3. 发明授权

US6094808A Apparatus for mounting electronic components 失效
标题翻译：用于安装电子部件的装置
公开(公告)号：US6094808A
公开(公告)日：2000-08-01
申请号：US192400
申请日：1998-11-16
申请人： Yoshihiro Mimura , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
发明人： Yoshihiro Mimura , Noriaki Yoshida , Takeshi Takeda , Kanji Hata
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K13/0452 , H05K13/0408 , Y10T29/4913 , Y10T29/49144 , Y10T29/53022 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261
摘要： An electronic component mounting apparatus for sucking up an electronic component and placing it onto a board with a suction nozzle, includes a step of switching over air pressure switching timings for the suction nozzle when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. The air pressure switching timings are switched according to a velocity of up and down movement of the suction nozzle and independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. An electronic component mounting apparatus includes a suction nozzle for sucking an electronic component and placing it onto a board, a device for moving up and down the suction nozzle for suction and mounting of the electronic component, an air pressure switching unit for switching air pressure to the suction nozzle at an electronic component suction position and an electronic component mounting position, and a switching drive unit for performing switching control of the air pressure switching unit independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board.
摘要翻译：一种用于吸附电子部件并将其放置在具有吸嘴的板上的电子部件安装装置，包括当用吸嘴吸取部件时切换吸嘴的空气压力切换定时的步骤，以及当吸入部件安装在板上。空气压力切换定时根据吸嘴的上下运动速度进行切换，并且独立地用于当吸附有吸入部件的部件和吸附部件安装在基板上时。一种电子部件安装装置，包括：吸引电子部件并将其放置在基板上的吸嘴，将吸引和吸附电子部件的吸嘴上下移动的装置，将气压切换为电子部件吸引位置处的吸嘴和电子部件安装位置，以及开关驱动单元，其用于当部件被吸嘴吸引时，分别独立地执行空气压力切换单元的切换控制，并且当吸入部件为安装在板上。

4. 发明授权

US07200925B2 Component mounting method 有权
标题翻译：组件安装方法
公开(公告)号：US07200925B2
公开(公告)日：2007-04-10
申请号：US11433357
申请日：2006-05-15
申请人： Kanji Hata , Noriaki Yoshida
发明人： Kanji Hata , Noriaki Yoshida
IPC分类号： H05K3/30
CPC分类号： H05K13/0452 , H05K13/041 , H05K13/0413 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T29/5137 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53261 , Y10T29/53265
摘要： Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.
摘要翻译：公开了一种部件安装方法。在第一和第二正交方向上移动的是具有第一喷嘴的第一安装头部分。第一安装头旋转，使得第一喷嘴旋转并且连续地从布置在板传送路径的一侧上的第一部件供给台拾取部件。然后将这些部件连续地安装在位于板传送路径中的板上。在第三和第四正交方向上移动的是具有第二喷嘴的第二安装头部分。旋转第二安装头部，使得第二喷嘴旋转，并连续地从布置在板传送路径的相对侧上的第二部件供给台拾取部件。然后将这些部件连续地安装在板上，同时定位在板传送路径中。

5. 发明申请

US20060200979A1 Component mounting method 有权
公开(公告)号：US20060200979A1
公开(公告)日：2006-09-14
申请号：US11433357
申请日：2006-05-15
申请人： Kanji Hata , Noriaki Yoshida
发明人： Kanji Hata , Noriaki Yoshida
IPC分类号： H05K3/30
CPC分类号： H05K13/0452 , H05K13/041 , H05K13/0413 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T29/5137 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53261 , Y10T29/53265
摘要： Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.

6. 发明授权

US07100278B2 Component mounting apparatus and method 有权
公开(公告)号：US07100278B2
公开(公告)日：2006-09-05
申请号：US10079494
申请日：2002-02-22
申请人： Kanji Hata , Noriaki Yoshida
发明人： Kanji Hata , Noriaki Yoshida
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/041 , H05K13/0812 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A component mounting apparatus have a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary member, driving mechanisms for rotating corresponding component suction nozzle, and a recognition section for recognizing components sucked by the component suction nozzle. Each of the first and second mounting head section performs successive suction, recognition, posture adjustment, and mounting of the components.

7. 发明授权

US06789310B1 Component mounting apparatus 失效
标题翻译：组件安装设备
公开(公告)号：US06789310B1
公开(公告)日：2004-09-14
申请号：US09010490
申请日：1998-01-21
申请人： Kanji Hata , Noriaki Yoshida
发明人： Kanji Hata , Noriaki Yoshida
IPC分类号： B23P1900
CPC分类号： H05K13/0452 , H05K13/041 , H05K13/0413 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T29/5137 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53261 , Y10T29/53265
摘要： There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.
摘要翻译：提供了多个部件安装装置，用于通过安装头部分抽吸多个部件，并将部件依次安装在位于板定位部分的板上。部件安装装置彼此平行地布置，并且设置板传送路径，使得其穿过部件安装装置。即使当安装到板上的部件的数量增加时，部件被安装在分配到部件安装装置的部件供给台上，因此整个装置的尺寸不增加。部件供给台被固定地安装成没有振动，并且安装头部执行多个部件的抽吸和安装。因此，能够显着提高部件安装动作速度。

8. 发明授权

US06584683B2 Mounting electronic component method and apparatus 失效
标题翻译：安装电子元件的方法和装置
公开(公告)号：US06584683B2
公开(公告)日：2003-07-01
申请号：US09769515
申请日：2001-01-26
申请人： Noriaki Yoshida , Yoshihiro Mimura , Shozo Fukuda , Kanji Hata
发明人： Noriaki Yoshida , Yoshihiro Mimura , Shozo Fukuda , Kanji Hata
IPC分类号： H05K330
CPC分类号： H05K13/0413 , H05K13/0813 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53178 , Y10T29/53191
摘要： In an electronic component mounting method and apparatus, an electronic component is taken out from an electronic component feed position, a posture of the component is detected, and the component is mounted on a board based on a detected result. The method includes acquiring image data with a camera of the component from the feed position, processing acquired image data with a plurality of algorithms for detecting postures of components, and detecting a posture of the component.
摘要翻译：在电子部件安装方法和装置中，从电子部件供给位置取出电子部件，检测出部件的姿势，根据检测结果将部件安装在基板上。该方法包括从进给位置利用组件的照相机获取图像数据，用用于检测部件姿势的多种算法处理获取的图像数据，以及检测部件的姿势。

9. 发明授权

US07120996B2 Component mounting apparatus having component supply tables provided on opposite sides of a component transfer path 有权
标题翻译：组件安装装置具有设置在部件传送路径的相对侧上的部件供给台
公开(公告)号：US07120996B2
公开(公告)日：2006-10-17
申请号：US10897086
申请日：2004-07-23
申请人： Kanji Hata , Noriaki Yoshida
发明人： Kanji Hata , Noriaki Yoshida
IPC分类号： B23P19/00
CPC分类号： H05K13/0452 , H05K13/041 , H05K13/0413 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/49144 , Y10T29/5137 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53261 , Y10T29/53265
摘要： There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.
摘要翻译：提供了多个部件安装装置，用于通过安装头部分抽吸多个部件，并将部件依次安装在位于板定位部分的板上。部件安装装置彼此平行地布置，并且设置板传送路径，使得其穿过部件安装装置。即使当安装到板上的部件的数量增加时，部件被安装在分配到部件安装装置的部件供给台上，因此整个装置的尺寸不增加。部件供给台被固定地安装成没有振动，并且安装头部执行多个部件的抽吸和安装。因此，能够显着提高部件安装动作速度。

10. 发明授权

US5778525A Component mounting apparatus and method, and component mounting equipment 失效
标题翻译：组件安装设备和方法以及组件安装设备
公开(公告)号：US5778525A
公开(公告)日：1998-07-14
申请号：US740992
申请日：1996-11-05
申请人： Kanji Hata , Noriaki Yoshida
发明人： Kanji Hata , Noriaki Yoshida
IPC分类号： B23P21/00 , H05K13/00 , H05K13/04 , H05K3/30
CPC分类号： H05K13/0452 , H05K13/0413 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/53061 , Y10T29/53087 , Y10T29/53178 , Y10T29/53187 , Y10T29/53191
摘要： There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.
摘要翻译：提供了多个部件安装装置，用于通过安装头部分抽吸多个部件，并将部件依次安装在位于板定位部分的板上。部件安装装置彼此平行地布置，并且设置板传送路径，使得其穿过部件安装装置。即使当安装到板上的部件的数量增加时，部件被安装在分配到部件安装装置的部件供给台上，因此整个装置的尺寸不增加。部件供给台被固定地安装成没有振动，并且安装头部执行多个部件的抽吸和安装。因此，能够显着提高部件安装动作速度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式